Surface Mount Metallized PPS Film Capacitor
LDB, Unencapsulated Stacked Chip,
Size 1206 – 1812, 16 and 50 VDC
Overview
Polyphenylene sulphide (PPS) film capacitor for surface
mounting.
Applications
Typical applications include timing, filtering and use as
a memory capacitor. The LDB Series is designed for high
stability, accuracy and temperature.
Benefits
• Rated voltage: 16VDC – 50VDC
• Capacitance range: 0.0033µF – 0.1µF
• EIA Size 1206 – 1812
• Capacitance tolerance: ±2%, ±5%
• Climatic category: 55/125/56
• RoHS compliance and lead-free terminations
• Operating temperature range of −55°C to +125°C
Part Number System
LDB
Series
A
Rated Voltage
(VDC)
A
Size Code
See Dimension
Table
2120
Capacitance
Code (pF)
Digits two –
four indicate
the first three
digits of the
capacitance
value.
First digit
indicates the
number of
zeros to be
added.
G
Capacitance
Tolerance
G = ±2%
J = ±5%
C
Dielectric
C = PPS
5
Version
5 = Standard
N
Packaging
See Ordering
Options Table
0
Internal Use
0 (Standard)
Metallized PPS A = 16
C = 50
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
F3082_LDB • 7/31/2017
1
Surface Mount Metallized PPS Film Capacitors
LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC
Ordering Options Table
Packaging Type
Standard Packaging Options
Tape & Reel (Standard Reel)
N
Packaging
Code
Dimensions – Millimeters
W
L
H
B
Size Code
A
B
C
Chip Size
(EIA)
1206
1210
1812
W
Nominal
1.7
2.5
3.3
Tolerance
±0.2
±0.3
±0.3
H
(Maximum)
See Part Number Table
L
Nominal
3.3
3.3
4.7
Tolerance
+0.3/−0.1
+0.3/−0.1
+0.3/−0.2
Nominal
0.5
0.5
0.5
B
Tolerance
+0.5/−0.3
+0.5/−0.3
+0.5/−0.3
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
F3082_LDB • 7/31/2017
2
Surface Mount Metallized PPS Film Capacitors
LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC
Performance Characteristics
Rated Voltage (VDC)
Capacitance Range (μF)
Chip Size (EIA)
Capacitance Values
Capacitance Tolerance
Category Temperature Range
Rated Temperature
Voltage Derating
Climatic Category
Capacitance Drift
Reliability
(Reference MIL-HDBK-217)
16
0.012 – 0.1
1206 – 1812
E12 series
±2%, ±5%
−55°C to +125°C
+105°C
V
C
(category voltage) = V
R
(rated voltage) up to 105°C. Vc is decreased
with 1.25%/°C from +105 °C to +125 °C
55/125/56
Maximum 1% after a 2 year storage period at a temperature of +10°C
to +40°C and a relative humidity of 40% to 60%
Failure rate ≤ 1 FIT, T = +40°C, V = 0.5 x V
R
1 FIT = 10
-9
failures / (components * hours)
Failure criteria: open or short circuit, cap. change > 10%, DF 2 times
the catalog limits, IR < 0.005 x initial limit
Measured at +25°C ±5°C
Minimum Value Between Terminals
Insulation Resistance
3,000 MΩ
Charging time: 1 minute
Charging voltage:
10 V
DC
for VR = 16 V
DC
50 V
DC
for VR = 50 V
DC
Maximum Values at 25°C ±5°C
1 kHz
1.75 x V
R
(5 seconds; T = 25 ± 5°C)
0.6%
50
0.0033 – 0.1
Dissipation Factor
Surge Voltage Test
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
F3082_LDB • 7/31/2017
3
Surface Mount Metallized PPS Film Capacitors
LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC
PPS Dielectric Typical Temperature Graphs
Capacitance vs. Temperature
(f = 1 kHz)
1.0
0.5
PPS Dielectric Typical Frequency Graphs
Capacitance vs. Frequency
2.0
1.5
1.0
∆
C/C [%]
0.5
0.0
∆
C/C [%]
0.0
−0.5
−1.0
−1.5
−60 −40 −20
−0.5
−1.0
−1.5
−2.0
0.1
1
10
100
1,000
f [kHZ]
0
20
40
60
80
100
120 140
Dissipation Factor vs. Frequency
100
80
0.1 µF
Temperature [°C]
tg δ x 10
−4
60
40
20
0
0.1
10 nF
1
Dissipation Factor vs. Temperature
(f = 1 kHz)
50
40
f [kHZ]
10
100
1,000
tgδ x 10
−4
30
20
10
1E+2
1E+1
Equivalent Series Resisteance vs. Frequency
ESR [Ω]
0
−60 −40 −20
0
20
40
60
80
100
120 140
1E+0
1E−1
1E−2
0.1
10 nF
0.1 µF
Temperature [°C]
Insulation Resistance vs. Temperature
1E+7
1
f [kHZ]
10
100
1,000
PEN and PPS Impedance vs. Frequency
10
IR [MΩ]
1E+6
1
1E+5
|Z| [Ω]
0.1
1E+4
−60 −40 −20
0
20
40
60
80
100
120 140
Temperature [°C]
0.01
0.1
1.0 µF
1
0.1 µF
10
0.01 µF
100
f [MHZ]
Note: Measurements performed at T = 25±5°C
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
F3082_LDB • 7/31/2017
4
Surface Mount Metallized PPS Film Capacitors
LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC
Environmental Test Data
Damp Heat, Steady State
Test Conditions
Temperature
Relative Humidity (RH)
Test Duration
Capacitance Change |∆ C/C|
DF Change (∆tgδ)
Insulation Resistance
+40°C ±2°C
93% ±2%
56 days
≤ 5%
≤ 30 x 10
−4
at 1 kHz
≥ 50% of limit value
Test Conditions
Performance
Capacitance Change |∆ C/C|
DF Change (∆tgδ)
Insulation Resistance
≤ 3%
≤ 50 x 10
−4
at 1 kHz
≥ limit value
Reflow
See Solder Process
Performance
No Mechanical Damage
Bending
Test Conditions
Deflection
1 to 6 mm
Performance
Capacitance Change |∆ C/C|
≤ 1%
No visible damage on the terminations
(pealing) neither on the body (cracking)
Endurance
Test Conditions
Temperature
Test Duration
Voltage Applied
Capacitance Change |∆ C/C|
DF Change (∆tgδ)
Insulation Resistance
125°C ±2°C
2,000 hours
1.25 x V
C
≤ 3%
≤ 30 x 10
−4
at 1 kHz
≥ 50% of limit value
Performance
Rapid Change of Temperature
Test Conditions
1 hour at −55°C, 1 hour at
Temperature
+125°C
Number of Cycles
1,000
Performance
Capacitance Change |∆ C/C|
DF Change (∆tgδ)
Insulation Resistance
≤ 3%
≤ 50 x 10
−4
at 1 kHz
≥ limit value
No Mechanical Damage
Environmental Compliance
All KEMET surface mount capacitors are RoHS Compliant.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
F3082_LDB • 7/31/2017
5
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