HIGHEST PERFORMANCE
conga-TS77
-
Highest Performance COM Express Type 6
-
3rd Generation Intel
®
Core
™
processor-based platform
-
Better transcode HD-HD, HD Video Conferencing
-
Improved Graphics Performance, DirectX
®
11
Formfactor
CPU
COM Express
™
Basic | (95 x 125 mm) | Type 6 Connector Layout
Intel
®
Core
™
i7-3615QE
Intel
®
Core
™
i7-3612QE
Intel
®
Core
™
i7-3555LE
Intel
®
Core
™
i7-3517UE
Intel
®
Core
™
i5-3610ME
Intel
®
Core
™
i3-3120ME
Intel
®
Core
™
i3-3217UE
Intel
®
Celeron
®
847E
Intel
®
Celeron
®
827E
Intel
®
Celeron
®
1020E
Intel
®
Celeron
®
1047UE
Intel
®
Celeron
®
927UE
4x 2.3 GHz
4x 2.1 GHz
2x 2.5 GHz
2x 1.7 GHz
2x 2.7 GHz
2x 2.4 GHz
2x 1.6 GHz
2x 1.1 GHz
1x 1.4 GHz
2x 2.2 GHz
2x 1.4 GHz
1x 1.5 GHz
6 MB Cache
6 MB Cache
4 MB Cache
4 MB Cache
3 MB Cache
3 MB Cache
3 MB Cache
2 MB Cache
1.5 MB Cache
2 MB Cache
2 MB Cache
1 MB Cache
TDP 45 W
TDP 35 W
TDP 25 W
TDP 17 W
TDP 35 W
TDP 35 W
TDP 17 W
TDP 17 W
TDP 17 W
TDP 35 W
TDP 17 W
TDP 17 W
Intel
®
Turbo Boost Technology 2.0 | Intel
®
Hyper-Threading Technology | Integrated dual channel memory controller | up to 25.6 GByte/sec.
memory bandwidth | Integrated Intel
®
HD Graphics 4000 with dynamic frequency up to 1.0GHz | Intel
®
Clear Video HD Technology
DRAM
Chipset
Ethernet
I/O Interfaces
Sound
Graphics
LVDS
Digital Display Interface
CRT Interface
congatec Board Controller
Embedded BIOS Features
Security
2 Sockets | SO-DIMM DDR3 up to 1600MT/s and 16 GByte
Mobile Intel
®
7 Series Chipset: Intel
®
BD82QM77 PCH (Intel
®
BD82HM76 PCH for Intel
®
Celeron
®
equipped modules)
Intel
®
82579 GbE LAN Controller with AMT 8.0 support
7x PCI Express
™
GEN. 2.0 lanes | 1x PEG GEN 3.0 (8GT/s) | 2x Serial ATA
®
with 6 Gb/s | 2x Serial ATA
®
with 3 Gb/s | RAID 0/1/5/10 support
2x ExpressCard
®
| 4x USB 3.0 (XHCI) | 8x USB 2.0 (EHCI) | LPC bus | I²C bus (fast mode / 400 kHz / multi-master)
Digital High Definition Audio Interface with support for multiple audio codecs
Intel
®
Flexible Display Interface (FDI) | OpenCL 1.1 | OpenGL 3.1 and DirectX11 support | Three simultaneous independet displays | High
performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.264 (AVC) support Blu-ray support @ 40 MBit/s | hardware motion compensation
Dual channel LVDS transmitter | Supports flat panels 2x24 Bit interface | VESA mappings | resolutions up to 1920x1200 | Automatic Panel Detection via EDID/EPI
1x SDVO / DisplayPort 1.1 / TMDS (DVI / HDMI) | 2x DisplayPort 1.1 / TMDS (DVI / HDMI)
340.4 MHz RAMDAC | resolutions up to QXGA (2048x1536 @75Hz)
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data Backup
I²C bus (fast mode / 400 kHz / multi-master) | Power Loss Control
AMI Aptio
®
UEFI 2.x firmware | 8 MByte serial SPI firmware flash
The conga-TS77 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM). It is capable of calculating efficient hash and
RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and
e-commerce will benefit also with improved authentication | integrity and confidence levels.
