IS25LQ032B
IS25LQ016B
IS25LQ080B
32/16/8Mb
3V QUAD SERIAL FLASH MEMORY WITH
MULTI-I/O SPI
DATA SHEET
IS25LQ032B/016B/080B
32/16/8Mb
3V QUAD SERIAL FLASH MEMORY MULTI-I/O SPI
FEATURES
Industry Standard Serial Interface
-
IS25LQ032B: 32Mbit/4Mbyte
-
IS25LQ016B: 16Mbit/2Mbyte
-
IS25LQ080B: 8Mbit/1Mbyte
-
256-bytes per Programmable Page Standard
-
Standard SPI/Dual/Quad Multi-I/O SPI
-
Supports Serial Flash Discoverable Parameters
(SFDP)
High Performance Serial Flash (SPI)
-
104 MHz SPI/Dual/Quad Multi-I/O SPI
-
416 MHz equivalent Quad SPI
-
52MB/S Continuous Data Throughput
-
Supports SPI Modes 0 and 3
-
More than 100,000 erase/program cycles
-
More than 20-year data retention
Efficient Read and Program modes
-
Low Instruction Overhead Operations
-
Continuous data read with Byte Wrap around
-
Allows XIP operations (execute in place)
-
Outperforms X16 Parallel Flash
Flexible & Cost Efficient Memory Architecture
-
Uniform 4 Kbyte Sectors or 32/64 Kbyte Blocks
-
Flexible 4, 32, 64 Kbytes, or Chip Erase
-
Standard Page Program 1 to 256 bytes
-
Program/Erase Suspend and Resume
Low Power with Wide Temp. Ranges
-
Single 2.3V to 3.6V Voltage Supply
-
10 mA Active Read Current
-
8 µA Standby Current
-
5 µA Deep Power Down
-
Temp Grades:
Extended: -40°C to +105°C
Extended+: -40°C to +125°C
Auto Grade: up to +125°C
Note: Extended+ should not be used for Automotive.
Advanced Security Protection
-
Software and Hardware Write Protection
-
4x256-Byte dedicated security area with
OTP user-lockable bits.
-
128 bit Unique ID for each device (Call Factory)
Industry Standard Pin-out & Pb-Free Packages
-
M = 16-pin SOIC 300mil
-
B = 8-pin SOIC 208mil
-
N = 8-pin SOIC 150mil
-
F = 8-pin VSOP 208mil
-
K = 8-contact WSON 6x5mm
-
L = 8-contact WSON 8x6mm
-
T = 8-contact USON 4x3mm
-
G = 24-ball TFBGA 6x8mm 4x6 (Call Factory)
-
H = 24-ball TFBGA 6x8mm 5x5 (Call Factory)
-
KGD (Call Factory)
Note1: IS25LQ080B (not available in M, L, G, H)
1
Integrated Silicon Solution, Inc.- www.issi.com
Rev. H2
06/27/2016
2
IS25LQ032B/016B/080B
GENERAL DESCRIPTION
The IS25LQ032B/016B/080B (32/16/8M-bit) Serial Flash memory offers a storage solution with flexibility and
performance in a simplified pin count package. ISSI’s “Industry Standard Serial Interface” is for systems that have
limited space, pins, and power. The device is accessed through a 4-wire SPI Interface consisting of a Serial Data
Input (SI), Serial Data Output (SO), Serial Clock (SCK), and Chip Enable (CE#) pins, which also serve as multi-
function I/O pins in Dual and Quad modes (see pin descriptions). The IS25xQ series of Flash is ideal for code
shadowing to RAM, execute in place (XIP) operations, and storing non-volatile data.
The memory array is organized into programmable pages of 256-bytes each. The device supports page program
mode where 1 to 256 bytes of data can be programmed into the memory with one command. Pages can be erased in
groups of 4Kbyte sectors, 32Kbyte blocks, 64Kbyte blocks, and/or the entire chip. The uniform sectors and blocks
allow greater flexibility for a variety of applications requiring solid data retention.
The device supports the standard Serial Peripheral Interface (SPI), Dual/Quad output (SPI), and Dual/Quad I/O (SPI).
Clock frequencies of up to 104MHz for all read modes allow for equivalent clock rates of up to 416MHz (104MHz x 4)
which equates to 52Mbytes/S of throughput. These transfer rates can outperform 16-bit Parallel Flash memories
allowing for efficient memory access for a XIP (execute in place) operation. The device is manufactured using industry
leading non-volatile memory technology and offered in industry standard lead-free packages. See Ordering
Information for the density and package combinations available
.
Integrated Silicon Solution, Inc.- www.issi.com
Rev. H2
06/27/2016
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IS25LQ032B/016B/080B
TABLE OF CONTENTS
FEATURES .......................................................................................................................................................... 2
GENERAL DESCRIPTION .................................................................................................................................. 3
TABLE OF CONTENTS ....................................................................................................................................... 4
1.
2.
3.
4.
5.
6.
PIN CONFIGURATION ................................................................................................................................. 6
PIN DESCRIPTIONS .................................................................................................................................... 8
BLOCK DIAGRAM ........................................................................................................................................ 9
SPI MODES DESCRIPTION ...................................................................................................................... 10
SYSTEM CONFIGURATION ...................................................................................................................... 12
5.1 BLOCK/SECTOR ADDRESSES .......................................................................................................... 13
REGISTERS ............................................................................................................................................... 14
6.1. STATUS REGISTER ........................................................................................................................... 14
6.2. FUNCTION REGISTER ....................................................................................................................... 17
7.
PROTECTION MODE................................................................................................................................. 18
7.1 HARDWARE WRITE PROTECTION.................................................................................................... 18
7.2 SOFTWARE WRITE PROTECTION .................................................................................................... 18
8.
