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74HC137D,653: 产品描述Encoders, Decoders, Multiplexers & Demultiplexers 3 TO 8 LINE DECODER/DEMUX; 产品类别逻辑逻辑; 文件大小793KB，共19页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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74HC137D,653概述

Encoders, Decoders, Multiplexers & Demultiplexers 3 TO 8 LINE DECODER/DEMUX

74HC137D,653规格参数

参数名称	属性值
Brand Name	NXP Semiconductor
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	SOP
包装说明	3.90 MM, PLASTIC, MS-012, SOT-109-1, SOP-16
针数	16
制造商包装代码	SOT109-1
Reach Compliance Code	compliant
其他特性	ADDRESS LATCHES
系列	HC/UH
输入调节	LATCHED
JESD-30 代码	R-PDSO-G16
JESD-609代码	e4
长度	9.9 mm
负载电容（CL）	50 pF
逻辑集成电路类型	OTHER DECODER/DRIVER
最大I（ol）	0.004 A
湿度敏感等级	1
功能数量	1
端子数量	16
最高工作温度	125 °C
最低工作温度	-40 °C
输出极性	INVERTED
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP16,.25
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
包装方法	TAPE AND REEL
峰值回流温度（摄氏度）	260
电源	2/6 V
Prop。Delay @ Nom-Sup	48 ns
传播延迟（tpd）	285 ns
认证状态	Not Qualified
座面最大高度	1.75 mm
最大供电电压 (Vsup)	6 V
最小供电电压 (Vsup)	2 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子面层	NICKEL PALLADIUM GOLD
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	30
宽度	3.9 mm
Base Number Matches	1

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74HC137

3-to-8 line decoder, demultiplexer with address latches;

inverting

Rev. 4 — 23 December 2015

Product data sheet

1. General description

The 74HC137 is a high-speed Si-gate CMOS device and is pin compatible with low power

Schottky TTL (LSTTL). The 74HC137 is specified in compliance with JEDEC

standard no. 7A.

The 74HC137 is a 3-to-8 line decoder, demultiplexer with latches at the three address

inputs (An). The 74HC137 essentially combines the 3-to-8 decoder function with a 3-bit

storage latch. When the latch is enabled (LE = LOW), the 74HC137 acts as a 3-to-8 active

LOW decoder. When the latch enable (LE) goes from LOW-to-HIGH, the last data present

at the inputs before this transition, is stored in the latches. Further address changes are

ignored as long as LE remains HIGH.

The output enable input (E1 and E2) controls the state of the outputs independent of the

address inputs or latch operation. All outputs are HIGH unless E1 is LOW and E2 is HIGH.

The 74HC137 is ideally suited for implementing non-overlapping decoders in 3-state

systems and strobed (stored address) applications in bus oriented systems.

2. Features and benefits



Combines 3-to-8 decoder with 3-bit latch

Multiple input enable for easy expansion or independent controls

Active LOW mutually exclusive outputs

Low-power dissipation

Complies with JEDEC standard no. 7A

ESD protection:



HBM JESD22-A114F exceeds 2000 V



MM JESD22-A115-A exceeds 200 V



Specified from

40 C

to +80

C

and from

40 C

to +125

C.

3. Ordering information

Table 1.

Ordering information

Package

Temperature range

74HC137D

74HC137DB

40 C

to +125

C

40 C

to +125

C

Name

SO16

SSOP16

Description

plastic small outline package; 16 leads;

body width 3.9 mm

plastic shrink small outline package; 16 leads;

body width 5.3 mm

Version

SOT109-1

SOT338-1

Type number

74HC137D,653相似产品对比

	74HC137D,653	74HC137DB,118	74HC137DB,112
描述	Encoders, Decoders, Multiplexers & Demultiplexers 3 TO 8 LINE DECODER/DEMUX	Encoders, Decoders, Multiplexers & Demultiplexers 3 TO 8 LINE DECODER	Encoders, Decoders, Multiplexers & Demultiplexers 3 TO 8 LINE DECODER
Brand Name	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor
是否Rohs认证	符合	符合	符合
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)
零件包装代码	SOP	SSOP1	SSOP1
包装说明	3.90 MM, PLASTIC, MS-012, SOT-109-1, SOP-16	5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16	5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16
针数	16	16	16
制造商包装代码	SOT109-1	SOT338-1	SOT338-1
Reach Compliance Code	compliant	unknown	compliant
其他特性	ADDRESS LATCHES	ADDRESS LATCHES	ADDRESS LATCHES
系列	HC/UH	HC/UH	HC/UH
输入调节	LATCHED	LATCHED	LATCHED
JESD-30 代码	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16
JESD-609代码	e4	e4	e4
长度	9.9 mm	6.2 mm	6.2 mm
负载电容（CL）	50 pF	50 pF	50 pF
逻辑集成电路类型	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER
湿度敏感等级	1	1	1
功能数量	1	1	1
端子数量	16	16	16
最高工作温度	125 °C	125 °C	125 °C
最低工作温度	-40 °C	-40 °C	-40 °C
输出极性	INVERTED	INVERTED	INVERTED
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	SSOP	SSOP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH
峰值回流温度（摄氏度）	260	260	260
传播延迟（tpd）	285 ns	285 ns	285 ns
认证状态	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.75 mm	2 mm	2 mm
最大供电电压 (Vsup)	6 V	6 V	6 V
最小供电电压 (Vsup)	2 V	2 V	2 V
标称供电电压 (Vsup)	5 V	5 V	5 V
表面贴装	YES	YES	YES
技术	CMOS	CMOS	CMOS
温度等级	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
端子面层	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD
端子形式	GULL WING	GULL WING	GULL WING
端子节距	1.27 mm	0.65 mm	0.65 mm
端子位置	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	30	30	30
宽度	3.9 mm	5.3 mm	5.3 mm
Base Number Matches	1	1	1
最大I（ol）	0.004 A	-	0.004 A
封装等效代码	SOP16,.25	-	SSOP16,.3
电源	2/6 V	-	2/6 V
Prop。Delay @ Nom-Sup	48 ns	-	54 ns

74HC137D,653

74HC137D,653概述

74HC137D,653规格参数

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