ACT SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, CDFP48, CERPACK-48
参数名称 | 属性值 |
厂商名称 | Texas Instruments(德州仪器) |
包装说明 | DFP, |
Reach Compliance Code | unknown |
系列 | ACT |
JESD-30 代码 | R-GDFP-F48 |
长度 | 15.748 mm |
逻辑集成电路类型 | BUS DRIVER |
位数 | 4 |
功能数量 | 4 |
端口数量 | 2 |
端子数量 | 48 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
传播延迟(tpd) | 10 ns |
认证状态 | Not Qualified |
座面最大高度 | 2.54 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | FLAT |
端子节距 | 0.635 mm |
端子位置 | DUAL |
宽度 | 9.65 mm |
Base Number Matches | 1 |
54ACTQ16244W-QML | 5962-9561901QXA | 5962R9561901VXA | RM54ACTQ16244VX | 54ACTQ16244MDA | |
---|---|---|---|---|---|
描述 | ACT SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, CDFP48, CERPACK-48 | ACT SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, CDFP48, CERAMIC, DFP-48 | ACT SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, CDFP48, CERAMIC, DFP-48 | ACT SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, CDFP48, CERPACK-48 | ACT SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, UUC48, DIE |
包装说明 | DFP, | DFP, FL48,.4,25 | DFP, FL48,.4,25 | DFP, | DIE, |
Reach Compliance Code | unknown | unknown | unknown | compliant | unknown |
系列 | ACT | ACT | ACT | ACT | ACT |
JESD-30 代码 | R-GDFP-F48 | R-GDFP-F48 | R-GDFP-F48 | R-GDFP-F48 | R-XUUC-N48 |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
位数 | 4 | 4 | 4 | 4 | 4 |
功能数量 | 4 | 4 | 4 | 4 | 4 |
端口数量 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 48 | 48 | 48 | 48 | 48 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | UNSPECIFIED |
封装代码 | DFP | DFP | DFP | DFP | DIE |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | UNCASED CHIP |
传播延迟(tpd) | 10 ns | 10 ns | 10 ns | 10 ns | 10 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | FLAT | FLAT | FLAT | FLAT | NO LEAD |
端子位置 | DUAL | DUAL | DUAL | DUAL | UPPER |
厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
长度 | 15.748 mm | 15.748 mm | 15.748 mm | 15.748 mm | - |
座面最大高度 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - |
端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | - |
宽度 | 9.65 mm | 9.65 mm | 9.65 mm | 9.65 mm | - |
Base Number Matches | 1 | 1 | 1 | - | - |
JESD-609代码 | - | e0 | e0 | e0 | - |
端子面层 | - | TIN LEAD | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn63Pb37) | - |
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