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MK20FN1M0VMD12: 产品描述ARM Microcontrollers - MCU KINETIS 1MB USB; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小1MB，共83页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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MK20FN1M0VMD12概述

ARM Microcontrollers - MCU KINETIS 1MB USB

MK20FN1M0VMD12规格参数

参数名称	属性值
Brand Name	Freescale
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	BGA
包装说明	13 X 13 MM, MAPBGA-144
针数	144
Reach Compliance Code	unknown
ECCN代码	3A991.A.2
具有ADC	YES
地址总线宽度
位大小	32
CPU系列	CORTEX-M4F
最大时钟频率	50 MHz
DAC 通道	YES
DMA 通道	YES
外部数据总线宽度
JESD-30 代码	S-PBGA-B144
长度	13 mm
湿度敏感等级	3
端子数量	144
最高工作温度	105 °C
最低工作温度	-40 °C
PWM 通道	YES
封装主体材料	PLASTIC/EPOXY
封装代码	LBGA
封装等效代码	BGA144,12X12,40
封装形状	SQUARE
封装形式	GRID ARRAY, LOW PROFILE
峰值回流温度（摄氏度）	260
电源	1.8/3.3,2.5/3.3 V
认证状态	Not Qualified
RAM（字节）	131072
ROM（单词）	1048576
ROM可编程性	FLASH
座面最大高度	1.7 mm
速度	120 MHz
最大压摆率	177 mA
最大供电电压	3.6 V
最小供电电压	1.71 V
标称供电电压	3.3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Silver/Copper - with Nickel barrier
端子形式	BALL
端子节距	1 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	40
宽度	13 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC

文档解析

这份文档是NXP Semiconductors发布的关于K20系列微控制器的技术数据手册（Data Sheet），文档编号为K20P144M120SF3，版本7，发布于2018年2月。以下是一些值得关注的技术信息：

微控制器家族: K20 Sub-Family，包括MK20FX512VLQ12, MK20FN1M0VLQ12, MK20FX512VMD12, MK20FN1M0VMD12等型号。
核心性能:
- 基于Arm Cortex-M4核心，具有DSP指令集，最高运行频率可达120 MHz。
- 性能达到1.25 Dhrystone MIPS每MHz。
存储器:
- 非FlexMemory设备上最多1024 KB的程序闪存。
- FlexMemory设备上最多512 KB的程序闪存和最多512 KB的FlexNVM。
时钟系统:
- 支持3到32 MHz的晶振振荡器。
- 32 kHz晶振振荡器。
- 多用途时钟发生器。
系统外设:
- 多种低功耗模式以优化应用需求。
- 具有多主保护的存储器保护单元。
- 32通道DMA控制器，支持最多128个请求源。
安全和完整性模块:
- 硬件CRC模块支持快速循环冗余检查。
- 每个芯片有128位的唯一识别码。
人机界面:
- 低功耗硬件触摸传感器接口（TSI）。
- 通用输入/输出。
模拟模块:
- 四个16位SAR ADC。
- 每个ADC集成可编程增益放大器（PGA）。
- 两个12位DAC。
- 四个包含6位DAC和可编程参考输入的模拟比较器。
定时器:
- 可编程延迟块。
- 多个电机控制/通用/PWM定时器。
- 周期性中断定时器。
- 16位低功耗定时器。
通信接口:
- USB高/全/低速On-the-Go控制器。
- 两个CAN模块。
- 三个SPI模块。
- 两个I2C模块。
- 六个UART模块。
电气特性:
- 包括电压和电流的运行要求，以及各种电源模式下的功耗行为。
封装信息:
- 提供了144引脚LQFP和144引脚MAPBGA的封装信息。
引脚分配:
- 详细列出了不同封装的引脚分配和信号复用。
修订历史:
- 文档的修订历史，显示了自首次发布以来的所有重要更改。

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NXP Semiconductors

Data Sheet: Technical Data

Document Number K20P144M120SF3

Rev. 7, 02/2018

Supports the following:

MK20FX512VLQ12,

MK20FN1M0VLQ12,

MK20FX512VMD12,

MK20FN1M0VMD12

Key features

• Operating Characteristics

– Voltage range: 1.71 to 3.6 V

– Flash write voltage range: 1.71 to 3.6 V

– Temperature range (ambient): -40 to 105°C

• Performance

– Up to 120 MHz Arm® Cortex®-M4 core with DSP

instructions delivering 1.25 Dhrystone MIPS per

MHz

• Memories and memory interfaces

– Up to 1024 KB program flash memory on non-

FlexMemory devices

– Up to 512 KB program flash memory on

FlexMemory devices

– Up to 512 KB FlexNVM on FlexMemory devices

– 16 KB FlexRAM on FlexMemory devices

– Up to 128 KB RAM

– Serial programming interface (EzPort)

– FlexBus external bus interface

– NAND flash controller interface

• Clocks

– 3 to 32 MHz crystal oscillator

– 32 kHz crystal oscillator

– Multi-purpose clock generator

• System peripherals

– Multiple low-power modes to provide power

optimization based on application requirements

– Memory protection unit with multi-master

protection

– 32-channel DMA controller, supporting up to 128

request sources

– External watchdog monitor

– Software watchdog

– Low-leakage wakeup unit

• Security and integrity modules

– Hardware CRC module to support fast cyclic

redundancy checks

– 128-bit unique identification (ID) number per chip

• Human-machine interface

– Low-power hardware touch sensor interface (TSI)

