Clock Buffer 2.5V/3.3V Multilevel 1:2 Clock / Fanout
参数名称 | 属性值 |
Brand Name | ON Semiconductor |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | ON Semiconductor(安森美) |
零件包装代码 | SOIC |
包装说明 | TSSOP, TSSOP8,.19 |
针数 | 8 |
制造商包装代码 | 948R-02 |
Reach Compliance Code | compliant |
Factory Lead Time | 1 week |
其他特性 | NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V |
系列 | 6L |
输入调节 | DIFFERENTIAL |
JESD-30 代码 | S-PDSO-G8 |
JESD-609代码 | e3 |
长度 | 3 mm |
逻辑集成电路类型 | LOW SKEW CLOCK DRIVER |
湿度敏感等级 | 3 |
功能数量 | 1 |
反相输出次数 | |
端子数量 | 8 |
实输出次数 | 2 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP8,.19 |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
电源 | +-2.5/+-3.3 V |
Prop。Delay @ Nom-Sup | 0.22 ns |
传播延迟(tpd) | 0.2 ns |
认证状态 | Not Qualified |
Same Edge Skew-Max(tskwd) | 0.015 ns |
座面最大高度 | 1.1 mm |
最大供电电压 (Vsup) | 3.465 V |
最小供电电压 (Vsup) | 2.375 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3 mm |
NB6L11DTR2G | NB6L11DG | NB6L11DTG | NB6L11DR2G | |
---|---|---|---|---|
描述 | Clock Buffer 2.5V/3.3V Multilevel 1:2 Clock / Fanout | Clock Buffer 2.5V/3.3V Multilevel 1:2 Clock / Fanout | Clock Buffer 2.5V/3.3V Multilevel 1:2 Clock / Fanout | Clock Buffer 2.5V/3.3V Multilevel 1:2 Clock / Fanout |
Brand Name | ON Semiconductor | ON Semiconductor | ON Semiconductor | ON Semiconductor |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) |
零件包装代码 | SOIC | SOIC | SOIC | SOIC |
包装说明 | TSSOP, TSSOP8,.19 | SOP, SOP8,.25 | TSSOP, TSSOP8,.19 | SOP, SOP8,.25 |
针数 | 8 | 8 | 8 | 8 |
制造商包装代码 | 948R-02 | 751-07 | 948R-02 | 751-07 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
Factory Lead Time | 1 week | 1 week | 1 week | 1 week |
其他特性 | NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V | NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V | NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V | NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V |
系列 | 6L | 6L | 6L | 6L |
输入调节 | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL |
JESD-30 代码 | S-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 |
JESD-609代码 | e3 | e3 | e3 | e3 |
长度 | 3 mm | 4.9 mm | 3 mm | 4.9 mm |
逻辑集成电路类型 | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER |
湿度敏感等级 | 3 | 1 | 3 | 1 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 |
实输出次数 | 2 | 2 | 2 | 2 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | SOP | TSSOP | SOP |
封装等效代码 | TSSOP8,.19 | SOP8,.25 | TSSOP8,.19 | SOP8,.25 |
封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 |
电源 | +-2.5/+-3.3 V | +-2.5/+-3.3 V | +-2.5/+-3.3 V | +-2.5/+-3.3 V |
Prop。Delay @ Nom-Sup | 0.22 ns | 0.22 ns | 0.22 ns | 0.22 ns |
传播延迟(tpd) | 0.2 ns | 0.2 ns | 0.2 ns | 0.2 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Same Edge Skew-Max(tskwd) | 0.015 ns | 0.015 ns | 0.015 ns | 0.015 ns |
座面最大高度 | 1.1 mm | 1.75 mm | 1.1 mm | 1.75 mm |
最大供电电压 (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
最小供电电压 (Vsup) | 2.375 V | 2.375 V | 2.375 V | 2.375 V |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | 40 | 40 | 40 |
宽度 | 3 mm | 3.9 mm | 3 mm | 3.9 mm |
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