ACPI 4.0 with battery support
Microsoft
®
Windows 8 | Microsoft
®
Windows 7 | Linux | Microsoft
®
Windows
®
embedded Standard
Typ. application: tbd. | see manual for full details | CMOS Battery Backup
Operating: 0 .. +60°C | Storage: -20 .. +80°C
Operating: 10 - 90% r. H. non cond. | Storage: 5 - 95% r. H. non cond.
95 x 125 mm (3.74” x 4.92”)
Power Management
Operating Systems
Power Consumption
Temperature
Humidity
Size
www.congatec.com
conga-TS77
| Order Information
Article
conga-TS77/i7-3615QE
conga-TS77/i7-3612QE
conga-TS77/i7-3555LE
conga-TS77/i7-3517UE
conga-TS77/i5-3610ME
conga-TS77/i3-3120ME
conga-TS77/i3-3217UE
conga-TS77/827E
conga-TS77/847E
conga-TS77/1047UE
conga-TS77/1020E
conga-TS77/927UE
conga-TS67/HSP-HP-B
conga-TS67/HSP-HP-T
conga-TS67/CSP-HP-B
conga-TS67/CSP-HP-T
conga-TS67/CSA-HP-B
conga-TS67/CSA-HP-T
DDR3L-SODIMM-1600 (2GB)
DDR3L-SODIMM-1600 (4GB)
DDR3L-SODIMM-1600 (8GB)
PN
046506
046501
046502
046503
046504
046507
046505
046508
046509
046510
046511
046512
046450
046451
046452
046453
046454
046455
068755
068756
068757
Description
Intel
®
Core
™
i7-3615QE quad core processor with 2.3GHz | 6MB L3 cache and 1600MT/s dual channel DDR3 memory interface
Intel
®
Core
™
i7-3612QE quad core processor with 2.1GHz | 6MB L3 cache and 1600MT/s dual channel DDR3 memory interface
Intel
®
Core
™
i7-3555LE dual core processor with 2.5GHz | 4MB L3 cache and 1600MT/s dual channel DDR3 memory interface
Intel
®
Core
™
i7-3517UE dual core processor with 1.7GHz | 4MB L3 cache and 1600MT/s dual channel DDR3 memory interface (17W)
Intel
®
Core
™
i5-3610ME dual core processor with 2.7GHz | 3MB L3 cache and 1600MT/s dual channel DDR3 memory interface (35W)
Intel
®
Core
™
i3-3120ME dual core processor with 2.4GHz | 3MB L3 cache and 1600MT/s dual channel DDR3 memory interface
Intel
®
Core
™
i3-3217UE dual core processor with 1.6GHz | 3MB L3 cache and 1600MT/s dual channel DDR3 memory interface (17W)
Intel
®
Celeron
™
827E single core processor with 1.4GHz | 1.5MB L3 cache and 1333MT/s dual channel DDR3 memory interface
Intel
®
Celeron
™
847E dual core processor with 1.1GHz | 2MB L3 cache and 1333MT/s dual channel DDR3 memory interface
Intel
®
Celeron
™
1047UE dual core processor with 1.4GHz | 2MB L3 cache and 1333MT/s dual channel DDR3 memory interface
Intel
®
Celeron
™
1020E dual core processor with 2.2GHz | 2MB L3 cache and 1333MT/s dual channel DDR3 memory interface
Intel
®
Celeron
™
927UE single core processor with 1.5GHz | 1MB L3 cache and 1333MT/s dual channel DDR3 memory interface
Standard heatspreader for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes. All standoffs
are with 2.7mm bore hole
Standard heatspreader for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes. All standoffs
are M2.5mm thread
Standard passive cooling solution for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes |
15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole
Standard passive cooling solution for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes |
15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread
Standard active cooling solution for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes |
15mm silver fins | 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole
Standard active cooling solution for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes |
15mm silver fins | 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 2GB RAM
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM
Accessories
conga-TEVAL
conga-LDVI/EPI
COM-Express-carrierboard-Socket-5
COM-Express-carrierboard-Socket-8
065800
011115
400007
400004
Evaluation carrier board for Type 6 COM-Express-modules
LVDS to DVI converter board for digital flat panels with onboard EEPROM
Connector for COM-Express carrier boards | height 5mm | packing unit 4 pieces
Connector for COM-Express carrier boards | height 8mm | packing unit 4 pieces
© 2016 congatec AG. All rights reserved.
All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee
of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their
respective trademark holders. These trademark holders are not affiliated with congatec AG. Rev. December 12, 2016 MR
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