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74HC4067PW

产品描述Multiplexer Switch ICs 16CH ANLG MUX/DEMUX
产品类别模拟混合信号IC    信号电路   
文件大小915KB,共28页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
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74HC4067PW概述

Multiplexer Switch ICs 16CH ANLG MUX/DEMUX

74HC4067PW规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码TSSOP
包装说明TSSOP, TSSOP24,.25
针数24
Reach Compliance Codecompliant
模拟集成电路 - 其他类型SINGLE-ENDED MULTIPLEXER
JESD-30 代码R-PDSO-G24
JESD-609代码e4
长度7.8 mm
湿度敏感等级1
信道数量16
功能数量1
端子数量24
标称断态隔离度50 dB
通态电阻匹配规范9 Ω
最大通态电阻 (Ron)180 Ω
最高工作温度125 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装等效代码TSSOP24,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)260
电源2/9 V
认证状态Not Qualified
座面最大高度1.1 mm
最大信号电流0.025 A
最大供电电流 (Isup)0.16 mA
最大供电电压 (Vsup)10 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)5 V
表面贴装YES
最长断开时间435 ns
最长接通时间450 ns
切换BREAK-BEFORE-MAKE
技术CMOS
温度等级AUTOMOTIVE
端子面层Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度4.4 mm
Base Number Matches1

文档预览

下载PDF文档
74HC4067; 74HCT4067
16-channel analog multiplexer/demultiplexer
Rev. 6 — 22 May 2015
Product data sheet
1. General description
The 74HC4067; 74HCT4067 is a single-pole 16-throw analog switch (SP16T) suitable for
use in analog or digital 16:1 multiplexer/demultiplexer applications. The switch features
four digital select inputs (S0, S1, S2 and S3), sixteen independent inputs/outputs (Yn), a
common input/output (Z) and a digital enable input (E). When E is HIGH, the switches are
turned off. Inputs include clamp diodes. This enables the use of current limiting resistors
to interface inputs to voltages in excess of V
CC
.
2. Features and benefits
Input levels S0, S1, S2, S3 and E inputs:
For 74HC4067: CMOS level
For 74HCT4067: TTL level
Low ON resistance:
80
(typical) at V
CC
= 4.5 V
70
(typical) at V
CC
= 6.0 V
60
(typical) at V
CC
= 9.0 V
Specified in compliance with JEDEC standard no. 7A
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101E exceeds 1000 V
Multiple package options
Specified from
40 C
to +85
C
and
40 C
to +125
C
Typical ‘break before make’ built-in
3. Applications
Analog multiplexing and demultiplexing
Digital multiplexing and demultiplexing
Signal gating

74HC4067PW相似产品对比

74HC4067PW 74HC4067PW,118 74HC4067DB 74HCT4067BQ,118 74HC4067BQ,115 74HC4067PW,112 74HCT4067D,118
描述 Multiplexer Switch ICs 16CH ANLG MUX/DEMUX Multiplexer Switch ICs 16-CHANNEL ANALOG MUX/DEMUX Multiplexer Switch ICs 16-CHANNEL ANALOG MUX/DEMUX Multiplexer Switch ICs Analog MUX Single 16:1 5.5V 24-Pin Multiplexer Switch ICs 16-CHANNEL ANALOG MUX/DEMUX Multiplexer Switch ICs 16CH ANLG MUX/DEMUX Multiplexer Switch ICs 16-CHANNEL ANALOG
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 TSSOP TSSOP2 SSOP QFN QFN TSSOP2 SOP
包装说明 TSSOP, TSSOP24,.25 TSSOP, TSSOP24,.25 SSOP, SSOP24,.3 HVQCCN, LCC24/28,.14X.2,20 3.50 X 5.50 MM , 0.85 MM HEIGHT, PLASTIC, SOT-815-1, DHVQFN-24 TSSOP, TSSOP24,.25 7.50 MM, PLASTIC, MS-013, SOT137-1, SOP-24
针数 24 24 24 24 24 24 24
Reach Compliance Code compliant compliant compliant compliant unknown compliant compliant
模拟集成电路 - 其他类型 SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER
JESD-30 代码 R-PDSO-G24 R-PDSO-G24 R-PDSO-G24 R-PQCC-N24 R-PQCC-N24 R-PDSO-G24 R-PDSO-G24
JESD-609代码 e4 e4 e4 e4 e4 e4 e4
长度 7.8 mm 7.8 mm 8.2 mm 5.5 mm 5.5 mm 7.8 mm 15.4 mm
湿度敏感等级 1 1 1 1 1 1 1
信道数量 16 16 16 16 16 16 16
功能数量 1 1 1 1 1 1 1
端子数量 24 24 24 24 24 24 24
标称断态隔离度 50 dB 50 dB 50 dB 50 dB 50 dB 50 dB 50 dB
通态电阻匹配规范 9 Ω 6 Ω 9 Ω 9 Ω 6 Ω 9 Ω 9 Ω
最大通态电阻 (Ron) 180 Ω 130 Ω 180 Ω 180 Ω 130 Ω 180 Ω 180 Ω
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP TSSOP SSOP HVQCCN HVQCCN TSSOP SOP
封装等效代码 TSSOP24,.25 TSSOP24,.25 SSOP24,.3 LCC24/28,.14X.2,20 LCC24/28,.14X.2,20 TSSOP24,.25 SOP24,.4
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
峰值回流温度(摄氏度) 260 260 260 260 260 260 260
电源 2/9 V 2/10 V 2/9 V 5 V 2/10 V 2/9 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.1 mm 1.1 mm 2 mm 1 mm 1 mm 1.1 mm 2.65 mm
最大供电电流 (Isup) 0.16 mA 0.32 mA 0.16 mA 0.294 mA 0.32 mA 0.16 mA 0.294 mA
最大供电电压 (Vsup) 10 V 10 V 10 V 5.5 V 10 V 10 V 5.5 V
最小供电电压 (Vsup) 2 V 2 V 2 V 4.5 V 2 V 2 V 4.5 V
标称供电电压 (Vsup) 5 V 9 V 5 V 4.5 V 9 V 5 V 4.5 V
表面贴装 YES YES YES YES YES YES YES
最长断开时间 435 ns 57 ns 435 ns 83 ns 57 ns 435 ns 83 ns
最长接通时间 450 ns 63 ns 450 ns 90 ns 63 ns 450 ns 90 ns
切换 BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子面层 Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式 GULL WING GULL WING GULL WING NO LEAD NO LEAD GULL WING GULL WING
端子节距 0.65 mm 0.65 mm 0.65 mm 0.5 mm 0.5 mm 0.65 mm 1.27 mm
端子位置 DUAL DUAL DUAL QUAD QUAD DUAL DUAL
处于峰值回流温度下的最长时间 30 30 30 30 30 30 30
宽度 4.4 mm 4.4 mm 5.3 mm 3.5 mm 3.5 mm 4.4 mm 7.5 mm
Base Number Matches 1 1 1 1 1 1 1
Brand Name - NXP Semiconductor - NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor
制造商包装代码 - SOT355-1 - SOT815-1 SOT815-1 SOT355-1 SOT137-1

 
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