74ALVC574
Octal D-type flip-flop; positive edge-trigger; 3-state
Rev. 02 — 8 November 2007
Product data sheet
1. General description
The 74ALVC574 is an octal D-type flip-flop featuring separate D-type inputs for each
flip-flop and 3-state outputs for bus-oriented applications. A clock input (CP) and an
outputs enable input (OE) are common to all flip-flops.
The eight flip-flops will store the state of their individual D-inputs that meet the set-up and
hold times requirements on the LOW to HIGH CP transition.
When pin OE is LOW, the contents of the eight flip-flops is available at the outputs. When
pin OE is HIGH, the outputs go to the high-impedance OFF-state. Operation of the OE
input does not affect the state of the flip-flops.
The 74ALVC574 is functionally identical to the 74ALVC374, but has a different pin
arrangement.
2. Features
s
s
s
s
s
s
s
Wide supply voltage range from 1.65 V to 3.6 V
3.6 V tolerant inputs/outputs
CMOS low power consumption
Direct interface with TTL levels (2.7 V to 3.6 V)
Power-down mode
Latch-up performance exceeds 250 mA
Complies with JEDEC standards:
x
JESD8-7 (1.65 V to 1.95 V)
x
JESD8-5 (2.3 V to 2.7 V)
x
JESD8B/JESD36 (2.7 V to 3.6 V)
s
ESD protection:
x
HBM JESD22-A114E exceeds 2000 V
x
MM JESD22-A115A exceeds 200 V
NXP Semiconductors
74ALVC574
Octal D-type flip-flop; positive edge-trigger; 3-state
3. Ordering information
Table 1.
Ordering information
Package
Temperature range Name
74ALVC574D
−40 °C
to +85
°C
SO20
TSSOP20
Description
plastic small outline package; 20 leads;
body width 7.5 mm
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
Version
SOT163-1
SOT360-1
SOT764-1
Type number
74ALVC574PW
−40 °C
to +85
°C
74ALVC574BQ
−40 °C
to +85
°C
DHVQFN20 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 20 terminals;
body 2.5
×
4.5
×
0.85 mm
4. Functional diagram
11
1
11
2
3
4
5
6
7
8
9
CP
D0
D1
D2
D3
D4
D5
D6
D7
OE
1
mna798
C1
EN
2
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
19
18
17
16
15
14
13
12
8
9
3
4
5
6
7
1D
19
18
17
16
15
14
13
12
mna446
Fig 1. Logic symbol
Fig 2. IEC logic symbol
2
3
4
5
6
7
8
9
D0
D1
D2
D3
D4
D5
D6
D7
FF1
to
FF8
3-STATE
OUTPUTS
Q0 19
Q1 18
Q2 17
Q3 16
Q4 15
Q5 14
Q6 13
Q7 12
11 CP
1 OE
mna800
Fig 3. Functional diagram
74ALVC574_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 8 November 2007
2 of 17
NXP Semiconductors
74ALVC574
Octal D-type flip-flop; positive edge-trigger; 3-state
D0
D1
D2
D3
D4
D5
D6
D7
D
CP
Q
D
CP
Q
D
CP
Q
D
CP
Q
D
CP
Q
D
CP
Q
D
CP
Q
D
CP
Q
FF1
FF2
FF3
FF4
FF5
FF6
FF7
FF8
CP
OE
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
mna801
Fig 4. Logic diagram
74ALVC574_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 8 November 2007
3 of 17
NXP Semiconductors
74ALVC574
Octal D-type flip-flop; positive edge-trigger; 3-state
5. Pinning information
5.1 Pinning
74ALVC574
terminal 1
index area
20 V
CC
19 Q0
18 Q1
17 Q2
16 Q3
15 Q4
14 Q5
GND
(1)
GND 10
CP 11
13 Q6
12 Q7
OE
2
3
4
5
6
7
8
9
1
74ALVC574
OE
D0
D1
D2
D3
D4
D5
D6
D7
1
2
3
4
5
6
7
8
9
20 V
CC
19 Q0
18 Q1
17 Q2
16 Q3
15 Q4
14 Q5
13 Q6
12 Q7
11 CP
001aad095
D0
D1
D2
D3
D4
D5
D6
D7
GND 10
001aad096
Transparent top view
(1) The die substrate is attached to this pad using
conductive die attach material. It can not be used as
a supply pin or input.
Fig 5. Pin configuration SO20 and TSSOP20
Fig 6. Pin configuration DHVQFN20
5.2 Pin description
Table 2.
Symbol
D[0:7]
CP
OE
Q[0:7]
V
CC
GND
Pin description
Pin
2, 3, 4, 5, 6, 7, 8, 9
11
1
19, 18, 17, 16, 15, 14, 13, 12
20
10
Description
data input
clock input (LOW to HIGH, edge-triggered)
output enable input (active LOW)
3-state flip-flop output
supply voltage
ground (0 V)
74ALVC574_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 8 November 2007
4 of 17
NXP Semiconductors
74ALVC574
Octal D-type flip-flop; positive edge-trigger; 3-state
6. Functional description
Table 3.
Function table
[1]
Input
OE
Load and read register
Load register and disable
outputs
[1]
Operating mode
Internal flip-flop Output
CP
↑
↑
↑
↑
Dn
l
h
l
h
L
H
L
H
Qn
L
H
Z
Z
L
L
H
H
H = HIGH voltage level
h = HIGH voltage level one set-up time prior to the LOW to HIGH CP transition
L = LOW voltage level
l = LOW voltage level one set-up time prior to the LOW to HIGH CP transition
Z = high-impedance OFF-state
↑
= LOW to HIGH clock transition
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
V
CC
I
IK
V
I
I
OK
V
O
Parameter
supply voltage
input clamping current
input voltage
output clamping current
output voltage
V
O
> V
CC
or V
O
< 0 V
output HIGH or LOW state
output 3-state
power-down mode, V
CC
= 0 V
I
O
I
CC
I
GND
T
stg
P
tot
[1]
[2]
[3]
[2]
[1] [2]
Conditions
V
I
< 0 V
Min
−0.5
−50
−0.5
-
−0.5
−0.5
−0.5
-
-
−100
−65
Max
+4.6
-
+4.6
±50
V
CC
+ 0.5
+4.6
+4.6
±50
100
-
+150
500
Unit
V
mA
V
mA
V
V
V
mA
mA
mA
°C
mW
output current
supply current
ground current
storage temperature
total power dissipation
V
O
= 0 V to V
CC
T
amb
=
−40 °C
to +85
°C
[3]
-
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
When V
CC
= 0 V (power-down mode), the output voltage can be 3.6 V in normal operation.
For SO20 packages: above 70
°C
derate linearly with 8 mW/K.
For TSSOP20 packages: above 60
°C
derate linearly with 5.5 mW/K.
For DHVQFN20 packages: above 60
°C
derate linearly with 4.5 mW/K.
74ALVC574_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 8 November 2007
5 of 17
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