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MAX9311EHJ-T

产品描述Clock Buffer
产品类别逻辑    逻辑   
文件大小366KB,共12页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
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MAX9311EHJ-T概述

Clock Buffer

MAX9311EHJ-T规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Maxim(美信半导体)
零件包装代码QFP
包装说明5 X 5 MM, 1 MM HEIGHT, MO-136AA, TQFP-32
针数32
Reach Compliance Codenot_compliant
其他特性CAN ALSO BE OPERATED FROM -2.25V TO -3.8V SUPPLY FOR LVECL
系列9311
输入调节DIFFERENTIAL MUX
JESD-30 代码S-PQFP-G32
JESD-609代码e0
长度5 mm
逻辑集成电路类型LOW SKEW CLOCK DRIVER
湿度敏感等级1
功能数量1
反相输出次数
端子数量32
实输出次数10
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码TFQFP
封装等效代码TQFP32,.28SQ
封装形状SQUARE
封装形式FLATPACK, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)240
电源2.5/3.3 V
Prop。Delay @ Nom-Sup0.4 ns
传播延迟(tpd)0.41 ns
认证状态Not Qualified
Same Edge Skew-Max(tskwd)0.046 ns
座面最大高度1.2 mm
最大供电电压 (Vsup)3.8 V
最小供电电压 (Vsup)2.25 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度5 mm