DEVICE OPERATION ................................................................................................................................ 19
8.1 READ DATA OPERATION (RD, 03h) .................................................................................................. 20
8.2 FAST READ DATA OPERATION (FR, 0Bh) ........................................................................................ 22
8.3 HOLD OPERATION .............................................................................................................................. 23
8.4 FAST READ DUAL I/O OPERATION (FRDIO, BBh) ........................................................................... 23
8.5 FAST READ DUAL OUTPUT OPERATION (FRDO, 3Bh) .................................................................. 26
8.6 FAST READ QUAD OUTPUT (FRQO, 6Bh) ........................................................................................ 28
8.7 FAST READ QUAD I/O OPERATION (FRQIO, EBh) .......................................................................... 30
8.8 PAGE PROGRAM OPERATION (PP, 02h) .......................................................................................... 33
8.9 QUAD INPUT PAGE PROGRAM OPERATION (PPQ, 32h/38h) ........................................................ 34
8.10 ERASE OPERATION ......................................................................................................................... 35
8.11 SECTOR ERASE OPERATION (SER, D7h/20h) ............................................................................... 35
8.12 BLOCK ERASE OPERATION (BER32K:52h, BER64K:D8h) ............................................................ 36
8.13 CHIP ERASE OPERATION (CER, C7h/60h) ..................................................................................... 37
8.14 WRITE ENABLE OPERATION (WREN, 06h) .................................................................................... 38
8.15 WRITE DISABLE OPERATION (WRDI, 04h) ..................................................................................... 38
8.16 READ STATUS REGISTER OPERATION (RDSR, 05h) ................................................................... 39
8.17 WRITE STATUS REGISTER OPERATION (WRSR, 01h) ................................................................. 39
8.18 READ FUNCTION REGISTER OPERATION (RDFR, 48h) ............................................................... 40
8.19 WRITE FUNCTION REGISTER OPERATION (WRFR, 42h)............................................................. 40
8.20 PROGRAM/ERASE SUSPEND & RESUME ...................................................................................... 41
Integrated Silicon Solution, Inc.- www.issi.com
Rev. H2
06/27/2016
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IS25LQ032B/016B/080B
8.21 DEEP POWER DOWN (DP, B9h) ...................................................................................................... 43
8.22 RELEASE DEEP POWER DOWN (RDPD, ABh) ............................................................................... 44
8.23 READ PRODUCT IDENTIFICATION (RDID, ABh) ............................................................................ 45
8.24 READ PRODUCT IDENTIFICATION BY JEDEC ID OPERATION (RDJDID, 9Fh) ........................... 46
8.25 READ DEVICE MANUFACTURER AND DEVICE ID OPERATION (RDMDID, 90h) ........................ 47
8.26 READ UNIQUE ID NUMBER (RDUID, 4Bh) ...................................................................................... 48
8.27 READ SFDP OPERATION (RDSFDP, 5Ah) ...................................................................................... 49
8.28 SOFTWARE RESET (RESET-ENABLE (RSTEN, 66h) AND RESET (RST, 99h) ............................ 50
8.29 SECURITY INFORMATION ROW (OTP AREA) ................................................................................ 51
8.30 INFORMATION ROW PROGRAM OPERATION (IRP, 62h) ............................................................. 51
8.31 INFORMATION ROW READ OPERATION (IRRD, 68h) ................................................................... 53
8.32 SECTOR LOCK/UNLOCK FUNCTIONS ............................................................................................ 54
9.
ELECTRICAL CHARACTERISTICS ........................................................................................................... 56
9.1 ABSOLUTE MAXIMUM RATINGS
(1)
................................................................................................... 56
9.2 OPERATING RANGE ........................................................................................................................... 56
9.3 DC CHARACTERISTICS ...................................................................................................................... 57
9.4 AC MEASUREMENT CONDITIONS .................................................................................................... 58
9.5 PIN CAPACITANCE (TA = 25°C, VCC=3V , 1MHz) ............................................................................ 58
9.6 AC CHARACTERISTICS ...................................................................................................................... 59
9.7 SERIAL INPUT/OUTPUT TIMING ........................................................................................................ 60
9.8 POWER-UP AND POWER-DOWN ...................................................................................................... 61
9.9 PROGRAM/ERASE PERFORMANCE ................................................................................................. 62
9.10 RELIABILITY CHARACTERISTICS ................................................................................................... 62
10.
PACKAGE TYPE INFORMATION ......................................................................................................... 63
10.1 16-Pin JEDEC 300mil Small Outline Integrated Circuit (SOIC) Package (M) .................................... 63
10.2 8-Pin JEDEC 208mil Broad Small Outline Integrated Circuit (SOIC) Package (B) ............................ 64
10.3 8-Pin JEDEC 150mil Broad Small Outline Integrated Circuit (SOIC) Package (N) ............................ 65
10.4 8-Pin 208mil VSOP Package (F) ........................................................................................................ 66
10.5 8-Contact Ultra-Thin Small Outline No-Lead (WSON) Package 6x5mm (K)...................................... 67
10.6 8-Contact Ultra-Thin Small Outline No-Lead (WSON) Package 8x6mm (L) ...................................... 68
10.7 24-Ball Thin Profile Fine Pitch BGA 6x8mm 4x6 array (G)................................................................. 69
10.8 8-Contact Ultra-Thin Small Outline No-Lead (USON) Package 4x3mm (T)....................................... 70
10.9 24-Ball Thin Profile Fine Pitch BGA 6x8mm 5x5 array (H) ................................................................. 71
11.
ORDERING INFORMATION - Valid Part Numbers ............................................................................... 72
Integrated Silicon Solution, Inc.- www.issi.com
Rev. H2
06/27/2016
5
测试/测量
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