Intel® Core™ i7-600, i5-500, i5-400
and i3-300 Mobile Processor Series
Datasheet — Volume One
This is volume 1 of 2. Refer to document 322813 for Volume 2
January 2010
Document Number: 322812
-
001
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Datasheet
Contents
1
Features Summary
.................................................................................................. 10
1.1
Introduction ..................................................................................................... 10
1.2
Processor Feature Details ................................................................................... 12
1.2.1 Supported Technologies .......................................................................... 12
1.3
Interfaces ........................................................................................................ 12
1.3.1 System Memory Support ......................................................................... 12
1.3.2 PCI Express* ......................................................................................... 13
1.3.3 Direct Media Interface (DMI).................................................................... 14
1.3.4 Platform Environment Control Interface (PECI) ........................................... 15
1.3.5 Intel® HD Graphics Controller.................................................................. 15
1.3.6 Embedded DisplayPort* (eDP*) ................................................................ 15
1.3.7 Intel® Flexible Display Interface (Intel® FDI) ............................................ 16
1.4
Power Management Support ............................................................................... 16
1.4.1 Processor Core....................................................................................... 16
1.4.2 System ................................................................................................. 16
1.4.3 Memory Controller.................................................................................. 16
1.4.4 PCI Express* ......................................................................................... 16
1.4.5 DMI...................................................................................................... 16
1.4.6 Integrated Graphics Controller ................................................................. 16
1.5
Thermal Management Support ............................................................................ 17
1.6
Package ........................................................................................................... 17
1.7
Terminology ..................................................................................................... 17
1.8
Related Documents ........................................................................................... 19
Interfaces................................................................................................................
20
2.1
System Memory Interface .................................................................................. 20
2.1.1 System Memory Technology Supported ..................................................... 20
2.1.2 System Memory Timing Support............................................................... 21
2.1.3 System Memory Organization Modes......................................................... 21
2.1.3.1 Single-Channel Mode................................................................. 21
2.1.3.2 Dual-Channel Mode - Intel® Flex Memory Technology Mode ........... 21
2.1.4 Rules for Populating Memory Slots ............................................................ 23
2.1.5 Technology Enhancements of Intel® Fast Memory Access (Intel® FMA) ........ 23
2.1.5.1 Just-in-Time Command Scheduling.............................................. 23
2.1.5.2 Command Overlap .................................................................... 24
2.1.5.3 Out-of-Order Scheduling ............................................................ 24
2.1.6 DRAM Clock Generation........................................................................... 24
2.1.7 System Memory Pre-Charge Power Down Support Details ............................ 24
2.2
PCI Express Interface ........................................................................................ 24
2.2.1 PCI Express Architecture ......................................................................... 24
2.2.1.1 Transaction Layer ..................................................................... 25
2.2.1.2 Data Link Layer ........................................................................ 25
2.2.1.3 Physical Layer .......................................................................... 26
2.2.2 PCI Express Configuration Mechanism ....................................................... 26
2.2.3 PCI Express Graphics .............................................................................. 27
2.3
DMI................................................................................................................. 27
2.3.1 DMI Error Flow....................................................................................... 27
2.3.2 Processor/PCH Compatibility Assumptions.................................................. 27
2.3.3 DMI Link Down ...................................................................................... 27
2.4
Integrated Graphics Controller ............................................................................ 27
2.4.1 3D and Video Engines for Graphics Processing............................................ 28
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Datasheet
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2.5
2.6
3
2.4.1.1 3D Engine Execution Units ..........................................................28
2.4.1.2 3D Pipeline ...............................................................................28
2.4.1.3 Video Engine ............................................................................29
2.4.1.4 2D Engine ................................................................................29
2.4.2 Integrated Graphics Display Pipes .............................................................30
2.4.2.1 Display Planes ..........................................................................31
2.4.2.2 Display Pipes ............................................................................31
2.4.2.3 Display Ports ............................................................................31
2.4.2.4 Embedded DisplayPort (eDP) ......................................................31
2.4.3 Intel Flexible Display Interface..................................................................32
Platform Environment Control Interface (PECI) ......................................................33
Interface Clocking..............................................................................................33
2.6.1 Internal Clocking Requirements ................................................................33
Technologies............................................................................................................34
3.1
Intel® Virtualization Technology (Intel® VT) .........................................................34
3.1.1 Intel® VT-x Objectives ............................................................................34
3.1.2 Intel VT-x Features .................................................................................35
3.1.3 Intel® VT-d Objectives............................................................................35
3.1.4 Intel VT-d Features Supported..................................................................36
3.1.5 Intel VT-d Features Not Supported ............................................................36
3.2
Intel® Trusted Execution Technology (Intel® TXT) ................................................37
3.3
Intel® Hyper-Threading Technology .....................................................................37
3.4
Intel® Turbo Boost Technology ...........................................................................38
3.4.1 Intel Turbo Boost Technology Processor Frequency......................................38
3.4.2 Intel HD Graphics with Dynamic Frequency ................................................38
3.5
New Instructions ...............................................................................................39
3.5.1 Advanced Encryption Standard New Instructions (AESNI).............................39
