Datasheet> 器件分类 > 半导体> 嵌入式处理器和控制器> MK02FN128VFM10

MK02FN128VFM10: 产品描述ARM Microcontrollers - MCU 128KB Flash 100MHz Entry Level 32QFN; 产品类别半导体嵌入式处理器和控制器; 文件大小834KB，共61页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

下载文档详细参数选型对比全文预览

MK02FN128VFM10在线购买

供应商	器件名称	价格	最低购买	库存
	MK02FN128VFM10	-	-	点击查看	点击购买

MK02FN128VFM10概述

ARM Microcontrollers - MCU 128KB Flash 100MHz Entry Level 32QFN

MK02FN128VFM10规格参数

参数名称	属性值
Product Attribute	Attribute Value
制造商 Manufacturer	NXP(恩智浦)
产品种类 Product Category	ARM Microcontrollers - MCU
RoHS	Details
安装风格 Mounting Style	SMD/SMT
封装 / 箱体 Package / Case	QFN-32
Core	ARM Cortex M4
Data Bus Width	32 bit
Maximum Clock Frequency	100 MHz
Program Memory Size	128 kB
Data RAM Size	16 kB
ADC Resolution	16 bit
Number of I/Os	26 I/O
工作电源电压 Operating Supply Voltage	3.3 V
最小工作温度 Minimum Operating Temperature	- 40 C
最大工作温度 Maximum Operating Temperature	+ 105 C
接口类型 Interface Type	I2C, SPI, UART
高度 Height	1 mm
长度 Length	5 mm
产品 Product	MCU
Program Memory Type	Flash
宽度 Width	5 mm
Data RAM Type	SRAM
Analog Supply Voltage	3.3 V
DAC Resolution	6 bit, 12 bit
I/O Voltage	3.3 V
Moisture Sensitive	Yes
Number of ADC Channels	1
Number of Timers/Counters	5 Timer
工厂包装数量 Factory Pack Quantity	490
电源电压-最大 Supply Voltage - Max	3.6 V
电源电压-最小 Supply Voltage - Min	1.71 V
单位重量 Unit Weight	0.002275 oz

文档预览

下载PDF文档

全文
预览

NXP Semiconductors

Data Sheet: Technical Data

K02P64M100SFA

Rev. 4, 08/2016

Kinetis K02 64 KB/128 KB Flash

100 MHz ARM® Cortex®-M4 Based Microcontroller with FPU

Ideal for low-power applications that require processing

efficiency and high peripheral integration. These devices share

the comprehensive enablement and scalability of the Kinetis

family.

This product offers:

• Run power consumption down to 117.5 µA/MHz and static

power consumption down to 2.8 µA with full state retention

and 5.7 µs wakeup. Lowest static mode down to 70 nA.

• Excellent processing efficiency, 100 MHz ARM

Cortex

M4-based device with floating-point unit in a tiny form factor

MK02FN128VLH10

MK02FN128VLF10

MK02FN128VFM10

MK02FN64VLH10

MK02FN64VLF10

MK02FN64VFM10

64 LQFP (LH)

10 x 10 x 1.4 Pitch 0.5

48 LQFP (LF)

7 x 7 x 1.4 Pitch 0.5

32 QFN (FM)

5 x 5 x 1 Pitch 0.5 mm

Performance

• 100 MHz ARM Cortex-M4 core with DSP instructions

delivering 1.25 Dhrystone MIPS per MHz

Memories and memory interfaces

• Up to 128 KB of embedded flash and 16 KB of RAM

• Preprogrammed Kinetis flashloader for one-time, in-

system factory programming

Analog modules

• One 16-bit SAR ADC (1.2 MS/s in 12bit mode)

• One 12-bit DAC

• Two analog comparators (CMP) with 6- bit DAC

• Accurate internal voltage reference (not available in

32-pin QFN package)

