Counter ICs 14ST BIN RIP COUNTER
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP, TSSOP16,.25 |
| 针数 | 16 |
| Reach Compliance Code | compliant |
| Base Number Matches | 1 |
| 74LV4020PW | 74LV4020DB-T | 74LV4020D | 74LV4020D-T | 74LV4020N | 74LV4020DB | |
|---|---|---|---|---|---|---|
| 描述 | Counter ICs 14ST BIN RIP COUNTER | Counter ICs 3.3V 14-STAGE BIN RIPPLE COUNT | Counter ICs 3.3V 14-STAGE BIN RIPPLE COUNT | Counter ICs 3.3V 14-STAGE BIN RIPPLE COUNT | Counter ICs 3.3V 14-STAGE BIN RIPPLE COUNT | Counter ICs 3.3V 14-STAGE BIN RIPPLE COUNT |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | TSSOP | SSOP | SOIC | SOIC | DIP | SSOP |
| 包装说明 | TSSOP, TSSOP16,.25 | SSOP, | SOP, SOP16,.25 | SOP, | DIP, DIP16,.3 | SSOP, SSOP16,.3 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compliant | unknown | unknown | unknown | unknown | compliant |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | 符合 | - | 符合 | - | 符合 | 符合 |
| 其他特性 | - | OUTPUTS FROM 12 STAGES AVAILABLE | OUTPUTS FROM 12 STAGES AVAILABLE | OUTPUTS FROM 12 STAGES AVAILABLE | OUTPUTS FROM 12 STAGES AVAILABLE | OUTPUTS FROM 12 STAGES AVAILABLE |
| 计数方向 | - | UP | UP | UP | UP | UP |
| 系列 | - | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H |
| JESD-30 代码 | - | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 |
| JESD-609代码 | - | e4 | e4 | - | e4 | e4 |
| 长度 | - | 6.2 mm | 9.9 mm | 9.9 mm | 19.025 mm | 6.2 mm |
| 负载电容（CL） | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 负载/预设输入 | - | YES | NO | YES | NO | NO |
| 逻辑集成电路类型 | - | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER |
| 工作模式 | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 位数 | - | 14 | 14 | 14 | 14 | 14 |
| 功能数量 | - | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | - | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | SSOP | SOP | SOP | DIP | SSOP |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, SHRINK PITCH |
| 传播延迟（tpd） | - | 54 ns | 54 ns | 54 ns | 54 ns | 54 ns |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 2 mm | 1.75 mm | 1.75 mm | 4.2 mm | 2 mm |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | 1 V | 1 V | 1 V | 1 V | 1 V |
| 标称供电电压 (Vsup) | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | - | YES | YES | YES | NO | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | - | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | - | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | - | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | - | 0.65 mm | 1.27 mm | 1.27 mm | 2.54 mm | 0.65 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL | DUAL |
| 触发器类型 | - | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE |
| 宽度 | - | 5.3 mm | 3.9 mm | 3.9 mm | 7.62 mm | 5.3 mm |
| 最小 fmax | - | 36 MHz | 36 MHz | 36 MHz | 36 MHz | 36 MHz |
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