MAX9311EHJ-T相似产品对比

MAX9311EHJ-T MAX9311ECJ MAX9311EGJ MAX9313EGJ-T MAX9311EGJ-T MAX9311EHJ MAX9311ECJ-T MAX9313ECJ+T MAX9311ECJ+
描述 Clock Buffer Clock Buffer Clock Buffer Clock Drivers u0026 Distribution 1:10 Differential LVPECL/LVECL/HSTL Clock and Data Drivers Clock Buffer Clock Buffer Clock Buffer IC CLK BUFFER 2:10 32TQFP IC CLK BUFFER 2:10 3GHZ 32LQFP
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 符合 符合
包装说明 5 X 5 MM, 1 MM HEIGHT, MO-136AA, TQFP-32 7 X 7 MM, 1.40 MM HEIGHT, MO-136BC, LQFP-32 5 X 5 MM, 0.90 MM HEIGHT, MO-220, QFN-32 5 X 5 MM, 0.90 MM HEIGHT, MO-220, QFN-32 5 X 5 MM, 0.90 MM HEIGHT, MO-220, QFN-32 5 X 5 MM, 1 MM HEIGHT, MO-136AA, TQFP-32 7 X 7 MM, 1.40 MM HEIGHT, MO-136BC, LQFP-32 LQFP, LQFP, QFP32,.35SQ,32
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant compliant compliant
其他特性 CAN ALSO BE OPERATED FROM -2.25V TO -3.8V SUPPLY FOR LVECL CAN ALSO BE OPERATED FROM -2.25V TO -3.8V SUPPLY FOR LVECL CAN ALSO BE OPERATED FROM -2.25V TO -3.8V SUPPLY FOR LVECL CAN ALSO BE OPERATED FROM -2.25V TO -3.8V SUPPLY FOR LVECL CAN ALSO BE OPERATED FROM -2.25V TO -3.8V SUPPLY FOR LVECL CAN ALSO BE OPERATED FROM -2.25V TO -3.8V SUPPLY FOR LVECL CAN ALSO BE OPERATED FROM -2.25V TO -3.8V SUPPLY FOR LVECL CAN ALSO BE OPERATED FROM -2.25V TO -3.8V SUPPLY FOR LVECL CAN ALSO BE OPERATED FROM -2.25V TO -3.8V SUPPLY FOR LVECL
输入调节 DIFFERENTIAL MUX DIFFERENTIAL MUX DIFFERENTIAL MUX DIFFERENTIAL MUX DIFFERENTIAL MUX DIFFERENTIAL MUX DIFFERENTIAL MUX DIFFERENTIAL MUX DIFFERENTIAL MUX
JESD-30 代码 S-PQFP-G32 S-PQFP-G32 S-XQCC-N32 S-XQCC-N32 S-XQCC-N32 S-PQFP-G32 S-PQFP-G32 S-PQFP-G32 S-PQFP-G32
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e3 e3
长度 5 mm 7 mm 5 mm 5 mm 5 mm 5 mm 7 mm 7 mm 7 mm
逻辑集成电路类型 LOW SKEW CLOCK DRIVER CLOCK DRIVER CLOCK DRIVER CLOCK DRIVER LOW SKEW CLOCK DRIVER LOW SKEW CLOCK DRIVER LOW SKEW CLOCK DRIVER LOW SKEW CLOCK DRIVER CLOCK DRIVER
功能数量 1 1 1 1 1 1 1 1 1
端子数量 32 32 32 32 32 32 32 32 32
实输出次数 10 10 10 10 10 10 10 20 10
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TFQFP LQFP HVQCCN HVQCCN HVQCCN TFQFP LQFP LQFP LQFP
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, THIN PROFILE, FINE PITCH FLATPACK, LOW PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE FLATPACK, THIN PROFILE, FINE PITCH FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
峰值回流温度(摄氏度) 240 245 245 245 NOT SPECIFIED 245 245 260 260
传播延迟(tpd) 0.41 ns 0.41 ns 0.41 ns 0.41 ns 0.41 ns 0.41 ns 0.41 ns 0.41 ns 0.41 ns
Same Edge Skew-Max(tskwd) 0.046 ns 0.046 ns 0.046 ns 0.046 ns 0.046 ns 0.046 ns 0.046 ns 0.046 ns 0.046 ns
座面最大高度 1.2 mm 1.6 mm 1 mm 1 mm 1 mm 1.2 mm 1.6 mm 1.6 mm 1.6 mm
最大供电电压 (Vsup) 3.8 V 3.8 V 3.8 V 3.8 V 3.8 V 3.8 V 3.8 V 3.8 V 3.8 V
最小供电电压 (Vsup) 2.25 V 2.25 V 2.25 V 2.25 V 2.25 V 2.25 V 2.25 V 2.25 V 2.25 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES YES YES YES YES YES YES
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) TIN LEAD Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) TIN LEAD Tin/Lead (Sn85Pb15) MATTE TIN (800) Matte Tin (Sn)
端子形式 GULL WING GULL WING NO LEAD NO LEAD NO LEAD GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.8 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.8 mm 0.8 mm 0.8 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED
宽度 5 mm 7 mm 5 mm 5 mm 5 mm 5 mm 7 mm 7 mm 7 mm
是否无铅 含铅 含铅 含铅 含铅 - 含铅 - 不含铅 不含铅
厂商名称 Maxim(美信半导体) Maxim(美信半导体) - Maxim(美信半导体) Maxim(美信半导体) - - Maxim(美信半导体) -
零件包装代码 QFP QFP QFN QFN QFN QFP QFP - QFP
针数 32 32 32 32 32 32 32 - 32
系列 9311 9311 9311 9313 9311 9311 9311 9313 -
湿度敏感等级 1 1 1 1 - 1 1 1 1
封装等效代码 TQFP32,.28SQ QFP32,.35SQ,32 LCC32,.2SQ,20 LCC32,.2SQ,20 LCC32,.2SQ,20 TQFP32,.28SQ QFP32,.35SQ,32 - QFP32,.35SQ,32
电源 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V - 2.5/3.3 V
Prop。Delay @ Nom-Sup 0.4 ns 0.4 ns 0.4 ns 0.4 ns 0.4 ns 0.4 ns 0.4 ns - 0.4 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified
ECCN代码 - EAR99 EAR99 EAR99 - EAR99 - - EAR99

 
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