MAX5207BEUB+,MAX5207BEUB+ pdf中文资料,MAX5207BEUB+引脚图,MAX5207BEUB+电路-Datasheet-电子工程世界

Datasheet> 器件分类 > 模拟混合信号IC> 转换器> MAX5207BEUB+

MAX5207BEUB+: 产品描述Digital to Analog Converters - DAC 16Bit DAC w/Int Reference; 产品类别模拟混合信号IC 转换器; 文件大小278KB，共13页; 制造商Maxim(美信半导体); 官网地址https://www.maximintegrated.com/en.html; 标准

下载文档详细参数选型对比全文预览

MAX5207BEUB+概述

Digital to Analog Converters - DAC 16Bit DAC w/Int Reference

MAX5207BEUB+规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	Maxim(美信半导体)
零件包装代码	SOIC
包装说明	MICRO MAX PACKAGE-10
针数	10
Reach Compliance Code	compliant
ECCN代码	EAR99
Factory Lead Time	6 weeks
最大模拟输出电压	3 V
最小模拟输出电压
转换器类型	D/A CONVERTER
输入位码	OFFSET BINARY
输入格式	SERIAL
JESD-30 代码	S-PDSO-G10
JESD-609代码	e3
长度	3 mm
最大线性误差 (EL)	0.061%
湿度敏感等级	1
位数	16
功能数量	1
端子数量	10
最高工作温度	105 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	TSSOP
封装等效代码	TSSOP10,.19,20
封装形状	SQUARE
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）	260
电源	3/3.3 V
认证状态	Not Qualified
座面最大高度	1.1 mm
标称安定时间 (tstl)	25 µs
最大压摆率	1.5 mA
标称供电电压	3 V
表面贴装	YES
技术	BICMOS
温度等级	INDUSTRIAL
端子面层	Matte Tin (Sn)
端子形式	GULL WING
端子节距	0.5 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	3 mm
Base Number Matches	1

MAX5207BEUB+相似产品对比

	MAX5207BEUB+	MAX5207ACUB+T	MAX5205BEUB+	MAX5206ACUB+T	MAX5206AEUB	MAX5204BEUB+	MAX5206AEUB+	MAX5204AEUB+	MAX5207AEUB+	MAX5206ACUB
描述	Digital to Analog Converters - DAC 16Bit DAC w/Int Reference	Digital to Analog Converters - DAC 16Bit DAC w/Int Reference	Digital to Analog Converters - DAC 16Bit DAC w/Int Reference	Digital to Analog Converters - DAC 16Bit DAC w/Int Reference	Digital to Analog Converters - DAC	Digital to Analog Converters - DAC 16Bit DAC w/Int Reference	Digital to Analog Converters - DAC 16Bit DAC w/Int Reference	Digital to Analog Converters - DAC 16Bit DAC w/Int Reference	Digital to Analog Converters - DAC 16Bit DAC w/Int Reference	Digital to Analog Converters - DAC
是否无铅	不含铅	不含铅	不含铅	不含铅	含铅	不含铅	不含铅	不含铅	不含铅	含铅
是否Rohs认证	符合	符合	符合	符合	不符合	符合	符合	符合	符合	不符合
厂商名称	Maxim(美信半导体)	Maxim(美信半导体)	Maxim(美信半导体)	Maxim(美信半导体)	Maxim(美信半导体)	Maxim(美信半导体)	Maxim(美信半导体)	Maxim(美信半导体)	Maxim(美信半导体)	Maxim(美信半导体)
零件包装代码	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC
包装说明	MICRO MAX PACKAGE-10	MICRO MAX PACKAGE-10	TSSOP, TSSOP10,.19,20	TSSOP, TSSOP10,.19,20	MICRO MAX PACKAGE-10	TSSOP, TSSOP10,.19,20	TSSOP, TSSOP10,.19,20	TSSOP, TSSOP10,.19,20	TSSOP, TSSOP10,.19,20	MICRO MAX PACKAGE-10
针数	10	10	10	10	10	10	10	10	10	10
Reach Compliance Code	compliant	compliant	compliant	compliant	not_compliant	compliant	compliant	compliant	compliant	not_compliant
最大模拟输出电压	3 V	3 V	5 V	3 V	3 V	5 V	3 V	5 V	3 V	3 V
转换器类型	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER
输入位码	OFFSET BINARY	OFFSET BINARY	OFFSET BINARY	OFFSET BINARY	OFFSET BINARY	OFFSET BINARY	OFFSET BINARY	OFFSET BINARY	OFFSET BINARY	OFFSET BINARY
输入格式	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
JESD-30 代码	S-PDSO-G10	S-PDSO-G10	S-PDSO-G10	S-PDSO-G10	S-PDSO-G10	S-PDSO-G10	S-PDSO-G10	S-PDSO-G10	S-PDSO-G10	S-PDSO-G10
JESD-609代码	e3	e3	e3	e3	e0	e3	e3	e3	e3	e0
长度	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm
最大线性误差 (EL)	0.061%	0.0305%	0.061%	0.0305%	0.0305%	0.061%	0.0305%	0.0305%	0.0305%	0.0305%
湿度敏感等级	1	1	1	1	1	1	1	1	1	1
位数	16	16	16	16	16	16	16	16	16	16
功能数量	1	1	1	1	1	1	1	1	1	1
端子数量	10	10	10	10	10	10	10	10	10	10
最高工作温度	105 °C	70 °C	105 °C	70 °C	105 °C	105 °C	105 °C	105 °C	105 °C	70 °C
最低工作温度	-40 °C	-	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TSSOP	TSSOP	TSSOP	TSSOP	TSSOP	TSSOP	TSSOP	TSSOP	TSSOP	TSSOP
封装等效代码	TSSOP10,.19,20	TSSOP10,.19,20	TSSOP10,.19,20	TSSOP10,.19,20	TSSOP10,.19,20	TSSOP10,.19,20	TSSOP10,.19,20	TSSOP10,.19,20	TSSOP10,.19,20	TSSOP10,.19,20
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）	260	260	260	260	245	260	260	260	260	245
电源	3/3.3 V	3/3.3 V	5 V	3/3.3 V	3/3.3 V	5 V	3/3.3 V	5 V	3/3.3 V	3/3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm
标称安定时间 (tstl)	25 µs	25 µs	25 µs	25 µs	25 µs	25 µs	25 µs	25 µs	25 µs	25 µs
最大压摆率	1.5 mA	1.5 mA	1.5 mA	1.5 mA	1.5 mA	1.5 mA	1.5 mA	1.5 mA	1.5 mA	1.5 mA
标称供电电压	3 V	3 V	5 V	3 V	3 V	5 V	3 V	5 V	3 V	3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS
温度等级	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL
端子面层	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Tin/Lead (Sn85Pb15)	MATTE TIN	Matte Tin (Sn)	Matte Tin (Sn)	MATTE TIN	Tin/Lead (Sn85Pb15)
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm
ECCN代码	EAR99	3A001.A.5.B	EAR99	EAR99	-	EAR99	EAR99	EAR99	EAR99	-
Factory Lead Time	6 weeks	-	9 weeks	10 weeks	-	-	1 week	6 weeks	1 week	-

MAX5207BEUB+

MAX5207BEUB+概述

MAX5207BEUB+规格参数

MAX5207BEUB+相似产品对比

推荐资源