– General-purpose input/output

• Analog modules

– Four 16-bit SAR ADCs

– Programmable gain amplifier (PGA) (up to x64)

integrated into each ADC

– Two 12-bit DACs

– Four analog comparators (CMP) containing a 6-bit

DAC and programmable reference input

– Voltage reference

• Timers

– Programmable delay block

– Two 8-channel motor control/general purpose/PWM

timers

– Two 2-channel quadrature decoder/general purpose

timers

– Periodic interrupt timers

– 16-bit low-power timer

– Carrier modulator transmitter

– Real-time clock

• Communication interfaces

– USB high-/full-/low-speed On-the-Go controller

with ULPI interface

– USB full-/low-speed On-the-Go controller with on-

chip transceiver

– USB Device Charger detect (USBDCD)

– Two Controller Area Network (CAN) modules

– Three SPI modules

– Two I2C modules

– Six UART modules

– Secure Digital Host Controller (SDHC)

– Two I2S modules

K20 Sub-Family

K20P144M120SF3

NXP reserves the right to change the production detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ordering parts.......................................................................................4

1.1 Determining valid orderable parts............................................... 4

2 Part identification................................................................................. 4

2.1 Description...................................................................................4

2.2 Format.......................................................................................... 4

2.3 Fields............................................................................................4

2.4 Example....................................................................................... 5

3 Terminology and guidelines.................................................................5

3.1 Definitions................................................................................... 5

3.2 Examples......................................................................................5

3.3 Typical-value conditions..............................................................6

3.4 Relationship between ratings and operating requirements.......... 6

3.5 Guidelines for ratings and operating requirements......................7

4 Ratings..................................................................................................7

4.1 Thermal handling ratings............................................................. 7

4.2 Moisture handling ratings............................................................ 8

4.3 ESD handling ratings................................................................... 8

4.4 Voltage and current operating ratings..........................................8

5 General................................................................................................. 9

5.1 AC electrical characteristics........................................................ 9

5.2 Nonswitching electrical specifications........................................ 9

5.2.1

5.2.2

5.2.3

5.2.4

5.2.5

5.2.6

5.2.7

5.2.8

Voltage and current operating requirements............... 9

LVD and POR operating requirements....................... 10

Voltage and current operating behaviors.....................11

Power mode transition operating behaviors................ 13

Power consumption operating behaviors.....................14

EMC radiated emissions operating behaviors............. 17

Designing with radiated emissions in mind.................18

Capacitance attributes..................................................18

6.8.7

6.8.8

6.8.9

6.8.10

6.8.11

6.2 System modules........................................................................... 26

6.3 Clock modules............................................................................. 26

6.3.1

6.3.2

6.3.3

MCG specifications..................................................... 26

Oscillator electrical specifications...............................28

32 kHz oscillator electrical characteristics.................. 30

6.4 Memories and memory interfaces................................................31

6.4.1

6.4.2

6.4.3

6.4.4

Flash (FTFE) electrical specifications.........................31

EzPort switching specifications...................................35

NAND flash controller specifications......................... 36

Flexbus switching specifications.................................39

6.5 Security and integrity modules.................................................... 42

6.6 Analog..........................................................................................42

6.6.1

6.6.2

6.6.3

6.6.4

ADC electrical specifications...................................... 42

CMP and 6-bit DAC electrical specifications............. 50

12-bit DAC electrical characteristics...........................52

Voltage reference electrical specifications..................55

6.7 Timers.......................................................................................... 56

6.8 Communication interfaces........................................................... 56

6.8.1

6.8.2

6.8.3

6.8.4

6.8.5

6.8.6

USB electrical specifications.......................................56

USB DCD electrical specifications............................. 57

USB VREG electrical specifications...........................57

ULPI timing specifications..........................................58

CAN switching specifications..................................... 59

DSPI switching specifications (limited voltage

range)...........................................................................59

DSPI switching specifications (full voltage range)..... 61

Inter-Integrated Circuit Interface (I2C) timing............62

UART switching specifications...................................63

SDHC specifications................................................... 64

I2S/SAI switching specifications................................ 65

5.3 Switching specifications.............................................................. 18

5.3.1

5.3.2

Device clock specifications......................................... 18

General switching specifications.................................19

6.9 Human-machine interfaces (HMI)...............................................71

6.9.1

TSI electrical specifications........................................ 71

5.4 Thermal specifications................................................................. 20

5.4.1

5.4.2

Thermal operating requirements..................................20

Thermal attributes........................................................21

7 Dimensions...........................................................................................72

7.1 Obtaining package dimensions.................................................... 72

8 Pinout................................................................................................... 73

8.1 Pins with active pull control after reset....................................... 73

8.2 K20 Signal Multiplexing and Pin Assignments...........................73

8.3 K20 pinouts..................................................................................80

9 Revision History...................................................................................81

6 Peripheral operating requirements and behaviors................................ 22

6.1 Core modules............................................................................... 22

6.1.1

6.1.2

Debug trace timing specifications............................... 22

JTAG electricals.......................................................... 23

K20 Sub-Family, Rev. 7, 02/2018