Note1) Absolute maximum ratings represent the values which cannot be exceeded for any length of time.
Note2) Even when the device is used within the range of absolute maximum ratings, as a result of continuous usage under high temperature, high
current, high voltage, or drastic temperature change, the reliability of the IC may be degraded. Please contact us for the further details.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
See detailed ordering and shipping information on page 10 of this data sheet.
Semiconductor Components Industries, LLC, 2013
October, 2013
Ver.2.3
O1613HK 20130926-S00002/71013HK No.A2201- 1/10
LV5011MD
Recommended Operating Conditions
at Ta = 25C
Parameter
Input voltage
Symbol
VIN
Ratings
min
0.585
VIN = 8.5 to 24V
8
6.3
typ
0.605
±0.5
9
7.3
1.7
55
70
93
1
160
80
1
VDrain=480V
VIN=12V
9.5
200
*Design guarantee
*Design guarantee
165
30
100
10
85
10
8.3
max
0.625
Conditions
Ratings
8.5 to 24
Unit
V
Electrical Characteristics
at Ta
½
25C, VIN = 12V, unless otherwise specified.
Parameter
Reference Voltage block
Built-in Reference Voltage
VREF VIN line regulation
Under Voltage Lockout
Operation Start Input
Voltage
Operation Stop Input
Voltage
Hysteresis Voltage
Oscillation
Frequency
Maximum ON duty
Comparator
Input offset Voltage
(Between CS and REF_IN)
Input current
CS pin max voltage
FET output stage
Drain Leakage current
Power FET ON resistor
Minimum On time
Thermal protection Circuit
Thermal shutdown
temperature
Thermal shutdown
hysteresis
TRIAC Stabilization Circuit
Threshold of OUT2
OUT2 sink current
OUT2 source current
VCC current
UVLO mode VIN current
Normal mode VIN current
VIN over voltage protection
voltage
VIN Current at OVP
Abnormal sensing voltage
ICCOFF
ICCON
VINOVP
IINOVP
CSOCP
VIN=30V
VIN
UVLOOFF
VIN=12V
24
0.7
120
1.0
27
1.0
1.9
30
1.5
160
A
mA
V
mA
V
TSD
TSD
C
C
ILK
Ron
TMIN
uA
Ω
ns
VIO_RI
IIOCS
IIOREF
VOM
mV
nA
nA
V
FOSC
MAXDuty
kHz
%
UVLOON
UVLOOFF
UVLOH
V
V
V
VREF
VREF_LN
V
%
Symbol
Conditions
Unit
VACS
IO2I
IO2O
OUT2=High [ less than right record ]
VIN=12V, OUT2=6V
VIN=12V, OUT2=6V
2.8
3.0
0.6
0.6
3.2
V
mA
mA
VIN Over Voltage Protection Circuit
CS terminal abnormal sensing circuit
*: Design guarantee (value guaranteed by design and not tested before shipment)
No.A2201-2/11
LV5011MD
Block Diagram
VIN
Built-in
REGULATOR
TSD
3.0V
0.605V
(NC)
(NC)
UVLO
OVP
REFERENCE
VOLTAGE
OSCILLATOR
S
R
Current Limit
Comparater
Drain
+
Q
REF_IN
-
-
CONTROL
LOGIC
Source
Short
Protection
Circuit
CS
ACS
-
OUT2
+
AC_Voltage sense
Comparator
GND
Sample Application Circuit
No.A2201-3/11
LV5011MD
Package Dimensions
unit : mm
SOIC- 10 NB
CASE 751BQ- 01
ISSUE A
2X
0.10 C A-B
D
D
A
2X
0.10 C A-B
10
6
F
H
1
5
E
L2
10X
A3
L
DETAIL A
0.20 C
2X 5 TIPS
C
B
TOP VIEW
b
0.25
M
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.10mm TOTAL IN EXCESS OF b
AT MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15mm
PER SIDE. DIMENSIONS D AND E ARE DE-
TERMINED AT DATUM F.
5. DIMENSIONS A AND B ARE TO BE DETERM-
INED AT DATUM F.
6. A1 IS DEFINED AS THE VERTICAL DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
DIM
A
A1
A3
b
D
E
e
H
h
L
L2
M
MILLIMETERS
MIN
MAX
1.25
1.75
0.10
0.25
0.17
0.25
0.31
0.51
4.80
5.00
3.80
4.00
1.00 BSC
5.80
6.20
0.37 REF
0.40
1.27
0.25 BSC
0
8
C A-B D
10X
h
0.10 C
X 45
0.10 C
M
A
A1
e
SIDE VIEW
C
SEATING
PLANE
DETAIL A
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
10X
0.58
GENERIC
MARKING DIAGRAM*
10
XXXXX
ALYWX
1
1.00
PITCH
6.50
10X
1.18
1
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Logic analyzers are widely used tools in digital design verification and debugging. They can verify the proper functioning of digital circuits and help users identify and troubleshoot faults. They ...[详细]
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