Communication interfaces

• One SPI module

• Two UART modules

• One I2C: Support for up to 1 Mbps operation

System peripherals

• Flexible low-power modes, multiple wake up sources

• 4-channel DMA controller

• Independent External and Software Watchdog monitor

Timers

• One 6-channel general-purpose/PWM timer

Clocks

• Two 2-channel general-purpose timers with

• Crystal oscillator: 32-40 kHz or 3-32 MHz

quadrature decoder functionality (FTM2 does not

• Three internal oscillators: 32 kHz, 4 MHz, and 48 MHz

have external pins on the 32-pin QFN or the 48-pin

• Multi-purpose clock generator with FLL

LQFP package)

• Periodic interrupt timers

Security and integrity modules

• 16-bit low-power timer

• Hardware CRC module

• Programmable delay block

• 128-bit unique identification (ID) number per chip

• Flash access control to protect proprietary software

Operating Characteristics

• Voltage range (including flash writes): 1.71 to 3.6 V

Human-machine interface

• Temperature range (ambient): -40 to 105°C

• Up to 46 general-purpose I/O (GPIO)

NXP reserves the right to change the production detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ratings.................................................................................... 5

1.1 Thermal handling ratings................................................. 5

1.2 Moisture handling ratings................................................ 5

1.3 ESD handling ratings....................................................... 5

1.4 Voltage and current operating ratings............................. 5

2 General................................................................................... 6

2.1 AC electrical characteristics.............................................6

2.2 Nonswitching electrical specifications..............................6

2.2.1 Voltage and current operating requirements....... 6

2.2.2 LVD and POR operating requirements................7

2.2.3 Voltage and current operating behaviors.............8

2.2.4 Power mode transition operating behaviors........ 9

2.2.5 Power consumption operating behaviors............ 10

2.2.6 EMC radiated emissions operating behaviors..... 16

2.2.7 Designing with radiated emissions in mind..........17

2.2.8 Capacitance attributes.........................................17

2.3 Switching specifications...................................................17

2.3.1 Device clock specifications..................................17

2.3.2 General switching specifications......................... 18

2.4 Thermal specifications..................................................... 18

2.4.1 Thermal operating requirements......................... 18

2.4.2 Thermal attributes................................................19

3 Peripheral operating requirements and behaviors.................. 20

3.1 Core modules.................................................................. 20

3.1.1 SWD electricals .................................................. 20

3.1.2 JTAG electricals.................................................. 21

3.2 System modules.............................................................. 24

3.3 Clock modules................................................................. 24

3.3.1 MCG specifications..............................................24

3.3.2 IRC48M specifications.........................................26

3.3.3 Oscillator electrical specifications........................26

3.4 Memories and memory interfaces................................... 29

3.4.1 Flash electrical specifications.............................. 29

3.5 Security and integrity modules........................................ 30

3.6 Analog............................................................................. 30

3.6.1

3.6.2

3.6.3

ADC electrical specifications............................... 30

CMP and 6-bit DAC electrical specifications....... 34

12-bit DAC electrical characteristics....................37

3.6.4 Voltage reference electrical specifications.......... 40

3.7 Timers..............................................................................41

3.8 Communication interfaces............................................... 41

DSPI switching specifications (limited voltage

range).................................................................. 42

3.8.2 DSPI switching specifications (full voltage

range).................................................................. 43

3.8.3 Inter-Integrated Circuit Interface (I2C) timing...... 45

3.8.4 UART switching specifications............................ 47

4 Dimensions............................................................................. 47

4.1 Obtaining package dimensions....................................... 47

5 Pinout...................................................................................... 47

5.1 K02F Signal Multiplexing and Pin Assignments.............. 47

5.2 Recommended connection for unused analog and

digital pins........................................................................50

5.3 K02F Pinouts................................................................... 51

6 Part identification.....................................................................54

6.1 Description.......................................................................54

6.2 Format............................................................................. 54

6.3 Fields............................................................................... 55

6.4 Example...........................................................................55

6.5 48-pin LQFP part marking............................................... 56

6.6 32-pin QFN part marking................................................. 56

7 Terminology and guidelines.................................................... 56

7.1 Definitions........................................................................ 56

7.2 Examples......................................................................... 57

7.3 Typical-value conditions.................................................. 57

7.4 Relationship between ratings and operating

requirements....................................................................58

7.5 Guidelines for ratings and operating requirements..........58

8 Revision History...................................................................... 58

3.8.1