RS-422/RS-485 Interface IC Half-Dplx RS-485/422 5V 16Msps LD/Rc
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
零件包装代码 | DFN |
包装说明 | VSON, SOLCC8,.08,20 |
针数 | 8 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
Factory Lead Time | 6 weeks |
Is Samacsys | N |
差分输出 | YES |
驱动器位数 | 1 |
输入特性 | STANDARD |
接口集成电路类型 | LINE TRANSCEIVER |
接口标准 | RS-485; RS-422 |
JESD-30 代码 | S-XDSO-N8 |
JESD-609代码 | e4 |
长度 | 2 mm |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
最小输出摆幅 | 1.5 V |
最大输出低电流 | 0.001 A |
封装主体材料 | UNSPECIFIED |
封装代码 | VSON |
封装等效代码 | SOLCC8,.08,20 |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
电源 | 5 V |
认证状态 | Not Qualified |
最大接收延迟 | 80 ns |
接收器位数 | 1 |
座面最大高度 | 0.8 mm |
最大压摆率 | 4.5 mA |
最大供电电压 | 5.25 V |
最小供电电压 | 4.75 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子面层 | GOLD |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
最大传输延迟 | 1000 ns |
宽度 | 2 mm |
Base Number Matches | 1 |
MAX13486EELA+T | MAX13486EESA+ | MAX13485EELA+T | MAX13486EESA+T | 302074-4P370K00QB | |
---|---|---|---|---|---|
描述 | RS-422/RS-485 Interface IC Half-Dplx RS-485/422 5V 16Msps LD/Rc | RS-422/RS-485 Interface IC Half-Dplx RS-485/422 5V 16Msps LD/Rc | RS-422/RS-485 Interface IC Half-Dplx RS-485/422 5V 500ksps LD/Rc | RS-422/RS-485 Interface IC Half-Dplx RS-485/422 5V 16Msps LD/Rc | Fixed Resistor, Metal Foil, 1W, 370000ohm, 500V, 0.02% +/-Tol, -2,2ppm/Cel, |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 不符合 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
JESD-609代码 | e4 | e3 | e4 | e3 | e0 |
端子数量 | 8 | 8 | 8 | 8 | 4 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C |
封装形式 | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE | 4 Terminals |
技术 | BICMOS | BICMOS | BICMOS | BICMOS | METAL FOIL |
端子面层 | GOLD | Matte Tin (Sn) | GOLD | MATTE TIN | Tin/Lead (Sn/Pb) |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - |
零件包装代码 | DFN | SOIC | DFN | SOIC | - |
包装说明 | VSON, SOLCC8,.08,20 | SOP, SOP8,.25 | VSON, SOLCC8,.08,20 | 0.150 INCH, LEAD FREE, MS-012AA, SOIC-8 | - |
针数 | 8 | 8 | 8 | 8 | - |
Factory Lead Time | 6 weeks | 6 weeks | 6 weeks | 6 weeks | - |
差分输出 | YES | YES | YES | YES | - |
驱动器位数 | 1 | 1 | 1 | 1 | - |
输入特性 | STANDARD | STANDARD | STANDARD | STANDARD | - |
接口集成电路类型 | LINE TRANSCEIVER | LINE TRANSCEIVER | LINE TRANSCEIVER | LINE TRANSCEIVER | - |
接口标准 | RS-485; RS-422 | RS-485; RS-422 | RS-485; RS-422 | RS-485; RS-422 | - |
JESD-30 代码 | S-XDSO-N8 | R-PDSO-G8 | S-XDSO-N8 | R-PDSO-G8 | - |
长度 | 2 mm | 4.9 mm | 2 mm | 4.9 mm | - |
湿度敏感等级 | 1 | 1 | 1 | 1 | - |
功能数量 | 1 | 1 | 1 | 1 | - |
最小输出摆幅 | 1.5 V | 1.5 V | 1.5 V | 1.5 V | - |
最大输出低电流 | 0.001 A | 0.001 A | 0.001 A | 0.001 A | - |
封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | - |
封装代码 | VSON | SOP | VSON | SOP | - |
封装等效代码 | SOLCC8,.08,20 | SOP8,.25 | SOLCC8,.08,20 | SOP8,.25 | - |
封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | - |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | - |
电源 | 5 V | 5 V | 5 V | 5 V | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
最大接收延迟 | 80 ns | 80 ns | 80 ns | 80 ns | - |
接收器位数 | 1 | 1 | 1 | 1 | - |
座面最大高度 | 0.8 mm | 1.75 mm | 0.8 mm | 1.75 mm | - |
最大压摆率 | 4.5 mA | 4.5 mA | 4.5 mA | 4.5 mA | - |
最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V | - |
最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.75 V | - |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | - |
表面贴装 | YES | YES | YES | YES | - |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
端子形式 | NO LEAD | GULL WING | NO LEAD | GULL WING | - |
端子节距 | 0.5 mm | 1.27 mm | 0.5 mm | 1.27 mm | - |
端子位置 | DUAL | DUAL | DUAL | DUAL | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
最大传输延迟 | 1000 ns | 1000 ns | 1000 ns | 1000 ns | - |
宽度 | 2 mm | 3.9 mm | 2 mm | 3.9 mm | - |
Base Number Matches | 1 | 1 | - | 1 | - |
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