Pb
HD01 – HD06
0.8A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER
Features and Benefits
Glass Passivated Die Construction
Low Forward Voltage Drop
Surge Overload Rating to 30A Peak
Ideally Suited for Automated Assembly
Miniature Package Saves Space on PC Boards
UL Listed Under Recognized Component Index, File Number
E94661
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Mechanical Data
Case: MiniDIP
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish
Tin. Plated Leads, Solderable per MIL-STD-
202, Method 208
Polarity: As Marked on Case
Marking: Product Type Marking Code, Date Code & Polarity
Markings
Weight: 0.125 grams (Approximate)
Equivalent Circuit
Ordering Information
(Note 3)
Part Number*
HDxx-T
Packaging
MiniDIP
Shipping
3k/Tape & Reel, 13-inch
*xx = Device type, e.g. HD02-T or HD04-T, etc.
Notes:
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.
Marking Information
YM
HDxx
HDxx = Product Type Marking Code (ex: HD04)
YM = Date Code Marking
Y = Last Digit of the Year
M = See Month/Code Table Below
Month
Code
Jan
1
Feb
2
Mar
3
Apr
4
May
5
Jun
6
Jul
7
Aug
8
Sep
9
Oct
O
Nov
N
Dec
D
HD01 – HD06
Document number: DS17003 Rev. 14 - 2
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July 2017
© Diodes Incorporated
HD01 – HD06
Maximum Ratings
(@T
A
= +25° unless otherwise specified.)
C,
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Forward Rectified Current (Note 4) @T
A
= +40C
Non-Repetitive Peak Forward Surge Current, 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
Symbol
V
RMM
V
RWM
V
DC
V
RMS
I
O
I
FSM
HD01
100
70
HD02
200
140
0.8
30
HD04
400
280
HD06
600
420
Unit
V
V
A
A
Thermal Characteristics
Characteristic
Typical Thermal Resistance, Junction to Ambient (Note 4)
Operating and Storage Temperature Range
Symbol
R
JA
T
J
, T
STG
Value
75
-55 to +150
Unit
C/W
C
Electrical Characteristics
(@T
A
= +25° unless otherwise specified.)
C,
Symbol
V
F
I
R
C
T
Value
1.0
5.0
500
10
Unit
V
µA
pF
Characteristic
Instantaneous Voltage Drop @ 0.4A (Per Element)
Peak Reverse Current at Rated @T
A
= +25C
DC Blocking Voltage (Per Element) @T
A
= +125C
Typical Total Capacitance (Per Element) (Note 5)
Notes:
4. Mounted on PC Board.
5. Measured at 1.0MHz and applied reverse voltage of 4.0V.
0.8
I
F(AV)
, AVERAGE FORWARD CURRENT (A)
0.6
I
F
, INSTANTANEOUS FORWARD CURRENT (A)
10
1.0
0.4
0.1
0.2
0
0
40
80
120
T
A
, AMBIENT TEMPERATURE (°
C)
Fig. 1 Output Current Derating Curve
160
0.01
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics (per element)
HD01 – HD06
Document number: DS17003 Rev. 14 - 2
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July 2017
© Diodes Incorporated
HD01 – HD06
35
100
T
j
= 25°
C
f = 1.0MHz
I
FSM
, PEAK FORWARD SURGE CURRENT (A)
30
20
C
T
, TOTAL CAPACITANCE (pF)
10
10
0
10
100
NUMBER OF CYCLES AT 60 Hz
Fig. 3 Maximum Peak Forward Surge Current (per element)
100
1
1.0
1
10
V
R
, REVERSE VOLTAGE (V)
Fig. 4 Typical Total Capacitance (per element)
100
T
j
= 125°
C
10
1.0
0.1
T
j
= 25°
C
0.01
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Fig. 5 Typical Reverse Characteristics (per element)
HD01 – HD06
Document number: DS17003 Rev. 14 - 2
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July 2017
© Diodes Incorporated
HD01 – HD06
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
MiniDIP
D
e
L
A2a
E1
E
L1
b
MiniDIP
Dim
Min
Max
A
--
3.00
A1
--
0.20
A2
2.30
2.70
A2a
1.20
1.60
b
0.50
0.80
c
0.15
0.35
D
4.50
4.90
E
--
7.00
E1
3.60
4.00
e
2.30
2.70
L
0.70
1.10
L1
1.10
2.12
All Dimensions in mm
c
A1
A2
A
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
MiniDIP
C
Dimensions
C
X
Y
Y1
Y
Y1
Value (in
mm)
2.50
1.65
1.80
6.80
X
HD01 – HD06
Document number: DS17003 Rev. 14 - 2
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July 2017
© Diodes Incorporated
HD01 – HD06
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2017, Diodes Incorporated
www.diodes.com
HD01 – HD06
Document number: DS17003 Rev. 14 - 2
5 of 5
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July 2017
© Diodes Incorporated
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