Digital Signal Processors & Controllers - DSP, DSC 275Mhz/550MMACS 275Mhz EFCOP
| 参数名称 | 属性值 |
| Brand Name | Freescale |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | BGA |
| 包装说明 | MOLDED ARRAY PROCESS, BGA-196 |
| 针数 | 196 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A991.A.2 |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 18 |
| 桶式移位器 | YES |
| 位大小 | 24 |
| 边界扫描 | YES |
| 最大时钟频率 | 275 MHz |
| 外部数据总线宽度 | 24 |
| 格式 | FIXED POINT |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PBGA-B196 |
| JESD-609代码 | e0 |
| 长度 | 15 mm |
| 低功率模式 | YES |
| 湿度敏感等级 | 3 |
| 端子数量 | 196 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LBGA |
| 封装等效代码 | BGA196,14X14,40 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.6,3.3 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 163840 |
| 座面最大高度 | 1.6 mm |
| 最大供电电压 | 1.7 V |
| 最小供电电压 | 1.5 V |
| 标称供电电压 | 1.6 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 端子面层 | Tin/Lead/Silver (Sn/Pb/Ag) |
| 端子形式 | BALL |
| 端子节距 | 1 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 15 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
| DSP56321VF275 | DSP56321VF220 | DSP56321VL275 | DSP56321VF240 | DSP56321VL240 | DSP56321VL220 | |
|---|---|---|---|---|---|---|
| 描述 | Digital Signal Processors & Controllers - DSP, DSC 275Mhz/550MMACS 275Mhz EFCOP | Digital Signal Processors & Controllers - DSP, DSC 220Mhz/440MMACS 220Mhz EFCOP | Digital Signal Processors & Controllers - DSP, DSC 24 BIT DSP PBFREE | Digital Signal Processors & Controllers - DSP, DSC 240Mhz/480MMACS 240Mhz EFCOP | Digital Signal Processors & Controllers - DSP, DSC 24 BIT DSP PBFREE | Digital Signal Processors & Controllers - DSP, DSC 24 BIT DSP PBFREE |
| 是否无铅 | 含铅 | 含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 符合 | 不符合 | 符合 | 符合 |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | MOLDED ARRAY PROCESS, BGA-196 | MOLDED ARRAY PROCESS, BGA-196 | LEAD FREE, MOLDED ARRAY PROCESS, BGA-196 | MOLDED ARRAY PROCESS, BGA-196 | LEAD FREE, MOLDED ARRAY PROCESS, BGA-196 | LEAD FREE, MOLDED ARRAY PROCESS, BGA-196 |
| 针数 | 196 | 196 | 196 | 196 | 196 | 196 |
| Reach Compliance Code | not_compliant | not_compliant | unknown | not_compliant | unknown | unknown |
| ECCN代码 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 18 | 18 | 18 | 18 | 18 | 18 |
| 桶式移位器 | YES | YES | YES | YES | YES | YES |
| 位大小 | 24 | 24 | 24 | 24 | 24 | 24 |
| 边界扫描 | YES | YES | YES | YES | YES | YES |
| 最大时钟频率 | 275 MHz | 220 MHz | 275 MHz | 240 MHz | 240 MHz | 220 MHz |
| 外部数据总线宽度 | 24 | 24 | 24 | 24 | 24 | 24 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-PBGA-B196 | S-PBGA-B196 | S-PBGA-B196 | S-PBGA-B196 | S-PBGA-B196 | S-PBGA-B196 |
| JESD-609代码 | e0 | e0 | e1 | e0 | e1 | e1 |
| 长度 | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm |
| 低功率模式 | YES | YES | YES | YES | YES | YES |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 196 | 196 | 196 | 196 | 196 | 196 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA |
| 封装等效代码 | BGA196,14X14,40 | BGA196,14X14,40 | BGA196,14X14,40 | BGA196,14X14,40 | BGA196,14X14,40 | BGA196,14X14,40 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
| 峰值回流温度（摄氏度） | 260 | 220 | 260 | 220 | 260 | 260 |
| 电源 | 1.6,3.3 V | 1.6,3.3 V | 1.6,3.3 V | 1.6,3.3 V | 1.6,3.3 V | 1.6,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字数） | 163840 | 163840 | 163840 | 163840 | 163840 | 163840 |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| 最大供电电压 | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
| 最小供电电压 | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| 标称供电电压 | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子面层 | Tin/Lead/Silver (Sn/Pb/Ag) | Tin/Lead/Silver (Sn/Pb/Ag) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead/Silver (Sn/Pb/Ag) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | 40 | 30 | 40 | 30 | 40 | 40 |
| 宽度 | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| Brand Name | Freescale | Freescale | Freescale | Freescale | - | - |
| Base Number Matches | 1 | - | 1 | - | 1 | 1 |
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