Audio Amplifiers DirectDrive 130mW Headphone Amplifier
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC16,.12SQ,20 |
| 针数 | 16 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| 标称带宽 | 22 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER |
| JESD-30 代码 | S-XQCC-N16 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 2 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 标称输出功率 | 0.13 W |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC16,.12SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大压摆率 | 13 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.4 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3 mm |
| MAX9722BETE+ | MAX9722BEUE | MAX9722BEUE-T | MAX9722AEUE | MAX9722BEUE+T | MAX9722AETE+T | MAX9722AEUE-T | MAX9722BETE+T | MAX9722AETE+ | MAX9722AEUE+ | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Audio Amplifiers DirectDrive 130mW Headphone Amplifier | Audio Amplifiers | Audio Amplifiers | Audio Amplifiers | Audio Amplifiers DirectDrive 130mW Headphone Amplifier | Audio Amplifiers DirectDrive 130mW Headphone Amplifier | Audio Amplifiers | Audio Amplifiers DirectDrive 130mW Headphone Amplifier | Audio Amplifiers DirectDrive 130mW Headphone Amplifier | Audio Amplifiers DirectDrive 130mW Headphone Amplifier |
| 是否无铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 不符合 | 符合 | 符合 | 不符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | QFN | TSSOP | TSSOP | TSSOP | TSSOP | QFN | TSSOP | QFN | QFN | TSSOP |
| 包装说明 | HVQCCN, LCC16,.12SQ,20 | 4.40 MM, MO-153AB, TSSOP-16 | 4.40 MM, MO-153AB, TSSOP-16 | 4.40 MM, MO-153AB, TSSOP-16 | TSSOP, TSSOP16,.25 | HVQCCN, LCC16,.12SQ,20 | 4.40 MM, MO-153AB, TSSOP-16 | HVQCCN, LCC16,.12SQ,20 | HVQCCN, LCC16,.12SQ,20 | TSSOP, TSSOP16,.25 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compliant | not_compliant | not_compliant | not_compliant | compliant | compliant | not_compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 标称带宽 | 22 kHz | 22 kHz | 22 kHz | 22 kHz | 22 kHz | 22 kHz | 22 kHz | 22 kHz | 22 kHz | 22 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
| JESD-30 代码 | S-XQCC-N16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | S-XQCC-N16 | R-PDSO-G16 | S-XQCC-N16 | S-XQCC-N16 | R-PDSO-G16 |
| JESD-609代码 | e3 | e0 | e0 | e0 | e3 | e3 | e0 | e3 | e3 | e3 |
| 长度 | 3 mm | 5 mm | 5 mm | 5 mm | 5 mm | 3 mm | 5 mm | 3 mm | 3 mm | 5 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 信道数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 标称输出功率 | 0.13 W | 0.13 W | 0.13 W | 0.13 W | 0.13 W | 0.13 W | 0.13 W | 0.13 W | 0.13 W | 0.13 W |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | TSSOP | TSSOP | TSSOP | TSSOP | HVQCCN | TSSOP | HVQCCN | HVQCCN | TSSOP |
| 封装等效代码 | LCC16,.12SQ,20 | TSSOP16,.25 | TSSOP16,.25 | TSSOP16,.25 | TSSOP16,.25 | LCC16,.12SQ,20 | TSSOP16,.25 | LCC16,.12SQ,20 | LCC16,.12SQ,20 | TSSOP16,.25 |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 245 | 240 | 245 | 260 | 260 | 245 | 260 | 260 | 260 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 0.8 mm | 1.1 mm | 0.8 mm | 0.8 mm | 1.1 mm |
| 最大压摆率 | 13 mA | 13 mA | 13 mA | 13 mA | 13 mA | 13 mA | 13 mA | 13 mA | 13 mA | 13 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | GULL WING | NO LEAD | NO LEAD | GULL WING |
| 端子节距 | 0.5 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.5 mm | 0.65 mm | 0.5 mm | 0.5 mm | 0.65 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm | 3 mm | 4.4 mm | 3 mm | 3 mm | 4.4 mm |
| Factory Lead Time | 6 weeks | - | - | - | 17 weeks | 19 weeks | - | 18 weeks | 6 weeks | 18 weeks |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
