Datasheet> 器件分类 > 无源元件> WBC-T0303AS-03-1303-F

WBC-T0303AS-03-1303-F: 产品描述Resistor Networks & Arrays; 产品类别无源元件; 文件大小351KB，共3页; 制造商TT Electronics

下载文档详细参数全文预览

WBC-T0303AS-03-1303-F在线购买

供应商	器件名称	价格	最低购买	库存
	WBC-T0303AS-03-1303-F	-	-	点击查看	点击购买

WBC-T0303AS-03-1303-F概述

Resistor Networks & Arrays

WBC-T0303AS-03-1303-F规格参数

参数名称	属性值
Product Attribute	Attribute Value
制造商 Manufacturer	TT Electronics
产品种类 Product Category	Resistor Networks & Arrays

文档预览

下载PDF文档

全文
预览

Resistors

Wire Bondable

WBC Series

Chip Resistors

Wire Bondable

Chip Resistors

Discrete or tapped schematics

MIL inspection available

WBC Series

High resistor density

•

Discrete or tapped schematics

•

MIL inspection available

•

High resistor density

All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)

IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.

The WBC combines IRC’s TaNSil

tantalum nitride thin ﬁlm technology with silicon substrate processing to

produce an extremely small tantalum nitride thin ﬁlm technology with silicon substrate processing to produce

an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil

resistor ﬁlm.

Available in a wide range of tolerances and temperature coefﬁcients to ﬁt a variety of hybrid circuit applica-

tions. Custom resistance values, sizes and schematics are available on request from the factory.

Physical Data

R0202 - Discrete

( 0 . 5 0 8 mm ± 0 . 0 2 5 )

0. 020˝ ± 0. 001

Electrical Data

Absolute Tolerance

Absolute TCR

Package Power Rating

(@ 70°C)

Rated Operating Voltage

(not to exceed

√

P x R )

Operating Temperature

Back contact

Noise

Top contact

pad chamfered

0.004˝ min bond pad size

to ±0.1%

to ±25ppm/°C

250mW

100V

-55°C to +150°C

<-30dB

Oxidized Silicon

(10KÅ SiO

min)

0.010˝ ±0.001

(0.254mm ±0.025)

10KÅ minimum

15KÅ minimum

Silicon

(Al / Au optional)

3KÅ Au minimum

10KÅ Al minimum

Silicon Dioxide or

Silicon Nitride

0.004˝ min bond pad size

0.020˝ ±0.001

(0.508mm ±0.025)

B0202 - Discrete back contact

( 0 . 5 0 8 mm ± 0 . 0 2 5 )

0. 020˝ ± 0. 001

Substrate Material

Top contact

Substrate Thickness

Aluminum

Gold

R0202 and

T0303

B0202

0.020˝ ±0.001

(0.508mm ±0.025)

T0303 - Tapped network ½R + ½R

Bond Pad

Metallization

( 0 . 7 6 2 mm ± 0 . 0 2 5 )

0. 030˝ ± 0. 001

½R

Backside

0.030˝ ±0.001

(0.762mm ±0.025)

0.004˝ min bond pad size

Passivation

Note 1: Not recommended for new designs

General Note

IRC reserves the right to make changes in product speciﬁcation without notice or liability.

All information is subject to IRC’s own data and is considered accurate at time of going to print.

• Corpus Christi Texas 78411 USA

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

A subsidiary of

TT electronics plc

General Note

TT Electronics reserves the right to make changes in product specification without notice or liability.

All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.

BI Technologies IRC Welwyn

http://www.ttelectronics.com/resistors

WBC Series Issue January 2009 Sheet 1 of 3

05.17

推荐资源

瑞萨RL78/G14评估板室内温度, 采集,显示: 温度采集,显示和收集；看了瑞萨RL78/G14活动,想利用业余时间完成此活动; 系统分两部分:温度采集节点和温度收集器; 温度采集节点使用DS18B20或者NTC 加ADC 方式获取环境温度；通过三色led灯的 ......; lou小小瑞萨MCU/MPU

大侠们来指点UART会丢数据的问题: 系统：S3C2440 + WINCE5.0 目的：使用S3C2440的COM2与外部设备的串口通信。过程（1）先使用WINCE中的串口调试器，固定用115200发送50个16进制的协议字节；（2）外部设备正确接收到协议 ......; Joanthan 嵌入式系统

这是什么问题，害我好苦！: 一、发帖输入标题时： 193413 明明说标题还是可以再输入的。！二、但是发帖后就出现了下面的情况： 193412 三、可恶的是，当你回到上一页后，什么你也看不 ......; dontium 为我们提建议&公告

小资料:WiMAX无线宽带连接技术: WiMAX WiMAX(Worldwide Interoperability for Microwave Access)微波接入全球互操作性认证产业联盟主要成员包括设备制造商、器件供应商、运营商等，主要任务是通过对产品进行兼容性和互操作性 ......; 1234 无线连接

基于TI DSP的SVPWM学习资料: 这个关于无刷电机正弦波控制的一片文章对理解SVPWM有很大的参考意义，做FOC控制必须要看看 482775 482776 482777482778 482779 ...; Jacktang 微控制器 MCU

楼宇对讲常见故障: 楼宇对讲常见故障 1.0不能开锁 1.所有用户均不能开锁可能原因:a.查门口机至电源,门口机至电锁接线是否接好；查开锁线路是否接好（至电控锁的开锁线是2芯线，建议使用0.5平方毫米的护套线 ......; ggsngkk 工业自动化与控制

器件捷径: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

热门器件

开源项目推荐更多

热门活动更多

热门文章更多

技术资料推荐更多