MUN2241, MMUN2241L,
MUN5241, DTC115TE,
DTC115TM3, NSBC115TF3
Digital Transistors (BRT)
R1 = 100 kW, R2 =
8
kW
NPN Transistors with Monolithic Bias
Resistor Network
This series of digital transistors is designed to replace a single
device and its external resistor bias network. The Bias Resistor
Transistor (BRT) contains a single transistor with a monolithic bias
network consisting of two resistors; a series base resistor and a base−
emitter resistor. The BRT eliminates these individual components by
integrating them into a single device. The use of a BRT can reduce
both system cost and board space.
Features
PIN 1
BASE
(INPUT)
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PIN CONNECTIONS
PIN 3
COLLECTOR
(OUTPUT)
R1
R2
PIN 2
EMITTER
(GROUND)
•
•
•
•
MARKING DIAGRAMS
SC−59
CASE 318D
STYLE 1
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
S and NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC-Q101 Qualified
and PPAP Capable
•
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
(T
A
= 25°C)
Rating
Collector−Base Voltage
Collector−Emitter Voltage
Collector Current − Continuous
Input Forward Voltage
Input Reverse Voltage
Symbol
V
CBO
V
CEO
I
C
V
IN(fwd)
V
IN(rev)
Max
50
50
100
40
6
Unit
Vdc
Vdc
mAdc
Vdc
Vdc
XX MG
G
1
XXX MG
G
1
SOT−23
CASE 318
STYLE 6
XX MG
G
1
XX M
1
XX M
1
XM 1
XXX
M
G
SC−70/SOT−323
CASE 419
STYLE 3
SC−75
CASE 463
STYLE 1
SOT−723
CASE 631AA
STYLE 1
SOT−1123
CASE 524AA
STYLE 1
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
= Specific Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending up-
on manufacturing location.
ORDERING INFORMATION
See detailed ordering, marking, and shipping information in
the package dimensions section on page 2 of this data sheet.
©
Semiconductor Components Industries, LLC, 2012
1
November, 2016 − Rev. 2
Publication Order Number:
DTC115T/D
MUN2241, MMUN2241L, MUN5241, DTC115TE, DTC115TM3, NSBC115TF3
Table 1. ORDERING INFORMATION
Device
MUN2241T1G
MMUN2241LT1G
MUN5241T1G
DTC115TET1G
DTC115TM3T5G
NSBC115TF3T5G
Part Marking
8U
A8U
AW
7V
7D
P (90°)*
Package
SC−59
(Pb−Free)
SOT−23
(Pb−Free)
SC−70/SOT−323
(Pb−Free)
SC−75
(Pb−Free)
SOT−723
(Pb−Free)
SOT−1123
(Pb−Free)
Shipping
†
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
8000 / Tape & Reel
8000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
* (xx°) = Degree rotation in the clockwise direction.
300
P
D
, POWER DISSIPATION (mW)
250
200
(1) (2) (3) (4) (5)
150
100
50
0
−50
(1) SC−75 and SC−70/SOT323; Minimum Pad
(2) SC−59; Minimum Pad
(3) SOT−23; Minimum Pad
(4) SOT−1123; 100 mm
2
, 1 oz. copper trace
(5) SOT−723; Minimum Pad
−25
0
25
50
75
100
125
150
AMBIENT TEMPERATURE (°C)
Figure 1. Derating Curve
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2
MUN2241, MMUN2241L, MUN5241, DTC115TE, DTC115TM3, NSBC115TF3
Table 2. THERMAL CHARACTERISTICS
Characteristic
THERMAL CHARACTERISTICS (SC−59) (MUN2241)
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction to Ambient
Thermal Resistance,
Junction to Lead
Junction and Storage Temperature Range
THERMAL CHARACTERISTICS (SOT−23) (MMUN2241L)
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction to Ambient
Thermal Resistance,
Junction to Lead
Junction and Storage Temperature Range
THERMAL CHARACTERISTICS (SC−70/SOT−323) (MUN5241)
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction to Ambient
Thermal Resistance,
Junction to Lead
Junction and Storage Temperature Range
THERMAL CHARACTERISTICS (SC−75) (DTC115TE)
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction to Ambient
Junction and Storage Temperature Range
THERMAL CHARACTERISTICS (SOT−723) (DTC115TM3)
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction to Ambient
Junction and Storage Temperature Range
1.
2.
3.
4.
FR−4 @ Minimum Pad.
FR−4 @ 1.0 x 1.0 Inch Pad.
FR−4 @ 100 mm
2
, 1 oz. copper traces, still air.
FR−4 @ 500 mm
2
, 1 oz. copper traces, still air.
