Encoders, Decoders, Multiplexers & Demultiplexers MUX 3.6V 250mW
| 参数名称 | 属性值 |
| Source Url Status Check Date | 2013-06-14 00:00:00 |
| Brand Name | NXP Semiconductor |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | SON |
| 包装说明 | 0.90 X 1 MM, 0.35 MM HEIGHT, SOT-1115, SON-6 |
| 针数 | 6 |
| 制造商包装代码 | SOT1115 |
| Reach Compliance Code | compliant |
| 74AUP1G157GN,132 | 74AUP1G157GS,132 | 74AUP1G157GM,132 | 74AUP1G157GW,125 | 74AUP1G157GM | |
|---|---|---|---|---|---|
| 描述 | Encoders, Decoders, Multiplexers & Demultiplexers MUX 3.6V 250mW | Encoders, Decoders, Multiplexers & Demultiplexers MUX 3.6V 250mW | Encoders, Decoders, Multiplexers & Demultiplexers 1.8V 2-INPUT NON | Encoders, Decoders, Multiplexers & Demultiplexers 1.8V 2-INPUT NON | Encoders, Decoders, Multiplexers & Demultiplexers |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | 0.90 X 1 MM, 0.35 MM HEIGHT, SOT-1115, SON-6 | 1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, SON-6 | 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6 | PLASTIC, SOT-363, SC-88, SMD-6 | 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| Brand Name | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | - |
| 零件包装代码 | SON | - | SON | TSSOP | SON |
| 针数 | 6 | - | 6 | 6 | 6 |
| 制造商包装代码 | SOT1115 | SOT1202 | SOT886 | SOT363 | - |
| 系列 | - | - | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V |
| JESD-30 代码 | - | - | R-PDSO-N6 | R-PDSO-G6 | R-PDSO-N6 |
| JESD-609代码 | - | - | e3 | e3 | e3 |
| 长度 | - | - | 1.45 mm | 2 mm | 1.45 mm |
| 负载电容（CL） | - | - | 30 pF | 30 pF | 30 pF |
| 逻辑集成电路类型 | - | - | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 最大I（ol） | - | - | 0.0017 A | 0.0017 A | 0.0017 A |
| 湿度敏感等级 | - | - | 1 | 1 | 1 |
| 功能数量 | - | - | 1 | 1 | 1 |
| 输入次数 | - | - | 2 | 2 | 2 |
| 输出次数 | - | - | 1 | 1 | 1 |
| 端子数量 | - | - | 6 | 6 | 6 |
| 最高工作温度 | - | - | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | - | -40 °C | -40 °C | -40 °C |
| 输出极性 | - | - | TRUE | TRUE | TRUE |
| 封装主体材料 | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | - | VSON | TSSOP | VSON |
| 封装等效代码 | - | - | SOLCC6,.04,20 | TSSOP6,.08 | SOLCC6,.04,20 |
| 封装形状 | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | - | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE |
| 包装方法 | - | - | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
| 峰值回流温度（摄氏度） | - | - | 260 | 260 | 260 |
| 电源 | - | - | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V |
| Prop。Delay @ Nom-Sup | - | - | 21.9 ns | 21.9 ns | 21.9 ns |
| 传播延迟（tpd） | - | - | 21.9 ns | 21.9 ns | 21.9 ns |
| 认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | - | 0.5 mm | 1.1 mm | 0.5 mm |
| 最大供电电压 (Vsup) | - | - | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | - | - | 0.8 V | 0.8 V | 0.8 V |
| 标称供电电压 (Vsup) | - | - | 1.2 V | 1.2 V | 1.2 V |
| 表面贴装 | - | - | YES | YES | YES |
| 技术 | - | - | CMOS | CMOS | CMOS |
| 温度等级 | - | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | - | - | Tin (Sn) | Tin (Sn) | Tin (Sn) |
| 端子形式 | - | - | NO LEAD | GULL WING | NO LEAD |
| 端子节距 | - | - | 0.5 mm | 0.65 mm | 0.5 mm |
| 端子位置 | - | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | - | 30 | 30 | 30 |
| 宽度 | - | - | 1 mm | 1.25 mm | 1 mm |
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