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89H48T12G2ZCBLG8

产品描述Switch ICs - Various PCIE GEN2 SWITCH
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小276KB,共43页
制造商IDT (Integrated Device Technology)
标准
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89H48T12G2ZCBLG8概述

Switch ICs - Various PCIE GEN2 SWITCH

89H48T12G2ZCBLG8规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码FCBGA
包装说明BGA, BGA676,26X26,40
针数676
制造商包装代码BLG676
Reach Compliance Codecompliant
ECCN代码EAR99
地址总线宽度
总线兼容性I2C; ISA; PCI; SMBUS; VGA
最大时钟频率125 MHz
最大数据传输速率48000 MBps
外部数据总线宽度
JESD-30 代码S-PBGA-B676
JESD-609代码e1
长度27 mm
湿度敏感等级4
端子数量676
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA676,26X26,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)245
电源1,2.5/3.3 V
认证状态Not Qualified
座面最大高度3.22 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度27 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI

文档解析

根据这份数据手册,选择合适的端口配置需要考虑以下几个关键点:

  1. 应用需求:首先明确系统的应用场景,比如服务器、存储、通信、嵌入式系统等,这将决定所需的端口数量和类型。

  2. 端口类型与数量:手册中提到89HPES48T12G2支持48通道,12个端口,可以配置为6个x8端口或12个x4端口。每个端口都可以根据需要合并或分割,例如,两个x4端口可以合并成一个x8端口。

  3. 链路宽度:端口支持自动链路宽度协商(x8 → x4 → x2 → x1),可以根据实际的带宽需求和兼容性要求选择合适的链路宽度。

  4. 性能要求:如果系统需要高性能和低延迟,应选择支持PCIe Gen2(5.0 GT/s)的配置。手册中提到该设备支持高达48 GBps的交换容量。

  5. 电源管理:考虑系统的电源管理需求,比如D0、D3hot和D3电源管理状态,以及ASPM(Active State Power Management)支持。

  6. 热插拔:如果系统设计中需要支持热插拔功能,应选择支持PCI Express Hot-Plug的端口。

  7. 质量服务(QoS):如果应用需要不同的服务质量,应考虑支持端口仲裁和请求计量的配置。

  8. 多播支持:如果系统需要多播功能,应选择支持PCI-SIG多播ECN的配置。

  9. 时钟要求:根据系统的时钟要求选择合适的参考时钟频率(100 MHz或125 MHz)。

  10. 电源电压:确保所选配置的端口符合系统的电源电压要求,手册中提到需要1.0V和2.5V两种电源电压。

  11. 物理尺寸和布局:考虑PCB板的尺寸和布局限制,选择合适的封装类型。

  12. 引脚分配:根据手册中的引脚分配表,确保所选端口配置不会与其他系统组件发生冲突。

通过综合考虑以上因素,可以为特定应用场景设计合适的端口配置。如果需要更详细的配置建议,可以进一步分析具体的系统要求和设计约束。

文档预览

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48-Lane 12-Port PCIe® Gen2
System Interconnect Switch
®
89HPES48T12G2
Data Sheet
Device Overview
The 89HPES48T12G2 is a member of the IDT PRECISE™ family of
PCI Express® switching solutions. The PES48T12G2 is a 48-lane, 12-
port system interconnect switch optimized for PCI Express Gen2 packet
switching in high-performance applications, supporting multiple simulta-
neous peer-to-peer traffic flows. Target applications include servers,
storage, communications, embedded systems, and multi-host or intelli-
gent I/O based systems with inter-domain communication.
• De-emphasis
• Receive equalization
• Drive strength
Initialization / Configuration
Features
High Performance Non-Blocking Switch Architecture
48-lane 12-port PCIe switch
• Six x8 ports switch ports each of which can bifurcate to two
x4 ports (total of twelve x4 ports)
Integrated SerDes supports 5.0 GT/s Gen2 and 2.5 GT/s
Gen1 operation
Delivers up to
48 GBps (384 Gbps)
of switching capacity
Supports 128 Bytes to 2 KB maximum payload size
Low latency cut-through architecture
Supports one virtual channel and eight traffic classes
Standards and Compatibility
PCI Express Base Specification 2.0 compliant
Implements the following optional PCI Express features
• Advanced Error Reporting (AER) on all ports
• End-to-End CRC (ECRC)
• Access Control Services (ACS)
• Power Budgeting Enhanced Capability
• Device Serial Number Enhanced Capability
• Sub-System ID and Sub-System Vendor ID Capability
• Internal Error Reporting ECN
• Multicast ECN
• VGA and ISA enable
• L0s and L1 ASPM
• ARI ECN
Port Configurability
x4 and x8 ports
• Ability to merge adjacent x4 ports to create a x8 port
Automatic per port link width negotiation
(x8
x4
x2
x1)
Crosslink support
Automatic lane reversal
Autonomous and software managed link width and speed
control
Per lane SerDes configuration
Supports Root (BIOS, OS, or driver), Serial EEPROM, or
SMBus switch initialization
Common switch configurations are supported with pin strap-
ping (no external components)
Supports in-system Serial EEPROM initialization/program-
ming
Quality of Service (QoS)
Port arbitration
• Round robin
• Weighted Round Robin (WRR)
Request metering
• IDT proprietary feature that balances bandwidth among
switch ports for maximum system throughput
High performance switch core architecture
• Combined Input Output Queued (CIOQ) switch architecture
with large buffers
Multicast
Compliant to the PCI-SIG multicast ECN
Supports arbitrary multicasting of Posted transactions
Supports 64 multicast groups
Multicast overlay mechanism support
ECRC regeneration support
Clocking
Supports 100 MHz and 125 MHz reference clock frequencies
Flexible clocking modes
• Common clock
• Non-common clock
Hot-Plug and Hot Swap
Hot-plug controller on all ports
• Hot-plug supported on all downstream switch ports
All ports support hot-plug using low-cost external I
2
C I/O
expanders
Configurable presence detect supports card and cable appli-
cations
GPE output pin for hot-plug event notification
• Enables SCI/SMI generation for legacy operating system
support
Hot swap capable I/O
Power Management
Supports D0, D3hot and D3 power management states
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 43
2011 Integrated Device Technology, Inc.
November 28, 2011

