Thermal Resistance, Junction−to−Case, Steady State
(Assumes 600 mm
2
1 oz. copper bond pad, on a FR4 board)
Symbol
R
θJC
Typ
−
Max
1.7
Unit
°C/W
ELECTRICAL CHARACTERISTICS
Instantaneous Forward Voltage (Note 1)
(i
F
= 12 A, T
J
= 125°C)
(i
F
= 12 A, T
J
= 25°C)
Instantaneous Reverse Current (Note 1)
(Rated dc Voltage, T
J
= 125°C)
(Rated dc Voltage, T
J
= 25°C)
1. Pulse Test: Pulse Width = 300
ms,
Duty Cycle
≤
2.0%.
v
F
0.455
0.53
i
R
35
0.08
170
0.5
0.62
0.68
mA
V
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2
MBR1240MFS, NRVB1240MFS
TYPICAL CHARACTERISTICS
I
F
, INSTANTANEOUS FORWARD CURRENT (A)
100
I
F
, INSTANTANEOUS FORWARD CURRENT (A)
100
10
T
A
= 125°C
T
A
= 150°C
10
T
A
= 125°C
T
A
= 150°C
T
A
= 25°C
1
T
A
= 25°C
1
T
A
= −40°C
0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
T
A
= −40°C
0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Instantaneous Forward
Characteristics
I
R
, INSTANTANEOUS REVERSE CURRENT (A)
1.E+00
1.E−01
1.E−02
1.E−03
1.E−04
1.E−05
1.E−06
1.E−07
1.E−08
1.E−09
1.E−10
0
10
20
30
V
R
, INSTANTANEOUS REVERSE VOLTAGE (V)
T
A
= −40°C
T
A
= 25°C
T
A
= 150°C
T
A
= 125°C
I
R
, INSTANTANEOUS REVERSE CURRENT (A)
1.E+00
1.E−01
1.E−02
1.E−03
1.E−04
1.E−05
1.E−06
1.E−07
1.E−08
0
Figure 2. Maximum Instantaneous Forward
Characteristics
T
A
= 150°C
T
A
= 125°C
T
A
= 25°C
T
A
= −40°C
40
10
20
30
40
V
R
, INSTANTANEOUS REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Characteristics
10000
C, JUNCTION CAPACITANCE (pF)
T
A
= 25°C
I
F(AV)
, AVERAGE FORWARD CURRENT (A)
24
21
18
15
Figure 4. Maximum Reverse Characteristics
R
qJC
= 1.7°C/W
dc
1000
SQUARE WAVE
12
0
9
6
3
0
0
20
40
60
80
100 120
T
C
, CASE TEMPERATURE (°C)
140
160
100
10
0
10
20
30
V
R
, REVERSE VOLTAGE (V)
40
Figure 5. Typical Junction Characteristics
Figure 6. Current Derating TO−220AB
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3
MBR1240MFS, NRVB1240MFS
TYPICAL CHARACTERISTICS
8
P
F(AV)
, AVERAGE FORWARD
POWER DISSIPATION (W)
7
6
5
4
3
2
1
0
0
1
2
3
4
I
F(AV)
, AVERAGE FORWARD CURRENT (A)
Square Wave
dc
I
PK
/I
AV
= 5
I
PK
/I
AV
= 20
I
PK
/I
AV
= 10
T
J
= 150°C
Figure 7. Forward Power Dissipation
100
50% Duty Cycle
20%
10%
5%
2%
1%
0.1
Single Pulse
10
R
(t)
, (°C/W)
1
Assumes 25°C ambient and soldered to
a 600 mm
2
− oz copper pad on PCB
0.01
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
t, PULSE TIME (S)
Figure 8. R
(t)
vs. Duty
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4
MBR1240MFS, NRVB1240MFS
PACKAGE DIMENSIONS
DFN5 5x6, 1.27P
(SO−8FL)
CASE 488AA
ISSUE H
2X
0.20 C
D
2
D1
A
B
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION D1 AND E1 DO NOT INCLUDE
MOLD FLASH PROTRUSIONS OR GATE
BURRS.
MILLIMETERS
MIN
NOM
MAX
0.90
1.00
1.10
0.00
−−−
0.05
0.33
0.41
0.51
0.23
0.28
0.33
5.15 BSC
4.70
4.90
5.10
3.80
4.00
4.20
6.15 BSC
5.70
5.90
6.10
3.45
3.65
3.85
1.27 BSC
0.51
0.61
0.71
1.20
1.35
1.50
0.51
0.61
0.71
0.05
0.17
0.20
3.00
3.40
3.80
0
_
−−−
12
_
0.20 C
4X
E1
2
E
c
1
2
3
4
q
A1
TOP VIEW
3X
C
SEATING
PLANE
0.10 C
A
0.10 C
SIDE VIEW
8X
e
DETAIL A
DIM
A
A1
b
c
D
D1
D2
E
E1
E2
e
G
K
L
L1
M
q
DETAIL A
SOLDERING FOOTPRINT*
b
e/2
1
4
3X
4X
STYLE 2:
PIN 1. ANODE
2. ANODE
3. ANODE
4. NO CONNECT
5. CATHODE
0.10
0.05
C A B
c
L
1.270
0.750
4X
1.000
K
0.965
1.330
0.905
4.530
0.475
2X
E2
PIN 5
(EXPOSED PAD)
L1
M
2X
0.495
3.200
G
D2
BOTTOM VIEW
2X
1.530
4.560
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
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any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
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