P
D
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 1)
(Note 2)
R
qJA
T
J
, T
stg
260
600
2.0
4.8
480
205
−55 to +150
mW
mW/°C
°C/W
°C
P
D
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 1)
(Note 2)
R
qJA
T
J
, T
stg
200
300
1.6
2.4
600
400
−55 to +150
mW
mW/°C
°C/W
°C
P
D
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 1)
(Note 2)
R
qJA
R
qJL
T
J
, T
stg
202
310
1.6
2.5
618
403
280
332
−55 to +150
mW
mW/°C
°C/W
°C/W
°C
P
D
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 1)
(Note 2)
R
qJA
R
qJL
T
J
, T
stg
246
400
2.0
3.2
508
311
174
208
−55 to +150
mW
mW/°C
°C/W
°C/W
°C
P
D
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 1)
(Note 2)
R
qJA
R
qJL
T
J
, T
stg
230
338
1.8
2.7
540
370
264
287
−55 to +150
mW
mW/°C
°C/W
°C/W
°C
Symbol
Max
Unit
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3
MUN2241, MMUN2241L, MUN5241, DTC115TE, DTC115TM3, NSBC115TF3
Table 2. THERMAL CHARACTERISTICS
Characteristic
THERMAL CHARACTERISTICS (SOT−1123) (NSBC115TF3)
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction to Ambient
Thermal Resistance, Junction to Lead
Junction and Storage Temperature Range
1.
2.
3.
4.
FR−4 @ Minimum Pad.
FR−4 @ 1.0 x 1.0 Inch Pad.
FR−4 @ 100 mm
2
, 1 oz. copper traces, still air.
FR−4 @ 500 mm
2
, 1 oz. copper traces, still air.
P
D
(Note 3)
(Note 4)
(Note 3)
(Note 4)
(Note 3)
(Note 4)
(Note 3)
R
qJA
R
qJL
T
J
, T
stg
254
297
2.0
2.4
493
421
193
−55 to +150
mW
mW/°C
°C/W
°C/W
°C
Symbol
Max
Unit
Table 3. ELECTRICAL CHARACTERISTICS
(T
A
= 25°C, unless otherwise noted)
Characteristic
OFF CHARACTERISTICS
Collector−Base Cutoff Current
(V
CB
= 50 V, I
E
= 0)
Collector−Emitter Cutoff Current
(V
CE
= 50 V, I
B
= 0)
Emitter−Base Cutoff Current
(V
EB
= 6.0 V, I
C
= 0)
Collector−Base Breakdown Voltage
(I
C
= 10
mA,
I
E
= 0)
Collector−Emitter Breakdown Voltage (Note 5)
(I
C
= 2.0 mA, I
B
= 0)
ON CHARACTERISTICS
DC Current Gain (Note 5)
(I
C
= 5.0 mA, V
CE
= 10 V)
Collector−Emitter Saturation Voltage (Note 5)
(I
C
= 10 mA, I
B
= 5.0 mA)
Input Voltage (off)
(V
CE
= 5.0 V, I
C
= 100
mA)
Input Voltage (on)
(V
CE
= 0.3 V, I
C
= 1.0 mA)
Output Voltage (on)
(V
CC
= 5.0 V, V
B
= 5.0 V, R
L
= 1.0 kW)
Output Voltage (off)
(V
CC
= 5.0 V, V
B
= 0.25 V, R
L
= 1.0 kW)
Input Resistor
Resistor Ratio
h
FE
160
V
CE(sat)
−
V
i(off)
−
V
i(on)
1.5
V
OL
−
V
OH
4.9
R1
R
1
/R
2
70
−
−
100
−
−
130
−
kW
−
0.2
Vdc
1.0
−
Vdc
0.6
0.5
Vdc
−
0.25
Vdc
350
−
Vdc
I
CBO
−
I
CEO
−
I
EBO
−
V
(BR)CBO
50
V
(BR)CEO
50
−
−
−
−
Vdc
−
0.1
Vdc
−
500
mAdc
−
100
nAdc
nAdc
Symbol
Min
Typ
Max
Unit
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
5. Pulsed Condition: Pulse Width = 300 msec, Duty Cycle
≤
2%.
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MUN2241, MMUN2241L, MUN5241, DTC115TE, DTC115TM3, NSBC115TF3
TYPICAL CHARACTERISTICS − NSBC115TF3
10
V
CE(sat)
, COLLECTOR−EMITTER
VOLTAGE (V)
I
C
/I
B
= 10
h
FE
, DC CURRENT GAIN
25°C
1
−55°C
150°C
1000
150°C
25°C
−55°C
100
0.1
V
CE
= 10 V
10
0
10
20
30
40
50
1
10
I
C
, COLLECTOR CURRENT (mA)
100
I
C
, COLLECTOR CURRENT (mA)
0.01
Figure 2. V
CE(sat)
vs. I
C
2.4
C
ob
, OUTPUT CAPACITANCE (pF)
I
C
, COLLECTOR CURRENT (mA)
2.0
1.6
1.2
0.8
0.4
0
0
10
20
30
40
50
V
R
, REVERSE VOLTAGE (V)
f = 10 kHz
I
E
= 0 A
T
A
= 25°C
100
150°C
Figure 3. DC Current Gain
25°C
10
−55°C
1
0.1
V
O
= 5 V
0.01
0
4
8
12
16
20
24
28
V
in
, INPUT VOLTAGE (V)
Figure 4. Output Capacitance
100
Figure 5. Output Current vs. Input Voltage
V
in
, INPUT VOLTAGE (V)
−55°C
10
25°C
150°C
1
V
O
= 0.2 V
0.1
0
10
20
30
40
50
I
C
, COLLECTOR CURRENT (mA)
Figure 6. Input Voltage vs. Output Current
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