Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> MK22FN256VLH12

MK22FN256VLH12: 产品描述ARM Microcontrollers - MCU MK22FN256VLH12/QFP64///STANDARD MARKING * TRAY DRY; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小1MB，共76页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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MK22FN256VLH12概述

ARM Microcontrollers - MCU MK22FN256VLH12/QFP64///STANDARD MARKING * TRAY DRY

MK22FN256VLH12规格参数

参数名称	属性值
Brand Name	Freescale
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
包装说明	10 X 10 MM, 1.60 MM HEIGHT, LQFP-64
Reach Compliance Code	compliant
ECCN代码	3A991.A.2
具有ADC	YES
地址总线宽度
最大时钟频率	50 MHz
DAC 通道	YES
DMA 通道	YES
外部数据总线宽度
JESD-30 代码	S-PQFP-G64
JESD-609代码	e3
长度	10 mm
湿度敏感等级	3
I/O 线路数量	40
端子数量	64
最高工作温度	105 °C
最低工作温度	-40 °C
PWM 通道	YES
封装主体材料	PLASTIC/EPOXY
封装代码	FQFP
封装形状	SQUARE
封装形式	FLATPACK, FINE PITCH
峰值回流温度（摄氏度）	260
ROM（单词）	262144
ROM可编程性	FLASH
速度	120 MHz
最大供电电压	3.6 V
最小供电电压	1.71 V
标称供电电压	3.3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	MATTE TIN
端子形式	GULL WING
端子节距	0.5 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	40
宽度	10 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC

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NXP Semiconductors

Data Sheet: Technical Data

K22P121M120SF8

Rev. 7, 08/2016

Kinetis K22F 256 KB Flash

120 MHz ARM® Cortex®-M4-Based Microcontroller with FPU

The Kinetis K22 product family members are optimized for cost-

sensitive applications requiring low-power, USB connectivity,

high peripheral integration and processing efficiency with floating

point unit. These devices share the comprehensive enablement

and scalability of the Kinetis family.

This product offers:

• Run power consumption down to 153 µA/MHz and static

power consumption down to 2.6 µA with full state retention

and 6 µs wakeup. Lowest static mode down to 120 nA

• USB LS/FS OTG 2.0 with embedded 3.3 V, 120 mA LDO

voltage regulator. USB FS device crystal-less functionality.

MK22FN256VDC12

MK22FN256VLL12

MK22FN256VMP12

MK22FN256VLH12

121 XFBGA (DC)

8 x 8 x 0.5 Pitch 0.65

100 LQFP (LL)

14 x 14 x 1.4 Pitch 0.5

64 MAPBGA (MP)

5 x 5 x 1.2 Pitch 0.5

64 LQFP (LH)

10 x 10 x 1.4 Pitch 0.5

Performance

• 120 MHz ARM Cortex-M4 core with DSP instructions

delivering 1.25 Dhrystone MIPS per MHz

Memories and memory interfaces

• 256 KB of embedded flash and 48 KB of RAM

• Serial programming interface (EzPort)

• Preprogrammed Kinetis flashloader for one-time, in-

system factory programming

System peripherals

• Flexible low-power modes, multiple wake up sources

• 16-channel DMA controller

• Independent external and software watchdog monitor

Analog modules

• Two 16-bit SAR ADCs (1.2 MS/s in 12bit mode)

• One 12-bit DAC

• Two analog comparators (CMP) with 6- bit DAC

• Accurate internal voltage reference

Communication interfaces

• USB LS/FS OTG 2.0 with on-chip transceiver and

USB LDO voltage regulator

• USB full-speed device crystal-less operation

• Two SPI modules

• Three UART modules and one low-power UART

• Two I2C modules: Support for up to 1 Mbps

operation

• I2S module

Clocks

• Two crystal oscillators: 32 kHz (RTC) and 32-40 kHz or

Timers

3-32 MHz

• One 8-channel general purpose/ PWM timer

• Three internal oscillators: 32 kHz, 4 MHz, and 48 MHz

• Two 2-channel general purpose timers with

• Multi-purpose clock generator with PLL and FLL

quadrature decoder functionality

• Periodic interrupt timers

Security and integrity modules

• 16-bit low-power timer

• Hardware CRC module

• Real-time clock with independent power domain

• 128-bit unique identification (ID) number per chip

• Programmable delay block

• Hardware random-number generator

• Flash access control to protect proprietary software

Operating Characteristics

• Voltage range (including flash writes): 1.71 to 3.6 V

Human-machine interface

• Temperature range (ambient): -40 to 105°C

• Up to 70 general-purpose I/O (GPIO)

