Digital Signal Processors & Controllers - DSP, DSC 220Mhz/440MMACS 220Mhz EFCOP
参数名称 | 属性值 |
Brand Name | Freescale |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | BGA |
包装说明 | MOLDED ARRAY PROCESS, BGA-196 |
针数 | 196 |
Reach Compliance Code | not_compliant |
ECCN代码 | 3A991.A.2 |
其他特性 | ALSO REQUIRES 3.3V SUPPLY |
地址总线宽度 | 18 |
桶式移位器 | YES |
位大小 | 24 |
边界扫描 | YES |
最大时钟频率 | 220 MHz |
外部数据总线宽度 | 24 |
格式 | FIXED POINT |
内部总线架构 | MULTIPLE |
JESD-30 代码 | S-PBGA-B196 |
JESD-609代码 | e0 |
长度 | 15 mm |
低功率模式 | YES |
湿度敏感等级 | 3 |
端子数量 | 196 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LBGA |
封装等效代码 | BGA196,14X14,40 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE |
峰值回流温度(摄氏度) | 220 |
电源 | 1.6,3.3 V |
认证状态 | Not Qualified |
RAM(字数) | 163840 |
座面最大高度 | 1.6 mm |
最大供电电压 | 1.7 V |
最小供电电压 | 1.5 V |
标称供电电压 | 1.6 V |
表面贴装 | YES |
技术 | CMOS |
端子面层 | Tin/Lead/Silver (Sn/Pb/Ag) |
端子形式 | BALL |
端子节距 | 1 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 15 mm |
uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
DSP56321VF220 | DSP56321VL275 | DSP56321VF240 | DSP56321VL240 | DSP56321VL220 | DSP56321VF275 | |
---|---|---|---|---|---|---|
描述 | Digital Signal Processors & Controllers - DSP, DSC 220Mhz/440MMACS 220Mhz EFCOP | Digital Signal Processors & Controllers - DSP, DSC 24 BIT DSP PBFREE | Digital Signal Processors & Controllers - DSP, DSC 240Mhz/480MMACS 240Mhz EFCOP | Digital Signal Processors & Controllers - DSP, DSC 24 BIT DSP PBFREE | Digital Signal Processors & Controllers - DSP, DSC 24 BIT DSP PBFREE | Digital Signal Processors & Controllers - DSP, DSC 275Mhz/550MMACS 275Mhz EFCOP |
是否无铅 | 含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 | 含铅 |
是否Rohs认证 | 不符合 | 符合 | 不符合 | 符合 | 符合 | 不符合 |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA |
包装说明 | MOLDED ARRAY PROCESS, BGA-196 | LEAD FREE, MOLDED ARRAY PROCESS, BGA-196 | MOLDED ARRAY PROCESS, BGA-196 | LEAD FREE, MOLDED ARRAY PROCESS, BGA-196 | LEAD FREE, MOLDED ARRAY PROCESS, BGA-196 | MOLDED ARRAY PROCESS, BGA-196 |
针数 | 196 | 196 | 196 | 196 | 196 | 196 |
Reach Compliance Code | not_compliant | unknown | not_compliant | unknown | unknown | not_compliant |
ECCN代码 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
其他特性 | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY |
地址总线宽度 | 18 | 18 | 18 | 18 | 18 | 18 |
桶式移位器 | YES | YES | YES | YES | YES | YES |
位大小 | 24 | 24 | 24 | 24 | 24 | 24 |
边界扫描 | YES | YES | YES | YES | YES | YES |
最大时钟频率 | 220 MHz | 275 MHz | 240 MHz | 240 MHz | 220 MHz | 275 MHz |
外部数据总线宽度 | 24 | 24 | 24 | 24 | 24 | 24 |
格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
JESD-30 代码 | S-PBGA-B196 | S-PBGA-B196 | S-PBGA-B196 | S-PBGA-B196 | S-PBGA-B196 | S-PBGA-B196 |
JESD-609代码 | e0 | e1 | e0 | e1 | e1 | e0 |
长度 | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm |
低功率模式 | YES | YES | YES | YES | YES | YES |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 |
端子数量 | 196 | 196 | 196 | 196 | 196 | 196 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA |
封装等效代码 | BGA196,14X14,40 | BGA196,14X14,40 | BGA196,14X14,40 | BGA196,14X14,40 | BGA196,14X14,40 | BGA196,14X14,40 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
峰值回流温度(摄氏度) | 220 | 260 | 220 | 260 | 260 | 260 |
电源 | 1.6,3.3 V | 1.6,3.3 V | 1.6,3.3 V | 1.6,3.3 V | 1.6,3.3 V | 1.6,3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字数) | 163840 | 163840 | 163840 | 163840 | 163840 | 163840 |
座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
最大供电电压 | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
最小供电电压 | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
标称供电电压 | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子面层 | Tin/Lead/Silver (Sn/Pb/Ag) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead/Silver (Sn/Pb/Ag) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead/Silver (Sn/Pb/Ag) |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | 30 | 40 | 30 | 40 | 40 | 40 |
宽度 | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm |
uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
Brand Name | Freescale | Freescale | Freescale | - | - | Freescale |
Base Number Matches | - | 1 | - | 1 | 1 | 1 |
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