Gate Drivers
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | QFN |
包装说明 | HVQCCN, |
针数 | 20 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
高边驱动器 | YES |
接口集成电路类型 | HALF BRIDGE BASED MOSFET DRIVER |
JESD-30 代码 | S-XQCC-N20 |
长度 | 4 mm |
功能数量 | 2 |
端子数量 | 20 |
最高工作温度 | 100 °C |
最低工作温度 | -40 °C |
封装主体材料 | UNSPECIFIED |
封装代码 | HVQCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
座面最大高度 | 0.8 mm |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 4 mm |
MAX8703ETP-T | MAX8703ETP | MAX8702ETP-T | MAX8702ETP | MAX8702ETP+ | |
---|---|---|---|---|---|
描述 | Gate Drivers | Gate Drivers | Gate Drivers | Gate Drivers | IC DRVR MOSFET DUAL 20-TQFN |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 不含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
零件包装代码 | QFN | QFN | QFN | QFN | QFN |
包装说明 | HVQCCN, | HVQCCN, LCC20,.16SQ,20 | HVQCCN, | HVQCCN, LCC20,.16SQ,20 | HVQCCN, |
针数 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | unknown | not_compliant | compliant | not_compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
高边驱动器 | YES | YES | YES | YES | YES |
接口集成电路类型 | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER |
JESD-30 代码 | S-XQCC-N20 | S-XQCC-N20 | S-XQCC-N20 | S-XQCC-N20 | S-XQCC-N20 |
长度 | 4 mm | 4 mm | 4 mm | 4 mm | 4 mm |
功能数量 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 100 °C | 100 °C | 100 °C | 100 °C | 100 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED | 245 | 245 | 245 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 4 mm | 4 mm | 4 mm | 4 mm | 4 mm |
JESD-609代码 | - | e0 | e0 | e0 | e3 |
湿度敏感等级 | - | 1 | 1 | 1 | 1 |
端子面层 | - | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | TIN |
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