ACT SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, CDFP48, CERAMIC, DFP-48
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DFP, FL48,.4,25 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 控制类型 | ENABLE LOW |
| 系列 | ACT |
| JESD-30 代码 | R-GDFP-F48 |
| JESD-609代码 | e0 |
| 长度 | 15.748 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.024 A |
| 位数 | 4 |
| 功能数量 | 4 |
| 端口数量 | 2 |
| 端子数量 | 48 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装等效代码 | FL48,.4,25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 10 ns |
| 传播延迟（tpd） | 10 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class V |
| 座面最大高度 | 2.54 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped |
| 端子形式 | FLAT |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 总剂量 | 100k Rad(Si) V |
| 宽度 | 9.65 mm |
| Base Number Matches | 1 |
| 5962R9561901VXA | 5962-9561901QXA | 54ACTQ16244W-QML | RM54ACTQ16244VX | 54ACTQ16244MDA | |
|---|---|---|---|---|---|
| 描述 | ACT SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, CDFP48, CERAMIC, DFP-48 | ACT SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, CDFP48, CERAMIC, DFP-48 | ACT SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, CDFP48, CERPACK-48 | ACT SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, CDFP48, CERPACK-48 | ACT SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, UUC48, DIE |
| 包装说明 | DFP, FL48,.4,25 | DFP, FL48,.4,25 | DFP, | DFP, | DIE, |
| Reach Compliance Code | unknown | unknown | unknown | compliant | unknown |
| 系列 | ACT | ACT | ACT | ACT | ACT |
| JESD-30 代码 | R-GDFP-F48 | R-GDFP-F48 | R-GDFP-F48 | R-GDFP-F48 | R-XUUC-N48 |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 48 | 48 | 48 | 48 | 48 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | UNSPECIFIED |
| 封装代码 | DFP | DFP | DFP | DFP | DIE |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | UNCASED CHIP |
| 传播延迟（tpd） | 10 ns | 10 ns | 10 ns | 10 ns | 10 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | FLAT | FLAT | FLAT | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | UPPER |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| JESD-609代码 | e0 | e0 | - | e0 | - |
| 长度 | 15.748 mm | 15.748 mm | 15.748 mm | 15.748 mm | - |
| 座面最大高度 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped | TIN LEAD | - | Tin/Lead (Sn63Pb37) | - |
| 端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | - |
| 宽度 | 9.65 mm | 9.65 mm | 9.65 mm | 9.65 mm | - |
| Base Number Matches | 1 | 1 | 1 | - | - |
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