Audio Amplifiers
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC28,.2SQ,20 |
| 针数 | 28 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| MAX9763ETI | MAX9762ETI-T | MAX9763ETI-T | MAX9761ETI+T | MAX9761ETI-T | MAX9760ETI | MAX9760ETI-T | MAX9763ETI+T | MAX9760ETI+T | MAX9762ETI+T | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Audio Amplifiers | Audio Amplifiers | Audio Amplifiers | Audio Amplifiers Integrated Circuits (ICs) | Audio Amplifiers | Audio Amplifiers | Audio Amplifiers | Audio Amplifiers Integrated Circuits (ICs) | Audio Amplifiers Integrated Circuits (ICs) | Audio Amplifiers Integrated Circuits (ICs) |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 | - | 符合 | - |
| 零件包装代码 | QFN | QFN | QFN | QFN | QFN | QFN | QFN | - | QFN | - |
| 包装说明 | HVQCCN, LCC28,.2SQ,20 | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, LCC28,.2SQ,20 | HVQCCN, | - | HVQCCN, | - |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | - | 28 | - |
| Reach Compliance Code | not_compliant | unknown | unknown | compliant | compliant | not_compliant | compliant | - | compliant | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | - |
| 标称带宽 | - | 22 kHz | 22 kHz | 22 kHz | 22 kHz | 22 kHz | 22 kHz | - | 22 kHz | - |
| 商用集成电路类型 | - | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | - | AUDIO AMPLIFIER | - |
| JESD-30 代码 | - | S-XQCC-N28 | S-XQCC-N28 | S-XQCC-N28 | S-XQCC-N28 | S-XQCC-N28 | S-XQCC-N28 | - | S-XQCC-N28 | - |
| 长度 | - | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm | - | 5 mm | - |
| 信道数量 | - | 2 | 2 | 2 | 2 | 2 | 2 | - | 2 | - |
| 功能数量 | - | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 | - |
| 端子数量 | - | 28 | 28 | 28 | 28 | 28 | 28 | - | 28 | - |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - | 85 °C | - |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | - |
| 标称输出功率 | - | 3 W | 3 W | 3 W | 3 W | 3 W | 3 W | - | 3 W | - |
| 封装主体材料 | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED | - |
| 封装代码 | - | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | - | HVQCCN | - |
| 封装形状 | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | - | SQUARE | - |
| 封装形式 | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | 260 | 245 | 245 | 245 | - | 260 | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - |
| 座面最大高度 | - | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | - | 0.8 mm | - |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | - |
| 最小供电电压 (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | - |
| 表面贴装 | - | YES | YES | YES | YES | YES | YES | - | YES | - |
| 技术 | - | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | - | BICMOS | - |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | - |
| 端子形式 | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | - | NO LEAD | - |
| 端子节距 | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | - | 0.5 mm | - |
| 端子位置 | - | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | - | QUAD | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
| 宽度 | - | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm | - | 5 mm | - |
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