电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

WBC-R0202AS-01-1472-G

产品描述Resistor Networks & Arrays
产品类别无源元件   
文件大小351KB,共3页
制造商TT Electronics
下载文档 详细参数 全文预览

WBC-R0202AS-01-1472-G在线购买

供应商 器件名称 价格 最低购买 库存  
WBC-R0202AS-01-1472-G - - 点击查看 点击购买

WBC-R0202AS-01-1472-G概述

Resistor Networks & Arrays

WBC-R0202AS-01-1472-G规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
TT Electronics
产品种类
Product Category
Resistor Networks & Arrays

文档预览

下载PDF文档
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
灌水
上个论坛想下点东西,多发了几个帖子,居然收到提示:对不起,您两次发表时间间隔不超过30秒,请不要灌水!感到很受伤~ 其实帖子还是扫过滴,虽然目的不是很纯,但也经过思考了啊~ 转回eewo ......
Melinda123 聊聊、笑笑、闹闹
EVC编程出现LINK 错误 我不能解决 希望有高人能帮我看看 谢谢了。。
error LNK2019: unresolved external symbol "int __cdecl registerwnd(struct HINSTANCE__ *)" (?registerwnd@@YAHPAUHINSTANCE__@@@Z) referenced in function WinMain ARMV4Rel/ ......
cd001 嵌入式系统
PCBA 贴片加工工艺是怎样的?
1.根据客户Gerber文件及BOM单,制作SMT生产的工艺文件,生成SMT坐标文件2.盘点全部生产物料是否备齐,制作齐套单,并确认生产的PMC计划3.进行SMT编程,并制作首板进行核对,确保无误4.根据SMT工 ......
草房子的新生 PCB设计
在windows mobile下写输入法,那位大哥能给点资料?
在windows mobile下写输入法,那位大哥能给点资料? SIP IME输入法都可以,还想问下大家,sip能切换ime输入法吗?...
nwf1987 嵌入式系统
大神们帮忙分析一下这个TL431的具体工作方式
大神们帮忙分析一下这个TL431的具体工作方式 还想请教,电路中的光耦在反馈过程中,是工作于开关状态还是工作于线性状态? 虽然开关电源调通了,但是这个TL431反馈的问题还是不明白,说实话 ......
Knight97538 电源技术
8259A芯片中有那些寄存器?各寄存器有什么作用?
8259A芯片中有寄存器总数有多少?各寄存器名称和作用?...
rayqin 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 7  2122  533  2761  2153  7  20  40  52  58 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved