NL27WZ86
Dual 2-Input Exclusive-OR
Gate
The NL27WZ86 is a high performance dual 2−input Exclusive−OR
Gate operating from a 1.65 V to 5.5 V supply.
Features
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MARKING
DIAGRAM
8
L8 M
G
G
1
•
•
•
•
•
•
•
•
•
Extremely High Speed: t
PD
2.4 ns (typical) at V
CC
= 5.0 V
Designed for 1.65 V to 5.5 V V
CC
Operation
Over Voltage Tolerant Inputs and Outputs
LVTTL Compatible
−
Interface Capability With 5.0 V TTL Logic
with V
CC
= 3.0 V
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Replacement for NC7WZ86
These Devices are Pb−Free and are RoHS Compliant
US8
US SUFFIX
CASE 493
L8
M
G
= Specific Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending upon
manufacturing location.
A1
1
8
V
CC
PIN ASSIGNMENT
Pin
1
2
3
4
5
6
7
8
Function
A1
B1
Y2
GND
A2
B2
Y1
V
CC
B1
2
7
Y1
Y2
3
6
B2
GND
4
5
A2
Figure 1. Pinout
(Top View)
FUNCTION TABLE
Input
Output
Y=A+B
B
L
H
L
H
Y
L
H
H
L
A1
B1
A2
B2
A
=1
Y1
Y2
L
L
H
H
Figure 2. Logic Symbol
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
©
Semiconductor Components Industries, LLC, 2013
March, 2013
−
Rev. 7
1
Publication Order Number:
NL27WZ86/D
NL27WZ86
MAXIMUM RATINGS
Symbol
V
CC
V
I
V
O
I
IK
I
OK
I
O
I
CC
I
GND
T
STG
T
L
T
J
q
JA
P
D
MSL
F
R
V
ESD
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
V
I
< GND
DC Output Diode Current
V
O
< GND
DC Output Sink Current
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature under Bias
Thermal Resistance (Note 1)
Power Dissipation in Still Air at 85_C
Moisture Sensitivity
Flammability Rating
Oxygen Index: 28 to 34
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Latchup Performance Above V
CC
and Below GND at 125°C (Note 5)
Parameter
Value
−0.5
to +7.0
−0.5
to +7.0
−0.5
to +7.0
−50
−50
±50
±100
±100
−65
to +150
260
+150
250
250
Level 1
UL 94 V−0 @ 0.125 in
V
Units
V
V
V
mA
mA
mA
mA
mA
_C
_C
_C
_C/W
mW
> 2000
> 200
N/A
±100
I
LATCHUP
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
Supply Voltage
Operating
Data Retention Only
Input Voltage (Note 6)
Output Voltage (HIGH or LOW State)
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
V
CC
= 1.8 V
±0.15
V
V
CC
= 2.5 V
±0.2
V
V
CC
= 3.0 V
±0.3
V
V
CC
= 5.0 V
±0.5
V
Parameter
Min
1.65
1.5
0
0
−40
0
0
0
0
Max
5.5
5.5
5.5
5.5
+125
20
20
10
5
Units
V
V
I
V
O
T
A
Dt/DV
V
V
_C
ns/V
6. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level.
http://onsemi.com
2
NL27WZ86
PACKAGE DIMENSIONS
US8
CASE 493−02
ISSUE B
A
8
5
−X−
−Y−
J
DETAIL E
B
L
1
4
R
P
G
S
U
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTER−LEAD FLASH OR PROTRUSION.
INTER−LEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203 MM.
(300−800 “).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED
±0.0508
(0.0002 “).
MILLIMETERS
MIN
MAX
1.90
2.10
2.20
2.40
0.60
0.90
0.17
0.25
0.20
0.35
0.50 BSC
0.40 REF
0.10
0.18
0.00
0.10
3.00
3.20
0
_
6
_
5
_
10
_
0.23
0.34
0.23
0.33
0.37
0.47
0.60
0.80
0.12 BSC
INCHES
MIN
MAX
0.075
0.083
0.087
0.094
0.024
0.035
0.007
0.010
0.008
0.014
0.020 BSC
0.016 REF
0.004
0.007
0.000
0.004
0.118
0.126
0
_
6
_
5
_
10
_
0.010
0.013
0.009
0.013
0.015
0.019
0.024
0.031
0.005 BSC
C
−T−
SEATING
PLANE
D
0.10 (0.004)
K
M
0.10 (0.004) T
N
T X Y
V
H
R 0.10 TYP
M
DETAIL E
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
R
S
U
V
SOLDERING FOOTPRINT*
3.8
0.15
0.50
0.0197
1.8
0.07
0.30
0.012
1.0
0.0394
SCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
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Sales Representative
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5
NL27WZ86/D