CPLD - Complex Programmable Logic Devices PROGRAMMABLE SUPER FAST HI DENSITY PLD
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Lattice(莱迪斯) |
零件包装代码 | BGA |
包装说明 | FPBGA-256 |
针数 | 256 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
其他特性 | YES |
最大时钟频率 | 86 MHz |
系统内可编程 | YES |
JESD-30 代码 | S-PBGA-B256 |
JESD-609代码 | e0 |
JTAG BST | YES |
长度 | 17 mm |
湿度敏感等级 | 3 |
专用输入次数 | 4 |
I/O 线路数量 | 192 |
宏单元数 | 384 |
端子数量 | 256 |
组织 | 4 DEDICATED INPUTS, 192 I/O |
输出函数 | MACROCELL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | BGA |
封装等效代码 | BGA256,16X16,40 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY |
峰值回流温度(摄氏度) | 225 |
电源 | 2.5 V |
可编程逻辑类型 | EE PLD |
传播延迟 | 10 ns |
认证状态 | Not Qualified |
座面最大高度 | 2.1 mm |
最大供电电压 | 2.7 V |
最小供电电压 | 2.3 V |
标称供电电压 | 2.5 V |
表面贴装 | YES |
技术 | CMOS |
端子面层 | Tin/Lead (Sn63Pb37) |
端子形式 | BALL |
端子节距 | 1 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 17 mm |
Base Number Matches | 1 |
LC4384B-10F256I | LC4384C-75FN256I | LC4256V-75FN256BI | LC4256B-10FN256BI | LC4384B-75FN256I | LC4384C-75F256I | LC4384C-5FN256I | LC4256B-3FN256AC | LC4384B-5F256I | |
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描述 | CPLD - Complex Programmable Logic Devices PROGRAMMABLE SUPER FAST HI DENSITY PLD | CPLD - Complex Programmable Logic Devices PROGRAMMABLE SUPER FAST HI DENSITY PLD | CPLD - Complex Programmable Logic Devices PROGRAMMABLE SUPER FAST HI DENSITY PLD | CPLD - Complex Programmable Logic Devices PROGRAMMABLE SUPER FAST HI DENSITY PLD | CPLD - Complex Programmable Logic Devices PROGRAMMABLE SUPER FAST HI DENSITY PLD | CPLD - Complex Programmable Logic Devices PROGRAMMABLE SUPER FAST HI DENSITY PLD | CPLD - Complex Programmable Logic Devices PROGRAMMABLE SUPER FAST HI DENSITY PLD | CPLD - Complex Programmable Logic Devices PROGRAMMABLE SUPER FAST HI DENSITY PLD | CPLD - Complex Programmable Logic Devices PROGRAMMABLE SUPER FAST HI DENSITY PLD |
是否Rohs认证 | 不符合 | 符合 | 符合 | 符合 | 符合 | 不符合 | 符合 | 符合 | 不符合 |
厂商名称 | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
包装说明 | FPBGA-256 | FPBGA-256 | FPBGA-256 | FPBGA-256 | FPBGA-256 | FPBGA-256 | FPBGA-256 | FPBGA-256 | FPBGA-256 |
针数 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
最大时钟频率 | 86 MHz | 111 MHz | 111 MHz | 86 MHz | 111 MHz | 111 MHz | 156 MHz | 212 MHz | 156 MHz |
系统内可编程 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 |
JESD-609代码 | e0 | e1 | e1 | e1 | e1 | e0 | e1 | e1 | e0 |
JTAG BST | YES | YES | YES | YES | YES | YES | YES | YES | YES |
长度 | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
专用输入次数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
I/O 线路数量 | 192 | 192 | 160 | 160 | 192 | 192 | 192 | 128 | 192 |
宏单元数 | 384 | 384 | 256 | 256 | 384 | 384 | 384 | 256 | 384 |
端子数量 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
组织 | 4 DEDICATED INPUTS, 192 I/O | 4 DEDICATED INPUTS, 192 I/O | 4 DEDICATED INPUTS, 160 I/O | 4 DEDICATED INPUTS, 160 I/O | 4 DEDICATED INPUTS, 192 I/O | 4 DEDICATED INPUTS, 192 I/O | 4 DEDICATED INPUTS, 192 I/O | 4 DEDICATED INPUTS, 128 I/O | 4 DEDICATED INPUTS, 192 I/O |
输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
封装等效代码 | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
峰值回流温度(摄氏度) | 225 | 250 | 250 | 250 | 250 | 225 | 250 | 250 | 225 |
电源 | 2.5 V | 1.8 V | 3.3 V | 2.5 V | 2.5 V | 1.8 V | 1.8 V | 2.5 V | 2.5 V |
可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
传播延迟 | 10 ns | 7.5 ns | 7.5 ns | 10 ns | 7.5 ns | 7.5 ns | 5 ns | 3 ns | 5 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.1 mm | 2.1 mm | 2.1 mm | 2.1 mm | 2.1 mm | 2.1 mm | 2.1 mm | 2.1 mm | 2.1 mm |
最大供电电压 | 2.7 V | 1.95 V | 3.6 V | 2.7 V | 2.7 V | 1.95 V | 1.95 V | 2.7 V | 2.7 V |
最小供电电压 | 2.3 V | 1.65 V | 3 V | 2.3 V | 2.3 V | 1.65 V | 1.65 V | 2.3 V | 2.3 V |
标称供电电压 | 2.5 V | 1.8 V | 3.3 V | 2.5 V | 2.5 V | 1.8 V | 1.8 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子面层 | Tin/Lead (Sn63Pb37) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn63Pb37) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn63Pb37) |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | 30 | 40 | 40 | 40 | 40 | 30 | 40 | 40 | 30 |
宽度 | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm |
Base Number Matches | 1 | 1 | - | 1 | - | - | 1 | 1 | 1 |
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