ISOFACE™
ISO1H812G
Galvanic Isolated 8 Channel High-Side Switch
Datasheet
Revision 2.6, 2014-10-17
Power Management & Multimarket
Edition 2014-10-17
Published by
Infineon Technologies AG
81726 Munich, Germany
©
2014 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
ISOFACE™
ISO1H812G
Revision History
Page or Item
Page 4
Page 7
Page 9
Page 9
Page 16
Page 18
Page 19
all
Revision 2.5
Page 13
Revision 2.0
all
Final Datasheet
Page 13, Table 4.1 Extended operating temperature footnote removed
Subjects (major changes since previous revision)
Feature list updated, Vbb Monitoring included
Page 7 Chapter 2 Block diagram updated
Page 9 Chapter 3.3.3 Description for repetitive short circuit corrected
Page 9 Chapter 3.4 Vbb Monitoring included in common diagnostic output description
Page 16 Chapter 4.5 Footnotes corrected
Page 18 Chapter 4.8 Timing parameter for CS delay split into t
CSD
and t
CSDMD
Page 19 Chapter 4.10 Parameter Minimum Internal Gap removed
Correction of formats and typos
Revision 2.6, 2014-10-17
Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™,
CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, EasyPIM™, EconoBRIDGE™, EconoDUAL™,
EconoPIM™, EconoPACK™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™,
ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™,
POWERCODE™; PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™,
ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, TEMPFET™,
thinQ!™, TRENCHSTOP™, TriCore™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA
MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of
OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF
Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™
of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co.
TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™
of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas
Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes
Zetex Limited.
Last Trademarks Update 2011-11-11
Datasheet
3
Revision 2.6, 2014-10-17
ISOFACE™
ISO1H812G
Coreless Transformer Isolated Digital
Output 8 Channel 0.625 A High-Side
Switch
Product Highlights
•
•
•
•
Coreless transformer isolated data interface
Galvanic isolation
8 High-side output switches 0.625A
µC compatible 8-bit serial peripheral
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Interface CMOS 3.3/5V operation compatible
Serial Interface
High common mode transient immunity
Short circuit protection
Maximum current internally limited
Overload protection
Overvoltage protection (including load dump)
Undervoltage shutdown with autorestart
hysteresis
Switching inductive loads
Common output disable pin
Thermal shutdown with restart
Thermal independence of separate channels
Common diagnostic output
ESD protection
Loss of GNDbb and loss of V
bb
protection
Very low standby current
Reverse battery protection
Isolated return path for DIAG signal
V
bb
monitoring
UL508 compliant / RoHS compliant
Typical Application
•
•
•
•
Isolated switch for industrial applications (PLC)
All types of resistive, inductive and capacitive loads
µC compatible power switch for 24V DC
applications
Driver for solenoid, relays and resistive loads
and
Description
The ISO1H812G is a galvanically isolated 8 bit data
interface in PG-DSO-36 package that provides 8 fully
protected high-side power switches that are able to
handle currents up to 625 mA.
A serial µC compatible interface allows to connect the
IC directly to a µC system. The input interface is
designed to operate with 3.3/5V CMOS compatible
levels.
The data transfer from input to output side is realized by
the integrated Coreless Transformer Technology.
Typical Application
VCC
VCC P1.x
AD0
P0.0
VCC
DIS
CS
SCLK
DIAG
Control
&
Protectio
n Unit
OUT1
Serial
Interface
Control
Unit
OUT0
CT
Vbb
Vbb
P0.1
SI
for daisy chain
SO
DIAG
µC (i.e C166)
GND
OUT7
ISO1H812G
GNDCC
GNDbb
Type
ISO1H812G
Datasheet
On-state Resistance
200mΩ
4
Package
PG-DSO36
Revision 2.6, 2014-10-17
ISOFACE™
ISO1H812G
Pin Configuration and Functionality
1
1.1
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
TAB
Pin Configuration and Functionality
Pin Configuration
Symbol
N.C.
VCC
DIS
CS
SCLK
SI
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
SO
DIAG
GNDCC
N.C.
N.C.
N.C.
GNDbb
N.C
OUT7
OUT7
OUT6
OUT6
OUT5
OUT5
OUT4
OUT4
OUT3
OUT3
OUT2
OUT2
OUT1
OUT1
OUT0
OUT0
Vbb
Function
Not connected
Positive 3.3/5V logic supply
Output disable
Chip select
Serial Clock
Serial Data input
Not connected
Not connected
Not connected
Not connected
Not connected
Not connected
Serial Data Output
Common diagnostic output
Input logic ground
Not connected
Not connected
Not connected
Output driver ground
Not connected
High-side output of channel 7
High-side output of channel 7
High-side output of channel 6
High-side output of channel 6
High-side output of channel 5
High-side output of channel 5
High-side output of channel 4
High-side output of channel 4
High-side output of channel 3
High-side output of channel 3
High-side output of channel 2
High-side output of channel 2
High-side output of channel 1
High-side output of channel 1
High-side output of channel 0
High-side output of channel 0
Positive driver power supply voltage
Figure 1
.
Vbb
N.C.
VCC
DIS
CS
SCLK
SI
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
SO
DIAG
GNDCC
N.C.
N.C.
N.C.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
TAB
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
OUT0
OUT0
OUT1
OUT1
OUT2
OUT2
OUT3
OUT3
OUT4
OUT4
OUT5
OUT5
OUT6
OUT6
OUT7
OUT7
N.C.
GNDbb
TAB
Vbb
Power SO-36 (430mil)
Datasheet
5
Revision 2.6, 2014-10-17
FPGA/CPLD
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