电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

46KI3820CKP0M

产品描述Film Capacitor,
产品类别无源元件    电容器   
文件大小277KB,共2页
制造商KEMET(基美)
官网地址http://www.kemet.com
标准
下载文档 详细参数 全文预览

46KI3820CKP0M在线购买

供应商 器件名称 价格 最低购买 库存  
46KI3820CKP0M - - 点击查看 点击购买

46KI3820CKP0M概述

Film Capacitor,

46KI3820CKP0M规格参数

参数名称属性值
是否Rohs认证符合
Objectid1969948362
包装说明RADIAL LEADED
Reach Compliance Codecompliant
ECCN代码EAR99
YTEOL7.1
其他特性CLASS X2
电容0.82 µF
电容器类型FILM CAPACITOR
介电材料POLYPROPYLENE
高度19 mm
JESD-609代码e3
长度18 mm
安装特点THROUGH HOLE MOUNT
负容差20%
端子数量2
最高工作温度110 °C
最低工作温度-40 °C
封装形状RECTANGULAR PACKAGE
封装形式Radial
包装方法TR, 20 INCH
正容差20%
额定(AC)电压(URac)275 V
额定(直流)电压(URdc)560 V
参考标准CQC; CUL; ENEC; UL
表面贴装NO
端子面层Tin (Sn)
端子节距15 mm
端子形状WIRE
宽度11 mm

文档预览

下载PDF文档
Loose
Fig.1
Taped
Fig.2
meTAllized PolYPRoPYlene Film CAPACiToR
SELF-HEALING PRoPERTIES
Typical applications:
This special R46 release is designed
for applications in series with the main
.
PRoDUCT CoDE:
R46
X2 CLASS (IEC 60384-14) - MKP Series
R.46 S
VeRSion
Not for new design.
Not for use in series with the mains.
See www.kemet.com for more information.
Pitch Box thickness (B)
(mm)
(mm)
Ø d ±0.05
p
≤15
0.6 or 0.8*
22.5
p
27.5
0.8
p = 37.5
1.0
10.0
15.0
15.0
22.5
27.5
37.5
All
<7.5
≥7.5
All
All
All
Maximum dimensions (mm)
B max
H max
L max
B +0.2
B +0.2
B +0.2
B +0.2
B +0.2
B +0.3
H +0.1
H +0.1
H +0.1
H +0.1
H +0.1
H +0.1
L +0.2
L +0.3
L +0.5
L +0.3
L +0.3
L +0.3
*See size table.
All dimensions are in mm.
GeneRAl TeCHniCAl dATA
dielectric:
polypropylene film.
Plates:
metal layer deposited by evaporation under vacuum.
Winding:
non-inductive type.
leads:
tinned wire.
Protection:
plastic case, thermosetting resin filled.
Box material is solvent resistant and flame retardant according to
UL94 V0.
marking:
Manufacturer’s logo, series, capacitance, tolerance,
rated voltage, capacitor class, dielectric code, climatic category,
passive flammability category, manufacturing date code, approvals,
manufacturing plant.
Climatic category:
40/110/56 IEC 60068-1
TeST meTHod And PeRFoRmAnCe
damp heat, steady state:
Test conditions 1st
Temperature:
+40°C
±
2°C
Relative humidity (RH): 93%
±
2%
Test duration:
56 days
Test conditions 2nd
Temperature:
+60°C
±
2°C
Relative humidity (RH): 95%
±
2%
Test duration:
500 hours
Test conditions 3rd
operating temperature range:
-40 to +110°C
Related documents:
IEC 60384-14, EN 60384-14.
eleCTRiCAl CHARACTeRiSTiCS
Rated voltage (V
R
):
Capacitance range:
275Vac (50/60Hz) / 560 Vdc
0.022
µ
F to 10
µ
F
Temperature:
+40°C
±
2°C
Relative humidity (RH): 93%
±
2%
Test duration:
500 hours
Voltage value:
230 Vac, 50 Hz
Performance
Capacitance values:
E6 series (IEC 60063 Norm).
Capacitance tolerances
(measured at 1 kHz):
±
10% (K);
±
20% (M).
tolerance
±
5% (J) available upon request
dissipation factor (dF):
tg
δ
10
-4
at +25°C
±
5°C:
15 (8)* at 1kHz
* Typical value
insulation resistance:
Temperature:
Voltage charge time:
Voltage charge:
Performance
1x10
5
M
(5x10
5
M
)
*
30000 s (150000 s
)
*
Test conditions
no dielectric breakdown or
flashover at 4.3 x V
R
(d.c.)/1 min
Capacitance change |
C/C|:
5%
Insulation resistance:
50% of initial limit.
endurance:
Test conditions
Dielectric strength:
Temperature:
Test duration:
Voltage applied:
Performance
+110°C
±
2°C
1000 h
1.25 x V
R
+1000Vac 0.1 s/h
+25°C
±
5°C
1 min
100 Vdc
for C
0.33
µ
F
for C
>
0.33
µ
F
no dielectric breakdown or
flashover at 4.3 x V
R
(d.c.)/1 min
Capacitance change |
C/C|:
10%
Insulation resistance:
50% of initial limit.
Resistance to soldering heat:
Test conditions
Dielectric strength:
* Typical value
Solder bath temperature: +260°C
±
5°C
Dipping time (with heat screen):10 s
±
1 s
Performance
Test voltage between terminations
(on all pieces):
1500Vac for 1 s + 2200Vdc for 1 s at +25°C
±
5°C
Capacitance change |
C/C|:
2%
155
09/2008
请教:在掌握51的基础上,进一步提高是学习ARM呢还是DSP好点呢?学习他们有什么分别?
我想请教大家,现在我对51有一定掌握了,想进一步提高一下,DSP和ARM学习那个好点呢?他们的应用前景怎样?学习起来难易程度又如何?我本人偏向DSP,DSP算法是 精髓,有的研究。这只是我个人看法 ......
djg0820 DSP 与 ARM 处理器
【新思科技IP资源】汽车网络安全始于芯片和 IP
简介 汽车行业正在经历重大转型。随着连接性的提升和对更多功能的支持,汽车变得日益复杂且价值越来越高,可提供更出色的用户体验。与此同时,汽车收集和传输的敏感数据也越来越多,因此成为极 ......
arui1999 综合技术交流
请问现在用的比较普遍的板载网口控制芯片型号?
请问哪位知道现在用的比较普遍的板载网口控制芯片型号?开发比较方便的? 想用在局部以太网数据传输的,利用以太网接口实现主机和系统之间的数据传输 本帖最后由 open82977352 于 2011-3-7 ......
open82977352 模拟电子
从设计到上市——5G终端这场接力赛一共需要几棒?
5G 好比一场接力赛,从终端设计研发、一致性测试、运营商验收测试(CAT)到生产制造,四个环节紧密衔接。终端公司只有顺利完成四棒接力,才能赢得快速增长的5G终端商用蓝海市场。 490927 ......
eric_wang 无线连接
哪个大神做E题啊,交流一下啊!!!!!!!!!!
本帖最后由 paulhyde 于 2014-9-15 03:06 编辑 谢谢了 ...
涛家柒柒 电子竞赛
【LPC54100】+ 串口打印
今天花了些时间看了串口的例程,于是我就花了些时间参考例程用库写了个串口发送的例程。要使用串口时,我要走以下步奏:(1)首先打开管脚的复用功能,把管脚配置成串口功能。 /*Setup ......
强仔00001 NXP MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 265  2084  2119  1684  205  21  7  27  18  43 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved