256K x 36 9Mb Sync Burst SRAM
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | GSI Technology |
| 零件包装代码 | QFP |
| 包装说明 | LQFP, |
| 针数 | 100 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A991.B.2.B |
| 最长访问时间 | 2.5 ns |
| 其他特性 | PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY |
| JESD-30 代码 | R-PQFP-G100 |
| JESD-609代码 | e3 |
| 长度 | 20 mm |
| 内存密度 | 9437184 bit |
| 内存集成电路类型 | CACHE SRAM |
| 内存宽度 | 36 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 100 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX36 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LQFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.6 mm |
| 最大供电电压 (Vsup) | 2 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 14 mm |
| GS88037BGT-200V | GS88037BT-200V | GS88037BT-250IV | GS88037BT-250V | GS88037BT-V | GS88037BT-200IV | GS88037BGT-250V | GS88037BGT-250IV | GS88037BGT-200IV | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 256K x 36 9Mb Sync Burst SRAM | 256K x 36 9Mb Sync Burst SRAM | 256K x 36 9Mb Sync Burst SRAM | 256K x 36 9Mb Sync Burst SRAM | 256K x 36 9Mb Sync Burst SRAM | 256K x 36 9Mb Sync Burst SRAM | 256K x 36 9Mb Sync Burst SRAM | 256K x 36 9Mb Sync Burst SRAM | 256K x 36 9Mb Sync Burst SRAM |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 符合 | 符合 | 符合 |
| 厂商名称 | GSI Technology | GSI Technology | GSI Technology | GSI Technology | - | GSI Technology | GSI Technology | GSI Technology | GSI Technology |
| 零件包装代码 | QFP | QFP | QFP | QFP | - | QFP | QFP | QFP | QFP |
| 包装说明 | LQFP, | LQFP, | LQFP, | LQFP, | - | LQFP, | LQFP, | LQFP, | LQFP, |
| 针数 | 100 | 100 | 100 | 100 | - | 100 | 100 | 100 | 100 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | - | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | - | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
| 最长访问时间 | 2.5 ns | 2.5 ns | 2.5 ns | 2.5 ns | - | 2.5 ns | 2.5 ns | 2.5 ns | 2.5 ns |
| 其他特性 | PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | - | PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY |
| JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | - | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
| 长度 | 20 mm | 20 mm | 20 mm | 20 mm | - | 20 mm | 20 mm | 20 mm | 20 mm |
| 内存密度 | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | - | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit |
| 内存集成电路类型 | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | - | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
| 内存宽度 | 36 | 36 | 36 | 36 | - | 36 | 36 | 36 | 36 |
| 功能数量 | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 端子数量 | 100 | 100 | 100 | 100 | - | 100 | 100 | 100 | 100 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | - | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | - | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 70 °C | - | 85 °C | 70 °C | 85 °C | 85 °C |
| 组织 | 256KX36 | 256KX36 | 256KX36 | 256KX36 | - | 256KX36 | 256KX36 | 256KX36 | 256KX36 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LQFP | LQFP | LQFP | LQFP | - | LQFP | LQFP | LQFP | LQFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | - | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | - | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| 最大供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | - | 2 V | 2 V | 2 V | 2 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | - | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | - | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | - | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | - | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | - | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | - | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 14 mm | 14 mm | 14 mm | 14 mm | - | 14 mm | 14 mm | 14 mm | 14 mm |
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