3.5.2 PCLMULQDQ Instruction ..........................................................................39
Power Management
.................................................................................................40
4.1
ACPI States Supported .......................................................................................40
4.1.1 System States........................................................................................40
4.1.2 Processor Core/Package Idle States...........................................................40
4.1.3 Integrated Memory Controller States .........................................................41
4.1.4 PCIe Link States .....................................................................................41
4.1.5 DMI States ............................................................................................41
4.1.6 Integrated Graphics Controller States ........................................................41
4.1.7 Interface State Combinations ...................................................................42
4.2
Processor Core Power Management ......................................................................42
4.2.1 Enhanced Intel SpeedStep® Technology ....................................................43
4.2.2 Low-Power Idle States.............................................................................43
4.2.3 Requesting Low-Power Idle States ............................................................44
4.2.4 Core C-states .........................................................................................45
4.2.4.1 Core C0 State ...........................................................................45
4.2.4.2 Core C1/C1E State ....................................................................45
4.2.4.3 Core C3 State ...........................................................................46
4.2.4.4 Core C6 State ...........................................................................46
4.2.4.5 C-State Auto-Demotion ..............................................................46
4.2.5 Package C-States ...................................................................................46
4.2.5.1 Package C0 ..............................................................................48
4.2.5.2 Package C1/C1E........................................................................48
4.2.5.3 Package C3 State ......................................................................48
4.2.5.4 Package C6 State ......................................................................48
4.2.5.5 Power Status Indicator (PSI#) and DPRSLPVR#.............................49
4.3
IMC Power Management .....................................................................................49
4.3.1 Disabling Unused System Memory Outputs.................................................49
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Datasheet
4.4
4.5
4.6
4.7
5
DRAM Power Management and Initialization ............................................... 49
4.3.2.1 Initialization Role of CKE ............................................................ 49
4.3.2.2 Conditional Self-Refresh ............................................................ 50
4.3.2.3 Dynamic Power Down Operation ................................................. 50
4.3.2.4 DRAM I/O Power Management .................................................... 50
PCIe Power Management .................................................................................... 51
DMI Power Management..................................................................................... 51
Integrated Graphics Power Management............................................................... 51
4.6.1 Intel® Display Power Saving Technology 5.0 (Intel® DPST 5.0) ................... 51
4.6.2 Graphics Render C-State ......................................................................... 51
4.6.3 Graphics Performance Modulation Technology ............................................ 51
4.6.4 Intel® Smart 2D Display Technology (Intel® S2DDT) ................................. 51
Thermal Power Management ............................................................................... 52
4.3.2
Thermal Management
.............................................................................................. 53
5.1
Thermal Design Power and Junction Temperature .................................................. 53
5.1.1 Intel Turbo Boost Technology and Graphics Dynamic Frequency ................... 53
5.1.2 Intel Turbo Boost Technology and Graphics Dynamic Frequency
Thermal Design Considerations and Specifications ...................................... 54
5.1.3 Idle Power Specifications ......................................................................... 56
5.1.4 Intel Turbo Boost Technology Control Overview .......................................... 57
5.1.5 Component Power Measurement/Estimation Error....................................... 57
5.2
Thermal Management Features ........................................................................... 58
5.2.1 Processor Core Thermal Features ............................................................. 58
5.2.1.1 Adaptive Thermal Monitor .......................................................... 58
5.2.1.2 Digital Thermal Sensor .............................................................. 60
5.2.1.3 PROCHOT# Signal..................................................................... 61
5.2.1.4 On-Demand Mode ..................................................................... 62
5.2.1.5 THERMTRIP# Signal .................................................................. 63
5.2.1.6 Critical Temperature Detection ................................................... 63
5.2.2 Integrated Graphics and Memory Controller Thermal Features ...................... 63
5.2.2.1 Internal Digital Thermal Sensor .................................................. 63
5.2.2.2 Memory Thermal Throttling Options............................................. 65
5.2.2.3 External Thermal Sensor Interface Overview ................................ 65
5.2.2.4 THERMTRIP# Operation ............................................................. 66
5.2.2.5 Render Thermal Throttling ......................................................... 66
5.2.3 Platform Environment Control Interface (PECI) ........................................... 66
5.2.3.1 Fan Speed Control with Digital Thermal Sensor ............................. 66
5.2.3.2 Processor Thermal Data Sample Rate and Filtering ........................ 67
Signal Description
................................................................................................... 68
6.1
System Memory Interface .................................................................................. 69
6.2
Memory Reference and Compensation .................................................................. 71
6.3
Reset and Miscellaneous Signals.......................................................................... 72
6.4
PCI Express Graphics Interface Signals................................................................. 73
6.5
Embedded DisplayPort (eDP) .............................................................................. 74
6.6
Intel Flexible Display Interface Signals ................................................................. 75
6.7
DMI................................................................................................................. 75
6.8
PLL Signals....................................................................................................... 76
6.9
TAP Signals ...................................................................................................... 76
6.10 Error and Thermal Protection .............................................................................. 77
6.11 Power Sequencing ............................................................................................. 78
6.12 Processor Power Signals ..................................................................................... 79
6.13 Ground and NCTF .............................................................................................. 81
6.14 Processor Internal Pull Up/Pull Down.................................................................... 82
Electrical Specifications
........................................................................................... 83
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Datasheet
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