Bus Transceivers OCTAL BI-DIR TRANS
参数名称 | 属性值 |
Brand Name | Integrated Device Technology |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | QSOP |
包装说明 | QSOP-20 |
针数 | 20 |
制造商包装代码 | PCG20 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
Samacsys Confidence | 3 |
Samacsys Status | Released |
Samacsys PartID | 277353 |
Samacsys Pin Count | 20 |
Samacsys Part Category | Integrated Circuit |
Samacsys Package Category | Small Outline Packages |
Samacsys Footprint Name | PCG 20_- |
Samacsys Released Date | 2020-02-04 10:46:34 |
Is Samacsys | N |
其他特性 | WITH DIRECTION CONTROL |
控制类型 | COMMON CONTROL |
计数方向 | BIDIRECTIONAL |
系列 | FCT |
JESD-30 代码 | R-PDSO-G20 |
JESD-609代码 | e3 |
长度 | 8.65 mm |
逻辑集成电路类型 | BUS TRANSCEIVER |
最大I(ol) | 0.024 A |
湿度敏感等级 | 1 |
位数 | 8 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 20 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出特性 | 3-STATE WITH SERIES RESISTOR |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SSOP |
封装等效代码 | SSOP20,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
电源 | 3.3 V |
Prop。Delay @ Nom-Sup | 4.6 ns |
传播延迟(tpd) | 4.6 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed |
端子形式 | GULL WING |
端子节距 | 0.635 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
翻译 | N/A |
宽度 | 3.9116 mm |
Base Number Matches | 1 |
74FCT3245AQG8 | 74FCT3245QG8 | 74FCT3245APGG | 74FCT3245PGG8 | 74FCT3245AQG | |
---|---|---|---|---|---|
描述 | Bus Transceivers OCTAL BI-DIR TRANS | Bus Transceivers 8 BIT COMPARATOR | Bus Transceivers 8 BIT COMPARATOR | Bus Transceivers 8 BIT COMPARATOR | Bus Transceivers OCTAL BI-DIR TRANS |
Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | QSOP | QSOP | TSSOP | TSSOP | QSOP |
包装说明 | QSOP-20 | QSOP-20 | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25 | SSOP, SSOP20,.25 |
针数 | 20 | 20 | 20 | 20 | 20 |
制造商包装代码 | PCG20 | PCG20 | PGG20 | PGG20 | PCG20 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | DIRECTION CONTROL | WITH DIRECTION CONTROL |
控制类型 | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL |
计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
系列 | FCT | FCT | FCT | FCT | FCT |
JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 |
长度 | 8.65 mm | 8.65 mm | 6.5 mm | 6.5 mm | 8.6868 mm |
逻辑集成电路类型 | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER |
最大I(ol) | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
位数 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
输出特性 | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SSOP | SSOP | TSSOP | TSSOP | SSOP |
封装等效代码 | SSOP20,.25 | SSOP20,.25 | TSSOP20,.25 | TSSOP20,.25 | SSOP20,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Prop。Delay @ Nom-Sup | 4.6 ns | 7 ns | 4.6 ns | 7 ns | 4.6 ns |
传播延迟(tpd) | 4.6 ns | 7 ns | 4.6 ns | 7 ns | 4.6 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.75 mm | 1.75 mm | 1.2 mm | 1.2 mm | 1.7272 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.635 mm | 0.635 mm | 0.65 mm | 0.65 mm | 0.635 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED |
翻译 | N/A | N/A | N/A | N/A | N/A |
宽度 | 3.9116 mm | 3.9116 mm | 4.4 mm | 4.4 mm | 3.937 mm |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | - |
Base Number Matches | 1 | 1 | 1 | - | 1 |
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