Gate Drivers
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | QFN |
| 包装说明 | 4 X 4 MM, 0.80 MM PITCH, MO-220, QFN-20 |
| 针数 | 20 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 内置保护 | TRANSIENT |
| 驱动器位数 | 8 |
| 接口集成电路类型 | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
| JESD-30 代码 | S-XQCC-N20 |
| JESD-609代码 | e0 |
| 长度 | 4 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出电流流向 | SINK |
| 最大输出电流 | 0.15 A |
| 标称输出峰值电流 | 0.07 A |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC20,.16SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 245 |
| 电源 | 3.3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 2.3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 断开时间 | 1 µs |
| 接通时间 | 1 µs |
| 宽度 | 4 mm |
| MAX4820ETP | MAX4821ETP-T | MAX4820EUP-T | MAX4821ETP | MAX4820ETP-T | MAX4820EUP+T | |
|---|---|---|---|---|---|---|
| 描述 | Gate Drivers | Gate Drivers | Gate Drivers +3.3V/+5V, 8-Channel, Cascadable Relay Drivers with Serial/Parallel Interface | Gate Drivers | Gate Drivers | 继电器驱动 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 不含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 |
| 零件包装代码 | QFN | QFN | TSSOP | QFN | QFN | TSSOP |
| 包装说明 | 4 X 4 MM, 0.80 MM PITCH, MO-220, QFN-20 | 4 X 4 MM, 0.80 MM PITCH, MO-220, QFN-20 | 4.40 MM, MO-153ACT, TSSOP-20 | 4 X 4 MM, 0.80 MM PITCH, MO-220, QFN-20 | 4 X 4 MM, 0.80 MM PITCH, MO-220, QFN-20 | HTSSOP, LCC20,.16SQ,20 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 内置保护 | TRANSIENT | TRANSIENT | TRANSIENT | TRANSIENT | TRANSIENT | TRANSIENT |
| 驱动器位数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 接口集成电路类型 | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
| JESD-30 代码 | S-XQCC-N20 | S-XQCC-N20 | R-PDSO-G20 | S-XQCC-N20 | S-XQCC-N20 | R-PDSO-G20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e3 |
| 长度 | 4 mm | 4 mm | 6.5 mm | 4 mm | 4 mm | 6.5 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出电流流向 | SINK | SINK | SINK | SINK | SINK | SINK |
| 最大输出电流 | 0.15 A | 0.15 A | 0.15 A | 0.15 A | 0.15 A | 0.15 A |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | HVQCCN | TSSOP | HVQCCN | HVQCCN | HTSSOP |
| 封装等效代码 | LCC20,.16SQ,20 | LCC20,.16SQ,20 | TSSOP20,.25 | TSSOP20,.25 | LCC20,.16SQ,20 | LCC20,.16SQ,20 |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 245 | 245 | 245 | 245 | 245 | 260 |
| 电源 | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 0.8 mm | 1.1 mm | 0.8 mm | 0.8 mm | 1.1 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | TIN |
| 端子形式 | NO LEAD | NO LEAD | GULL WING | NO LEAD | NO LEAD | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.65 mm | 0.5 mm | 0.5 mm | 0.65 mm |
| 端子位置 | QUAD | QUAD | DUAL | QUAD | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 断开时间 | 1 µs | 1 µs | 1 µs | 1 µs | 1 µs | 1 µs |
| 接通时间 | 1 µs | 1 µs | 1 µs | 1 µs | 1 µs | 1 µs |
| 宽度 | 4 mm | 4 mm | 4.4 mm | 4 mm | 4 mm | 4.4 mm |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - |
| 标称输出峰值电流 | 0.07 A | 0.07 A | 0.07 A | 0.07 A | 0.07 A | - |
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