NXP reserves the right to change the production detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ratings.................................................................................... 5

1.1 Thermal handling ratings................................................. 5

1.2 Moisture handling ratings................................................ 5

1.3 ESD handling ratings....................................................... 5

1.4 Voltage and current operating ratings............................. 5

2 General................................................................................... 6

2.1 AC electrical characteristics.............................................6

2.2 Nonswitching electrical specifications..............................6

2.2.1 Voltage and current operating requirements....... 6

2.2.2 LVD and POR operating requirements................7

2.2.3 Voltage and current operating behaviors.............8

2.2.4 Power mode transition operating behaviors........ 9

2.2.5 Power consumption operating behaviors............ 10

2.2.6 EMC radiated emissions operating behaviors..... 17

2.2.7 Designing with radiated emissions in mind..........18

2.2.8 Capacitance attributes.........................................18

2.3 Switching specifications...................................................18

2.3.1 Device clock specifications..................................18

2.3.2 General switching specifications......................... 19

2.4 Thermal specifications..................................................... 20

2.4.1 Thermal operating requirements......................... 20

2.4.2 Thermal attributes................................................20

3 Peripheral operating requirements and behaviors.................. 21

3.1 Core modules.................................................................. 21

3.1.1 SWD electricals .................................................. 21

3.1.2 JTAG electricals.................................................. 22

3.2 System modules.............................................................. 25

3.3 Clock modules................................................................. 25

3.3.1 MCG specifications..............................................25

3.3.2 IRC48M specifications.........................................28

3.3.3 Oscillator electrical specifications........................28

3.3.4 32 kHz oscillator electrical characteristics........... 31

3.4 Memories and memory interfaces................................... 31

3.4.1 Flash electrical specifications.............................. 31

3.4.2 EzPort switching specifications........................... 33

3.5 Security and integrity modules........................................ 34

3.6 Analog............................................................................. 34

3.6.1

3.6.2

3.6.3

ADC electrical specifications............................... 34

CMP and 6-bit DAC electrical specifications....... 38

12-bit DAC electrical characteristics....................41

3.6.4 Voltage reference electrical specifications.......... 44

3.7 Timers..............................................................................45

3.8 Communication interfaces............................................... 45

3.8.1

3.8.2

3.8.3

3.8.4

USB electrical specifications............................... 46

USB VREG electrical specifications.................... 46

DSPI switching specifications (limited voltage

range).................................................................. 47

DSPI switching specifications (full voltage

range).................................................................. 49

3.8.5 Inter-Integrated Circuit Interface (I2C) timing...... 50

3.8.6 UART switching specifications............................ 52

3.8.7 I2S/SAI switching specifications.......................... 52

4 Dimensions............................................................................. 58

4.1 Obtaining package dimensions....................................... 58

5 Pinout...................................................................................... 59

5.1 K22F Signal Multiplexing and Pin Assignments.............. 59

5.2 Recommended connection for unused analog and

digital pins........................................................................64

5.3 K22F Pinouts................................................................... 65

6 Part identification.....................................................................69

6.1 Description.......................................................................69

6.2 Format............................................................................. 69

6.3 Fields............................................................................... 70

6.4 Example...........................................................................70

6.5 121-pin XFBGA part marking.......................................... 71

6.6 64-pin MAPBGA part marking......................................... 71

7 Terminology and guidelines.................................................... 71

7.1 Definitions........................................................................ 71

7.2 Examples......................................................................... 72

7.3 Typical-value conditions.................................................. 72

7.4 Relationship between ratings and operating

requirements....................................................................73

7.5 Guidelines for ratings and operating requirements..........73

8 Revision History...................................................................... 73