Battery Management FUEL GAUGE
| 参数名称 | 属性值 |
| Brand Name | ON Semiconductor |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ON Semiconductor(安森美) |
| 包装说明 | WDFN-8 |
| 制造商包装代码 | 509AF |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 16 weeks |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-N8 |
| 长度 | 4 mm |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVSON |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 座面最大高度 | 0.8 mm |
| 最大供电电压 (Vsup) | 4.5 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 标称供电电压 (Vsup) | 3.6 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3 mm |
| LC709203FQH-03TWG | LC709203FXE-02MH | LC709203FQH-02TWG | LC709203FQH-01-GEVB | LC709203FXE-04MH | LC709203FQH-04TWG | |
|---|---|---|---|---|---|---|
| 描述 | Battery Management FUEL GAUGE | Battery Management FUEL GAUGE | Battery Management FUEL GAUGE | Power Management IC Development Tools Eval Bd for LC709203FQH | Battery Management FUEL GAUGE | Battery Management FUEL GAUGE |
| Brand Name | ON Semiconductor | ON Semiconductor | ON Semiconductor | - | ON Semiconductor | ON Semiconductor |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | - | 符合 | - |
| 厂商名称 | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | - | ON Semiconductor(安森美) | - |
| 包装说明 | WDFN-8 | WLCSP-9 | WDFN-8 | - | WLCSP-9 | WDFN-8 |
| 制造商包装代码 | 509AF | 567JH | 509AF | - | 567JH | 509AF |
| Reach Compliance Code | compliant | compliant | compliant | - | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 |
| Factory Lead Time | 16 weeks | 6 weeks | 38 weeks | - | 9 weeks | 7 weeks |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-N8 | R-PBGA-B9 | R-PDSO-N8 | - | R-PBGA-B9 | R-PDSO-N8 |
| 长度 | 4 mm | 1.76 mm | 4 mm | - | 1.76 mm | 4 mm |
| 信道数量 | 1 | 1 | 1 | - | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | - | 1 | 1 |
| 端子数量 | 8 | 9 | 8 | - | 9 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSON | VFBGA | HVSON | - | VFBGA | HVSON |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 座面最大高度 | 0.8 mm | 0.51 mm | 0.8 mm | - | 0.51 mm | 0.8 mm |
| 最大供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V |
| 最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | - | 2.5 V | 2.5 V |
| 标称供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V |
| 表面贴装 | YES | YES | YES | - | YES | YES |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | BALL | NO LEAD | - | BALL | NO LEAD |
| 端子节距 | 0.65 mm | 0.5 mm | 0.65 mm | - | 0.5 mm | 0.65 mm |
| 端子位置 | DUAL | BOTTOM | DUAL | - | BOTTOM | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3 mm | 1.6 mm | 3 mm | - | 1.6 mm | 3 mm |
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