TELECOM, DIGITAL TIME SWITCH, PQFP100
参数名称 | 属性值 |
功能数量 | 1 |
端子数量 | 100 |
最大工作温度 | 85 Cel |
最小工作温度 | -40 Cel |
额定供电电压 | 5 V |
加工封装描述 | 14 X 20 MM, 2.80 MM HEIGHT, LEAD FREE, MO-112CC-1, MQFP-100 |
无铅 | Yes |
欧盟RoHS规范 | Yes |
状态 | ACTIVE |
工艺 | CMOS |
包装形状 | RECTANGULAR |
包装尺寸 | FLATPACK |
表面贴装 | Yes |
端子形式 | GULL WING |
端子间距 | 0.6500 mm |
端子涂层 | MATTE TIN |
端子位置 | QUAD |
包装材料 | PLASTIC/EPOXY |
温度等级 | INDUSTRIAL |
通信类型 | DIGITAL TIME SWITCH |
MT90820 | MT90820AL1 | MT90820AL | MT90820APR1 | MT90820APR | MT90820AP | MT90820AP1 | |
---|---|---|---|---|---|---|---|
描述 | TELECOM, DIGITAL TIME SWITCH, PQFP100 | TELECOM, DIGITAL TIME SWITCH, PQFP100 | TELECOM, DIGITAL TIME SWITCH, PQFP100 | TELECOM, DIGITAL TIME SWITCH, PQFP100 | TELECOM, DIGITAL TIME SWITCH, PQFP100 | TELECOM, DIGITAL TIME SWITCH, PQFP100 | TELECOM, DIGITAL TIME SWITCH, PQFP100 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 100 | 100 | 100 | 84 | 84 | 84 | 84 |
表面贴装 | Yes | YES | YES | YES | YES | YES | YES |
端子形式 | GULL WING | GULL WING | GULL WING | J BEND | J BEND | J BEND | J BEND |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
是否Rohs认证 | - | 符合 | 不符合 | 符合 | 不符合 | 不符合 | 符合 |
厂商名称 | - | Zarlink Semiconductor (Microsemi) | - | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) |
包装说明 | - | QFP, | QFP, QFP100,.7X.9 | QCCJ, | QCCJ, LDCC84,1.2SQ | QCCJ, LDCC84,1.2SQ | QCCJ, |
Reach Compliance Code | - | compli | compli | compli | compli | compli | compli |
JESD-30 代码 | - | R-PQFP-G100 | R-PQFP-G100 | S-PQCC-J84 | S-PQCC-J84 | S-PQCC-J84 | S-PQCC-J84 |
长度 | - | 20 mm | 20 mm | 29.31 mm | 29.31 mm | 29.31 mm | 29.31 mm |
最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | QFP | QFP | QCCJ | QCCJ | QCCJ | QCCJ |
封装形状 | - | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | - | FLATPACK | FLATPACK | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
峰值回流温度(摄氏度) | - | NOT SPECIFIED | 225 | 260 | 225 | 225 | NOT SPECIFIED |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | 3.4 mm | 3.4 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm |
标称供电电压 | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
电信集成电路类型 | - | DIGITAL TIME SWITCH | DIGITAL TIME SWITCH | DIGITAL TIME SWITCH | DIGITAL TIME SWITCH | DIGITAL TIME SWITCH | DIGITAL TIME SWITCH |
端子节距 | - | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | 30 | 30 | 30 | 30 | NOT SPECIFIED |
宽度 | - | 14 mm | 14 mm | 29.31 mm | 29.31 mm | 29.31 mm | 29.31 mm |
JESD-609代码 | - | - | e0 | e3 | e0 | e0 | - |
湿度敏感等级 | - | - | 3 | 3 | 3 | 3 | - |
端子面层 | - | - | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
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