89H48T12G2ZCBLG8相似产品对比

89H48T12G2ZCBLG8 89H48T12G2ZCBL8 89H48T12G2ZDBLG 89H48T12G2ZCBLGI 89H48T12G2ZCBLI8
描述 Switch ICs - Various PCIE GEN2 SWITCH Switch ICs - Various PCIE GEN2 SWITCH Switch ICs - Various PCIE GEN2 SWITCH Switch ICs - Various PCIE GEN2 SWITCH Switch ICs - Various PCIE GEN2 SWITCH
Brand Name Integrated Device Technology Integrated Device Technology - Integrated Device Technology Integrated Device Technology
是否无铅 不含铅 含铅 - 不含铅 含铅
是否Rohs认证 符合 不符合 - 符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 FCBGA FCBGA - FCBGA FCBGA
包装说明 BGA, BGA676,26X26,40 FCBGA-676 - BGA, BGA676,26X26,40 FCBGA-676
针数 676 676 - 676 676
制造商包装代码 BLG676 BL676 - BLG676 BL676
Reach Compliance Code compliant not_compliant - compliant not_compliant
ECCN代码 EAR99 EAR99 - EAR99 EAR99
总线兼容性 I2C; ISA; PCI; SMBUS; VGA I2C; ISA; PCI; SMBUS; VGA - I2C; ISA; PCI; SMBUS; VGA I2C; ISA; PCI; SMBUS; VGA
最大时钟频率 125 MHz 125 MHz - 125 MHz 125 MHz
最大数据传输速率 48000 MBps 48000 MBps - 48000 MBps 48000 MBps
JESD-30 代码 S-PBGA-B676 S-PBGA-B676 - S-PBGA-B676 S-PBGA-B676
JESD-609代码 e1 e0 - e1 e0
长度 27 mm 27 mm - 27 mm 27 mm
湿度敏感等级 4 4 - 4 4
端子数量 676 676 - 676 676
最高工作温度 70 °C 70 °C - 85 °C 85 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA - BGA BGA
封装等效代码 BGA676,26X26,40 BGA676,26X26,40 - BGA676,26X26,40 BGA676,26X26,40
封装形状 SQUARE SQUARE - SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY - GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) 245 225 - 245 225
电源 1,2.5/3.3 V 1,2.5/3.3 V - 1,2.5/3.3 V 1,2.5/3.3 V
认证状态 Not Qualified Not Qualified - Not Qualified Not Qualified
座面最大高度 3.22 mm 3.22 mm - 3.22 mm 3.22 mm
最大供电电压 1.1 V 1.1 V - 1.1 V 1.1 V
最小供电电压 0.9 V 0.9 V - 0.9 V 0.9 V
标称供电电压 1 V 1 V - 1 V 1 V
表面贴装 YES YES - YES YES
技术 CMOS CMOS - CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL - INDUSTRIAL INDUSTRIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb)
端子形式 BALL BALL - BALL BALL
端子节距 1 mm 1 mm - 1 mm 1 mm
端子位置 BOTTOM BOTTOM - BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
宽度 27 mm 27 mm - 27 mm 27 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI - BUS CONTROLLER, PCI BUS CONTROLLER, PCI

 
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