NXP Semiconductors
Data Sheet: Technical Data
Document Number K70P256M150SF3
Rev. 7, 02/2018
Supports the following:
MK70FX512VMJ15,
MK70FN1M0VMJ15
Key features
• Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
• Performance
– Up to 150 MHz Arm® Cortex®-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
• Memories and memory interfaces
– Up to 1024 KB program flash memory on non-
FlexMemory devices
– Up to 512 KB program flash memory on
FlexMemory devices
– Up to 512 KB FlexNVM on FlexMemory devices
– 16 KB FlexRAM on FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
– DDR controller interface
– NAND flash controller interface
• Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
• System peripherals
– Multiple low-power modes to provide power
optimization based on application requirements
– Memory protection unit with multi-master
protection
– 32-channel DMA controller, supporting up to 128
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
• Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– Tamper detect and secure storage
– Hardware random-number generator
– Hardware encryption supporting DES, 3DES, AES,
MD5, SHA-1, and SHA-256 algorithms
– 128-bit unique identification (ID) number per chip
• Human-machine interface
– Graphic LCD controller
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
• Analog modules
– Four 16-bit SAR ADCs
– Programmable gain amplifier (PGA) (up to x64)
integrated into each ADC
– Two 12-bit DACs
– Four analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
– Voltage reference
• Timers
– Programmable delay block
– Two 8-channel motor control/general purpose/PWM
timers
– Two 2-channel quadrature decoder/general purpose
timers
– IEEE 1588 timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
K70 Sub-Family
K70P256M150SF3
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
Table of Contents
1 Ordering parts.......................................................................................5
1.1 Determining valid orderable parts............................................... 5
2 Part identification................................................................................. 5
2.1 Description...................................................................................5
2.2 Format.......................................................................................... 5
2.3 Fields............................................................................................5
2.4 Example....................................................................................... 6
3 Terminology and guidelines.................................................................6
3.1 Definitions................................................................................... 6
3.2 Examples......................................................................................6
3.3 Typical-value conditions..............................................................7
3.4 Relationship between ratings and operating requirements.......... 7
3.5 Guidelines for ratings and operating requirements......................8
4 Ratings..................................................................................................8
4.1 Thermal handling ratings............................................................. 8
4.2 Moisture handling ratings............................................................ 9
4.3 ESD handling ratings................................................................... 9
4.4 Voltage and current operating ratings..........................................9
5 General................................................................................................. 10
5.1 AC electrical characteristics........................................................ 10
5.2 Nonswitching electrical specifications........................................ 10
5.2.1
5.2.2
5.2.3
5.2.4
5.2.5
5.2.6
5.2.7
5.2.8
Voltage and current operating requirements............... 10
LVD and POR operating requirements....................... 12
Voltage and current operating behaviors.....................13
Power mode transition operating behaviors................ 16
Power consumption operating behaviors.....................17
EMC radiated emissions operating behaviors............. 20
Designing with radiated emissions in mind.................21
Capacitance attributes..................................................21
6.8.8
6.8.9
6.8.10
6.8.11
6.8.12
6.2 System modules........................................................................... 29
6.3 Clock modules............................................................................. 29
6.3.1
6.3.2
6.3.3
MCG specifications..................................................... 29
Oscillator electrical specifications...............................32
32 kHz oscillator electrical characteristics.................. 34
6.4 Memories and memory interfaces................................................34
6.4.1
6.4.2
6.4.3
6.4.4
6.4.5
Flash (FTFE) electrical specifications.........................34
EzPort switching specifications...................................39
NAND flash controller specifications......................... 40
DDR controller specifications..................................... 43
Flexbus switching specifications.................................46
6.5 Security and integrity modules.................................................... 48
6.5.1
DryIce Tamper Electrical Specifications.....................48
6.6 Analog..........................................................................................49
6.6.1
6.6.2
6.6.3
6.6.4
ADC electrical specifications...................................... 49
CMP and 6-bit DAC electrical specifications............. 56
12-bit DAC electrical characteristics...........................58
Voltage reference electrical specifications..................61
6.7 Timers.......................................................................................... 62
6.8 Communication interfaces........................................................... 62
6.8.1
6.8.2
6.8.3
6.8.4
6.8.5
6.8.6
6.8.7
Ethernet switching specifications................................ 62
USB electrical specifications.......................................65
USB DCD electrical specifications............................. 65
USB VREG electrical specifications...........................66
ULPI timing specifications..........................................66
CAN switching specifications..................................... 67
DSPI switching specifications (limited voltage
range)...........................................................................67
DSPI switching specifications (full voltage range)..... 69
Inter-Integrated Circuit Interface (I2C) timing............71
UART switching specifications...................................72
SDHC specifications................................................... 72
I2S/SAI switching specifications................................ 73
5.3 Switching specifications.............................................................. 21
5.3.1
5.3.2
Device clock specifications......................................... 21
General switching specifications.................................22
5.4 Thermal specifications................................................................. 24
5.4.1
5.4.2
Thermal operating requirements..................................24
Thermal attributes........................................................24
6.9 Human-machine interfaces (HMI)...............................................80
6.9.1
6.9.2
TSI electrical specifications........................................ 80
LCDC electrical specifications....................................81
5.5 Power sequencing........................................................................ 25
6 Peripheral operating requirements and behaviors................................ 25
6.1 Core modules............................................................................... 25
6.1.1
6.1.2
Debug trace timing specifications............................... 25
JTAG electricals.......................................................... 26
7 Dimensions...........................................................................................84
7.1 Obtaining package dimensions.................................................... 84
8 Pinout................................................................................................... 84
8.1 Pins with active pull control after reset....................................... 84
K70 Sub-Family, Rev. 7, 02/2018
NXP Semiconductors
3
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