电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

74978-102013

产品描述High Speed / Modular Connectors METRAL 2000 SIGNAL HDR-STR. P. F. EXT. 8-ROW
产品类别连接器   
文件大小136KB,共18页
制造商FCI / Amphenol
下载文档 详细参数 全文预览

74978-102013概述

High Speed / Modular Connectors METRAL 2000 SIGNAL HDR-STR. P. F. EXT. 8-ROW

74978-102013规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
FCI / Amphenol
产品种类
Product Category
High Speed / Modular Connectors
产品
Product
Headers
位置数量
Number of Positions
96 Position
排数
Number of Rows
8 Row
节距
Pitch
2 mm
端接类型
Termination Style
Through Hole
系列
Packaging
Tube
外壳材料
Housing Material
Liquid Crystal Polymer (LCP)
安装角
Mounting Angle
Straight
触点材料
Contact Material
Copper Alloy
工厂包装数量
Factory Pack Quantity
360

文档预览

下载PDF文档
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-134
REVISION
Metral™ Standard Series – 8 Row
Metral™ 1000 Series – 8 Row
Metral™ 2000 Series – 8 Row
1 of 18
AUTHORIZED BY
DATE
G
10 JUN 14
S ALOSIUS
STATUS
UNRESTRICTED
TABLE OF CONTENTS
1.0
2.0
OBJECTIVE............................................................................................................................................... 3
SCOPE ...................................................................................................................................................... 3
3.0 GENERAL ................................................................................................................................................. 3
3.1.
Usage ................................................................................................................................................. 3
3.2.
Visual ................................................................................................................................................. 3
3.3.
Banded Substances ........................................................................................................................... 3
3.4.
Manufacturing Processability ............................................................................................................. 3
4.0 APPLICABLE DOCUMENTS ................................................................................................................... 4
4.1.
Standards and Specifications ............................................................................................................ 4
4.2.
FCI Documents .................................................................................................................................. 4
4.2.1.
Process Specifications ................................................................................................................... 4
4.2.2.
Standards and Test Specifications ................................................................................................ 5
4.3.
Lab Reports - Supporting Data .......................................................................................................... 5
5.0 REQUIREMENTS ...................................................................................................................................... 5
5.1.
Qualification ....................................................................................................................................... 5
5.2.
Material .............................................................................................................................................. 5
5.2.1.
Metallic Parts .................................................................................................................................. 5
5.2.2.
Plastic Parts ................................................................................................................................... 6
5.3.
Finish ................................................................................................................................................. 6
6.0 ELECTRICAL CHARACTERISTICS ........................................................................................................ 6
6.1.
Low Level Contact Resistance .......................................................................................................... 6
6.2.
Insulation Resistance......................................................................................................................... 7
6.3.
Dielectric Withstanding Voltage ......................................................................................................... 7
6.4.
Current Rating.................................................................................................................................... 7
6.5.
Capacitance ....................................................................................................................................... 7
6.6.
Inductance ......................................................................................................................................... 8
6.7.
Propagation Delay ............................................................................................................................. 8
6.8.
Characteristic Impedance .................................................................................................................. 8
6.9.
Crosstalk ............................................................................................................................................ 9
7.0 MECHANICAL CHARACTERISTICS ..................................................................................................... 10
7.1.
Mating/Unmating Force ................................................................................................................... 10
7.2.
Header Signal Compliant Pin Insertion/Retention Force ................................................................. 10
7.3.
Receptacle Signal Compliant Contact Insertion/Retention Force ................................................... 10
7.4.
PCB Hole Deformation Radius ........................................................................................................ 10
7.5.
PCB Hole Wall Damage .................................................................................................................. 10
Copyright FCI
Form E-3334
Rev E
PDS: Rev :G
STATUS:Released
GS-01-001
Printed: Jun 16, 2014
WinCE驱动开发过程求教
我的目的是通过写一个空的设备dll,再写个上层的简单程序来访问我的设备驱动dll,就是一个简单的HelloWorld,看看对于dll入口和接口十否设计对,注册设备、上层访问,这3步能否走通。 我用EV ......
heqingyun123456 嵌入式系统
tickget问题,欢迎大家回答,马上结贴。
(1)vxworks有一个 tickGet 函数可获取当前tick值,这个返回的是什么单位? SYS_CLK_RATE这个参数来设置1000,即系统时钟1秒发生1000次中断,两个时间差就是1ms,也就是1tick = 1ms. ......
chenjuntongxue 嵌入式系统
VS2005下能否开发WINCE4.2的应用程序???
RT~!` 如果能,具体应该怎样配置开发环境,新手,请讲的具体点,谢谢!!...
532250972 嵌入式系统
WaveScan技术分离DDR2的读写周期
WaveScan技术分离DDR2的读写周期...
安_然 测试/测量
MTK7688之OP路由器 IP修改
本帖最后由 wateras1 于 2018-3-5 17:02 编辑 MTK7688之OP路由器 IP修改 为啥要修改OP路由器的IP地 ......
wateras1 无线连接
DS18B20 Datasheet时序完全解读
本文章转自网络,本来想自己整理 但由于时间关系只能贴上原帖,这篇文章不错,教会大家如何看懂复杂难懂的datasheet 希望对大家有帮助 DS18B20时序 Author:exploer CIEE ,CAU 2008- ......
zl_felix Microchip MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1219  95  2833  2596  1645  51  14  50  53  46 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved