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74HCT00D/AUJ

产品描述Logic Gates Quad 2-input NAND gate
产品类别半导体    逻辑   
文件大小792KB,共15页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
下载文档 详细参数 选型对比 全文预览

74HCT00D/AUJ概述

Logic Gates Quad 2-input NAND gate

74HCT00D/AUJ规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
NXP(恩智浦)
产品种类
Product Category
Logic Gates
RoHSDetails
产品
Product
Single-Function Gate
Logic FunctionNAND
Logic Family74HCT
Number of Gates4 Gate
Number of Input Lines8 Input
Number of Output Lines4 Output
传播延迟时间
Propagation Delay Time
12 ns
电源电压-最大
Supply Voltage - Max
5.5 V
电源电压-最小
Supply Voltage - Min
4.5 V
最小工作温度
Minimum Operating Temperature
- 40 C
最大工作温度
Maximum Operating Temperature
+ 125 C
安装风格
Mounting Style
SMD/SMT
封装 / 箱体
Package / Case
SO-14
系列
Packaging
Cut Tape
系列
Packaging
MouseReel
系列
Packaging
Reel
工作温度范围
Operating Temperature Range
- 40 C to + 125 C
Output Current25 mA
Output Voltage5 V
Pd-功率耗散
Pd - Power Dissipation
500 mW (1/2 W)
工厂包装数量
Factory Pack Quantity
2500
单位重量
Unit Weight
0.009143 oz

文档预览

下载PDF文档
74HC00; 74HCT00
Quad 2-input NAND gate
Rev. 7 — 25 November 2015
Product data sheet
1. General description
The 74HC00; 74HCT00 is a quad 2-input NAND gate. Inputs include clamp diodes. This
enables the use of current limiting resistors to interface inputs to voltages in excess of
V
CC
.
2. Features and benefits
Input levels:
For 74HC00: CMOS level
For 74HCT00: TTL level
Complies with JEDEC standard no. 7A
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Multiple package options
Specified from
40 C
to +85
C
and from
40 C
to +125
C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74HC00D
74HCT00D
74HC00DB
74HCT00DB
74HC00PW
74HCT00PW
74HC00BQ
74HCT00BQ
40 C
to +125
C
DHVQFN14
40 C
to +125
C
TSSOP14
40 C
to +125
C
SSOP14
40 C
to +125
C
Name
SO14
Description
plastic small outline package; 14 leads; body width
3.9 mm
plastic shrink small outline package; 14 leads; body
width 5.3 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
Version
SOT108-1
SOT337-1
SOT402-1
Type number
plastic dual in-line compatible thermal enhanced very SOT762-1
thin quad flat package; no leads; 14 terminals;
body 2.5
3
0.85 mm

74HCT00D/AUJ相似产品对比

74HCT00D/AUJ 74HC00D,652 74HCT00PW 74HCT00D,652 74HCT00N,652 74HC00PW,112 74HC00DB,112 74HC00BQ
描述 Logic Gates Quad 2-input NAND gate Logic Gates QUAD 2-IN NAND GATE Logic Gates QUAD 2-INPUT NAND GATE Logic Gates QUAD 2-INPUT NAND Logic Gates QUAD 2-IN NAND GATE 2INPUT Logic Gates QUAD 2-INPUT NAND Logic Gates QUAD 2-INPUT NAND GATE Logic Gates
Brand Name - NXP Semiconductor - NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor -
是否Rohs认证 - 符合 符合 符合 符合 符合 符合 符合
厂商名称 - NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 - SOIC TSSOP SOIC DIP TSSOP SSOP1 QFN
包装说明 - SOP, SOP14,.25 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 DIP, DIP14,.3 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
针数 - 14 14 14 14 14 14 14
制造商包装代码 - SOT108-1 - SOT108-1 SOT27-1 SOT402-1 SOT337-1 -
Reach Compliance Code - compliant unknown compliant compliant compliant compliant compliant
系列 - HC/UH HCT HCT HCT HC/UH HC/UH HC/UH
JESD-30 代码 - R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDIP-T14 R-PDSO-G14 R-PDSO-G14 R-PQCC-N14
JESD-609代码 - e4 e4 e4 - - e4 e4
长度 - 8.65 mm 5 mm 8.65 mm 19.025 mm 5 mm 6.2 mm 3 mm
负载电容(CL) - 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
逻辑集成电路类型 - NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE
最大I(ol) - 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A
湿度敏感等级 - 1 1 1 - 1 1 1
功能数量 - 4 4 4 4 4 4 4
输入次数 - 2 2 2 2 2 2 2
端子数量 - 14 14 14 14 14 14 14
最高工作温度 - 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 - -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 - SOP TSSOP SOP DIP TSSOP SSOP HVQCCN
封装等效代码 - SOP14,.25 TSSOP14,.25 SOP14,.25 DIP14,.3 TSSOP14,.25 SSOP14,.3 LCC14,.1X.12,20
封装形状 - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 - SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
包装方法 - TUBE TUBE TUBE TUBE TUBE TUBE TAPE AND REEL
峰值回流温度(摄氏度) - 260 260 260 260 260 260 260
电源 - 2/6 V 5 V 5 V 5 V 2/6 V 2/6 V 2/6 V
Prop。Delay @ Nom-Sup - 27 ns 29 ns 29 ns 29 ns 27 ns 27 ns 27 ns
传播延迟(tpd) - 135 ns 29 ns 29 ns 29 ns 135 ns 135 ns 135 ns
认证状态 - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
施密特触发器 - NO NO NO NO NO NO NO
座面最大高度 - 1.75 mm 1.1 mm 1.75 mm 4.2 mm 1.1 mm 2 mm 1 mm
最大供电电压 (Vsup) - 6 V 5.5 V 5.5 V 5.5 V 6 V 6 V 6 V
最小供电电压 (Vsup) - 2 V 4.5 V 4.5 V 4.5 V 2 V 2 V 2 V
标称供电电压 (Vsup) - 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 - YES YES YES NO YES YES YES
技术 - CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子面层 - Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL/PALLADIUM/GOLD (NI/PD/AU) NICKEL/PALLADIUM/GOLD (NI/PD/AU) NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
端子形式 - GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING NO LEAD
端子节距 - 1.27 mm 0.65 mm 1.27 mm 2.54 mm 0.65 mm 0.65 mm 0.5 mm
端子位置 - DUAL DUAL DUAL DUAL DUAL DUAL QUAD
处于峰值回流温度下的最长时间 - 30 30 30 30 30 30 30
宽度 - 3.9 mm 4.4 mm 3.9 mm 7.62 mm 4.4 mm 5.3 mm 2.5 mm
Base Number Matches - 1 1 1 1 1 1 1

 
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