Current Sense Amplifiers 8 MHz Op Amp Rail to Rail In/Out
| 参数名称 | 属性值 |
| Product Attribute | Attribute Value |
| 制造商 Manufacturer | ST(意法半导体) |
| 产品种类 Product Category | Current Sense Amplifiers |
| RoHS | Details |
| Number of Channels | 1 Channel |
| CMRR - Common Mode Rejection Ratio | 90 dB |
| Vos - Input Offset Voltage | 1100 uV |
| 电源电压-最大 Supply Voltage - Max | 5.5 V |
| 电源电压-最小 Supply Voltage - Min | 2.7 V |
| 工作电源电流 Operating Supply Current | 360 uA |
| 最小工作温度 Minimum Operating Temperature | - 40 C |
| 最大工作温度 Maximum Operating Temperature | + 125 C |
| 安装风格 Mounting Style | SMD/SMT |
| 封装 / 箱体 Package / Case | SO-8 |
| 系列 Packaging | Tube |
| 产品 Product | Current Sense Amplifiers |
| Output Current per Channel | 26 mA |
| 工厂包装数量 Factory Pack Quantity | 100 |
| 单位重量 Unit Weight | 0.017870 oz |
| TSC103ID | TSC103IYDT | TSC103IYPT | TSC103IPT | |
|---|---|---|---|---|
| 描述 | Current Sense Amplifiers 8 MHz Op Amp Rail to Rail In/Out | Current Sense Amplifiers CONDITIONING & INTERFACES | Current Sense Amplifiers High Volt High Side 2.7 to 5.5V 360uA | Current Sense Amplifiers High-Voltage Amp 2.7 to 5.5 V Single |
| Brand Name | - | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| 厂商名称 | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| 零件包装代码 | - | SOIC | SOIC | SOIC |
| 包装说明 | - | SOP, SOP8,.25 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 |
| 针数 | - | 8 | 8 | 8 |
| Reach Compliance Code | - | compliant | compliant | compliant |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | - | 10 weeks | 20 weeks | 20 weeks |
| 放大器类型 | - | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 最大平均偏置电流 (IIB) | - | 15 µA | 15 µA | 15 µA |
| 标称共模抑制比 | - | 105 dB | 105 dB | 105 dB |
| 最大输入失调电压 | - | 1100 µV | 1100 µV | 1100 µV |
| JESD-30 代码 | - | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| 长度 | - | 4.9 mm | 4.4 mm | 4.4 mm |
| 功能数量 | - | 1 | 1 | 1 |
| 端子数量 | - | 8 | 8 | 8 |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | SOP | TSSOP | TSSOP |
| 封装等效代码 | - | SOP8,.25 | TSSOP8,.25 | TSSOP8,.25 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | 260 |
| 电源 | - | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1.75 mm | 1.2 mm | 1.2 mm |
| 标称压摆率 | - | 0.6 V/us | 0.6 V/us | 0.6 V/us |
| 最大压摆率 | - | 0.48 mA | 0.48 mA | 0.48 mA |
| 供电电压上限 | - | 20 V | 20 V | 20 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V |
| 表面贴装 | - | YES | YES | YES |
| 温度等级 | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | - | GULL WING | GULL WING | GULL WING |
| 端子节距 | - | 1.27 mm | 0.65 mm | 0.65 mm |
| 端子位置 | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | 10 |
| 宽度 | - | 3.9 mm | 3 mm | 3 mm |
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