NXP Semiconductors
Data Sheet: Technical Data
Document Number K20P144M120SF3
Rev. 7, 02/2018
Supports the following:
MK20FX512VLQ12,
MK20FN1M0VLQ12,
MK20FX512VMD12,
MK20FN1M0VMD12
Key features
• Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
• Performance
– Up to 120 MHz Arm® Cortex®-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
• Memories and memory interfaces
– Up to 1024 KB program flash memory on non-
FlexMemory devices
– Up to 512 KB program flash memory on
FlexMemory devices
– Up to 512 KB FlexNVM on FlexMemory devices
– 16 KB FlexRAM on FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
– NAND flash controller interface
• Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
• System peripherals
– Multiple low-power modes to provide power
optimization based on application requirements
– Memory protection unit with multi-master
protection
– 32-channel DMA controller, supporting up to 128
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
• Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– 128-bit unique identification (ID) number per chip
• Human-machine interface
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
• Analog modules
– Four 16-bit SAR ADCs
– Programmable gain amplifier (PGA) (up to x64)
integrated into each ADC
– Two 12-bit DACs
– Four analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
– Voltage reference
• Timers
– Programmable delay block
– Two 8-channel motor control/general purpose/PWM
timers
– Two 2-channel quadrature decoder/general purpose
timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
• Communication interfaces
– USB high-/full-/low-speed On-the-Go controller
with ULPI interface
– USB full-/low-speed On-the-Go controller with on-
chip transceiver
– USB Device Charger detect (USBDCD)
– Two Controller Area Network (CAN) modules
– Three SPI modules
– Two I2C modules
– Six UART modules
– Secure Digital Host Controller (SDHC)
– Two I2S modules
K20 Sub-Family
K20P144M120SF3
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
Table of Contents
1 Ordering parts.......................................................................................4
1.1 Determining valid orderable parts............................................... 4
2 Part identification................................................................................. 4
2.1 Description...................................................................................4
2.2 Format.......................................................................................... 4
2.3 Fields............................................................................................4
2.4 Example....................................................................................... 5
3 Terminology and guidelines.................................................................5
3.1 Definitions................................................................................... 5
3.2 Examples......................................................................................5
3.3 Typical-value conditions..............................................................6
3.4 Relationship between ratings and operating requirements.......... 6
3.5 Guidelines for ratings and operating requirements......................7
4 Ratings..................................................................................................7
4.1 Thermal handling ratings............................................................. 7
4.2 Moisture handling ratings............................................................ 8
4.3 ESD handling ratings................................................................... 8
4.4 Voltage and current operating ratings..........................................8
5 General................................................................................................. 9
5.1 AC electrical characteristics........................................................ 9
5.2 Nonswitching electrical specifications........................................ 9
5.2.1
5.2.2
5.2.3
5.2.4
5.2.5
5.2.6
5.2.7
5.2.8
Voltage and current operating requirements............... 9
LVD and POR operating requirements....................... 10
Voltage and current operating behaviors.....................11
Power mode transition operating behaviors................ 13
Power consumption operating behaviors.....................14
EMC radiated emissions operating behaviors............. 17
Designing with radiated emissions in mind.................18
Capacitance attributes..................................................18
6.8.7
6.8.8
6.8.9
6.8.10
6.8.11
6.2 System modules........................................................................... 26
6.3 Clock modules............................................................................. 26
6.3.1
6.3.2
6.3.3
MCG specifications..................................................... 26
Oscillator electrical specifications...............................28
32 kHz oscillator electrical characteristics.................. 30
6.4 Memories and memory interfaces................................................31
6.4.1
6.4.2
6.4.3
6.4.4
Flash (FTFE) electrical specifications.........................31
EzPort switching specifications...................................35
NAND flash controller specifications......................... 36
Flexbus switching specifications.................................39
6.5 Security and integrity modules.................................................... 42
