Multiplexer Switch ICs High-Speed, Low-Voltage, 0.7Ohm CMOS Analog Switches/Multiplexers
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | TSSOP |
| 包装说明 | 4.40 MM, MO-153AB, TSSOP-16 |
| 针数 | 16 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 长度 | 5 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 4 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 标称断态隔离度 | 75 dB |
| 通态电阻匹配规范 | 0.3 Ω |
| 最大通态电阻 (Ron) | 1 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 1.8/3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大信号电流 | 0.01 A |
| 最大供电电流 (Isup) | 0.001 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 1.6 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 最长断开时间 | 15 ns |
| 最长接通时间 | 25 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 4.4 mm |
| MAX4782EUE | MAX4782EGE- | MAX4781ETE-T | MAX4781ETE | MAX4783EUE-T | MAX4782EUE-T | MAX4782ETE+T | MAX4783EUE | MAX4782EUE+T | MAX4782ETE+ | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Multiplexer Switch ICs High-Speed, Low-Voltage, 0.7Ohm CMOS Analog Switches/Multiplexers | Multiplexer Switch ICs 4:1 2Ch Low Voltage Analog MUX | Multiplexer Switch ICs | Multiplexer Switch ICs | Analog Switch ICs | Multiplexer Switch ICs | Multiplexer Switch ICs 4:1 2Ch Low Voltage Analog MUX | Analog Switch ICs High-Speed, Low-Voltage, 0.7Ohm CMOS Analog Switches/Multiplexers | Multiplexer Switch ICs 4:1 2Ch Low Voltage Analog MUX | Multiplexer Switch ICs 4:1 2Ch Low Voltage Analog MUX |
| 是否无铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 符合 | 不符合 | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | - | - | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) |
| 零件包装代码 | TSSOP | - | QFN | QFN | TSSOP | TSSOP | QFN | TSSOP | TSSOP | QFN |
| 包装说明 | 4.40 MM, MO-153AB, TSSOP-16 | - | 3 X 3 MM, 0.80 MM HEIGHT, MO-220, TQFN-16 | 3 X 3 MM, 0.80 MM HEIGHT, MO-220, TQFN-16 | 4.40 MM, MO-153AB, TSSOP-16 | 4.40 MM, MO-153AB, TSSOP-16 | HVQCCN, LCC16,.12SQ,20 | 4.40 MM, MO-153AB, TSSOP-16 | TSSOP, TSSOP16,.25 | HVQCCN, LCC16,.12SQ,20 |
| 针数 | 16 | - | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | not_compliant | - | not_compliant | not_compliant | not_compliant | not_compliant | compliant | not_compliant | compliant | compliant |
| ECCN代码 | EAR99 | - | - | EAR99 | - | - | EAR99 | EAR99 | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER | - | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SPDT | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SPDT | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER |
| JESD-30 代码 | R-PDSO-G16 | - | S-XQCC-N16 | S-XQCC-N16 | R-PDSO-G16 | R-PDSO-G16 | S-XQCC-N16 | R-PDSO-G16 | R-PDSO-G16 | S-XQCC-N16 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e3 | e0 | e3 | e3 |
| 长度 | 5 mm | - | 3 mm | 3 mm | 5 mm | 5 mm | 3 mm | 5 mm | 5 mm | 3 mm |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 信道数量 | 4 | - | 8 | 8 | 1 | 4 | 4 | 1 | 4 | 4 |
| 功能数量 | 1 | - | 1 | 1 | 3 | 1 | 1 | 3 | 1 | 1 |
| 端子数量 | 16 | - | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 标称断态隔离度 | 75 dB | - | 75 dB | 75 dB | 75 dB | 75 dB | 75 dB | 75 dB | 75 dB | 75 dB |
| 通态电阻匹配规范 | 0.3 Ω | - | 0.3 Ω | 0.3 Ω | 0.3 Ω | 0.3 Ω | 0.3 Ω | 0.3 Ω | 0.3 Ω | 0.3 Ω |
| 最大通态电阻 (Ron) | 1 Ω | - | 1 Ω | 1 Ω | 1 Ω | 1 Ω | 1 Ω | 1 Ω | 1 Ω | 1 Ω |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | TSSOP | - | HVQCCN | HVQCCN | TSSOP | TSSOP | HVQCCN | TSSOP | TSSOP | HVQCCN |
| 封装等效代码 | TSSOP16,.25 | - | LCC16,.12SQ,20 | LCC16,.12SQ,20 | TSSOP16,.25 | TSSOP16,.25 | LCC16,.12SQ,20 | TSSOP16,.25 | TSSOP16,.25 | LCC16,.12SQ,20 |
| 封装形状 | RECTANGULAR | - | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 240 | - | 245 | 240 | 245 | 245 | 260 | 240 | 260 | 260 |
| 电源 | 1.8/3.3 V | - | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | - | 0.8 mm | 0.8 mm | 1.1 mm | 1.1 mm | 0.8 mm | 1.1 mm | 1.1 mm | 0.8 mm |
| 最大信号电流 | 0.01 A | - | 0.01 A | 0.01 A | - | 0.01 A | 0.01 A | - | 0.01 A | 0.01 A |
| 最大供电电流 (Isup) | 0.001 mA | - | 0.001 mA | 0.001 mA | - | 0.001 mA | 0.001 mA | - | 0.001 mA | 0.001 mA |
| 最大供电电压 (Vsup) | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 1.6 V | - | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V |
| 标称供电电压 (Vsup) | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | - | YES | YES | YES | YES | YES | YES | YES | YES |
| 最长断开时间 | 15 ns | - | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns |
| 最长接通时间 | 25 ns | - | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns |
| 切换 | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | MATTE TIN | Matte Tin (Sn) |
| 端子形式 | GULL WING | - | NO LEAD | NO LEAD | GULL WING | GULL WING | NO LEAD | GULL WING | GULL WING | NO LEAD |
| 端子节距 | 0.65 mm | - | 0.5 mm | 0.5 mm | 0.65 mm | 0.65 mm | 0.5 mm | 0.65 mm | 0.65 mm | 0.5 mm |
| 端子位置 | DUAL | - | QUAD | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | 20 | - | NOT SPECIFIED | 20 | NOT SPECIFIED | NOT SPECIFIED | 30 | 20 | NOT SPECIFIED | 30 |
| 宽度 | 4.4 mm | - | 3 mm | 3 mm | 4.4 mm | 4.4 mm | 3 mm | 4.4 mm | 4.4 mm | 3 mm |
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