6.6 Analog..........................................................................................42
6.6.1
6.6.2
6.6.3
6.6.4
ADC electrical specifications...................................... 42
CMP and 6-bit DAC electrical specifications............. 50
12-bit DAC electrical characteristics...........................52
Voltage reference electrical specifications..................55
6.7 Timers.......................................................................................... 56
6.8 Communication interfaces........................................................... 56
6.8.1
6.8.2
6.8.3
6.8.4
6.8.5
6.8.6
USB electrical specifications.......................................56
USB DCD electrical specifications............................. 57
USB VREG electrical specifications...........................57
ULPI timing specifications..........................................58
CAN switching specifications..................................... 59
DSPI switching specifications (limited voltage
range)...........................................................................59
DSPI switching specifications (full voltage range)..... 61
Inter-Integrated Circuit Interface (I2C) timing............62
UART switching specifications...................................63
SDHC specifications................................................... 64
I2S/SAI switching specifications................................ 65
5.3 Switching specifications.............................................................. 18
5.3.1
5.3.2
Device clock specifications......................................... 18
General switching specifications.................................19
6.9 Human-machine interfaces (HMI)...............................................71
6.9.1
TSI electrical specifications........................................ 71
5.4 Thermal specifications................................................................. 20
5.4.1
5.4.2
Thermal operating requirements..................................20
Thermal attributes........................................................21
7 Dimensions...........................................................................................72
7.1 Obtaining package dimensions.................................................... 72
8 Pinout................................................................................................... 73
8.1 Pins with active pull control after reset....................................... 73
8.2 K20 Signal Multiplexing and Pin Assignments...........................73
8.3 K20 pinouts..................................................................................80
9 Revision History...................................................................................81
6 Peripheral operating requirements and behaviors................................ 22
6.1 Core modules............................................................................... 22
6.1.1
6.1.2
Debug trace timing specifications............................... 22
JTAG electricals.......................................................... 23
K20 Sub-Family, Rev. 7, 02/2018
NXP Semiconductors
3
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to
nxp.com
and perform a part number search for the
following device numbers: PK20 and MK20
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q K## A M FFF T PP CC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Q
K##
A
M
FFF
Qualification status
Kinetis family
Key attribute
Flash memory type
Program flash memory size
Description
Values
• M = Fully qualified, general market flow
• P = Prequalification
• K20
• F = Cortex-M4 w/ DSP and FPU
• N = Program flash only
• X = Program flash and FlexMemory
• 512 = 512 KB
• 1M0 = 1 MB
Table continues on the next page...
K20 Sub-Family, Rev. 7, 02/2018
4
NXP Semiconductors
Terminology and guidelines
Field
T
PP
CC
N
Description
Temperature range (°C)
Package identifier
Maximum CPU frequency (MHz)
Packaging type
• V = –40 to 105
• C = –40 to 85
• LQ = 144 LQFP (20 mm x 20 mm)
• MD = 144 MAPBGA (13 mm x 13 mm)
• 12 = 120 MHz
• R = Tape and reel
• (Blank) = Trays
Values
2.4 Example
This is an example part number:
MK20FN1M0VLQ12
3 Terminology and guidelines
3.1 Definitions
Key terms are defined in the following table:
Term
Rating
Definition
A minimum or maximum value of a technical characteristic that, if exceeded, may cause permanent
chip failure:
•
Operating ratings
apply during operation of the chip.
•
Handling ratings
apply when the chip is not powered.
NOTE:
The likelihood of permanent chip failure increases rapidly as soon as a characteristic
begins to exceed one of its operating ratings.
Operating requirement
Operating behavior
Typical value
A specified value or range of values for a technical characteristic that you must guarantee during
operation to avoid incorrect operation and possibly decreasing the useful life of the chip
A specified value or range of values for a technical characteristic that are guaranteed during
operation if you meet the operating requirements and any other specified conditions
A specified value for a technical characteristic that:
• Lies within the range of values specified by the operating behavior
• Is representative of that characteristic during operation when you meet the
typical-value
conditions
or other specified conditions
NOTE:
Typical values are provided as design guidelines and are neither tested nor guaranteed.
K20 Sub-Family, Rev. 7, 02/2018
NXP Semiconductors
5
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