NLU1GT32
Single 2-Input OR Gate,
TTL Level
LSTTL−Compatible Inputs
The NLU1GT32 MiniGatet is an advanced CMOS high−speed
2−input OR gate in ultra−small footprint.
The device input is compatible with TTL−type input thresholds and
the output has a full 5.0 V CMOS level output swing.
The NLU1GT32 input and output structures provide protection
when voltages up to 7.0 V are applied, regardless of the supply
voltage.
Features
1
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MARKING
DIAGRAMS
UDFN6
1.2 x 1.0
CASE 517AA
5M
•
•
•
•
•
•
•
•
High Speed: t
PD
= 3.7 ns (Typ) @ V
CC
= 5.0 V
Low Power Dissipation: I
CC
= 2
mA
(Max) at T
A
= 25°C
TTL−Compatible Input: V
IL
= 0.8 V; V
IH
= 2.0 V
CMOS−Compatible Output:
V
OH
> 0.8 V
CC
; V
OL
< 0.1 V
CC
@ Load
Power Down Protection Provided on inputs
Balanced Propagation Delays
Ultra−Small Packages
These are Pb−Free Devices
1
ULLGA6
1.0 x 1.0
CASE 613AD
5M
1
ULLGA6
1.2 x 1.0
CASE 613AE
5M
1
IN B
1
6
V
CC
ULLGA6
1.45 x 1.0
CASE 613AF
5M
UDFN6
1.0 x 1.0
CASE 517BX
IN A
2
5
NC
1
UDFN6
1.45 x 1.0
CASE 517AQ
1
5
M
= Device Marking
= Date Code
M
L
T
M
GND
3
4
OUT Y
Figure 1. Pinout
(Top View)
IN A
IN B
≥
1
OUT Y
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Figure 2. Logic Symbol
PIN ASSIGNMENT
1
2
3
4
5
6
IN B
IN A
GND
OUT Y
NC
V
CC
A
L
L
H
H
FUNCTION TABLE
Input
B
L
H
L
H
Output
Y
L
H
H
H
©
Semiconductor Components Industries, LLC, 2013
July, 2013
−
Rev. 6
1
Publication Order Number:
NLU1GT32/D
NLU1GT32
MAXIMUM RATINGS
Symbol
V
CC
V
IN
V
OUT
I
IK
I
OK
I
O
I
CC
I
GND
T
STG
T
L
T
J
MSL
F
R
I
LATCHUP
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Source/Sink Current
DC Supply Current Per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Moisture Sensitivity
Flammability Rating
Oxygen Index: 28 to 34
V
IN
< GND
V
OUT
< GND
Parameter
Value
−0.5
to +7.0
−0.5
to +7.0
−0.5
to +7.0
−20
±20
±12.5
±25
±25
−65
to +150
260
150
Level 1
UL 94 V−0 @ 0.125 in
±500
mA
Unit
V
V
V
mA
mA
mA
mA
mA
°C
°C
°C
Latchup Performance Above V
CC
and Below GND at 125°C (Note 2)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
IN
V
OUT
T
A
Dt/DV
Positive DC Supply Voltage
Digital Input Voltage
Output Voltage
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
V
CC
= 3.3 V
±
0.3 V
V
CC
= 5.0 V
±
0.5 V
Parameter
Min
1.65
0
0
−55
0
0
Max
5.5
5.5
5.5
+125
100
20
Unit
V
V
V
°C
ns/V
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2
NLU1GT32
DC ELECTRICAL CHARACTERISTICS
T
A
= 25
5C
Symbol
V
IH
Parameter
Low−Level Input
Voltage
Low−Level Input
Voltage
High−Level Output
Voltage
V
IN
= V
IH
or V
IL
I
OH
=
−50
mA
V
IN
= V
IH
or V
IL
I
OH
=
−2
mA
I
OH
=
−4
mA
I
OH
=
−8
mA
V
OL
Low−Level Output
Voltage
V
IN
= V
IH
or V
IL
I
OL
= 50
mA
V
IN
= V
IH
or V
IL
I
OL
= 2 mA
I
OL
= 4 mA
I
OL
= 8 mA
I
IN
I
CC
I
CCT
I
OPD
Input Leakage
Current
Quiescent Supply
Current
Quiescent Supply
Current
Output Leakage
Current
0
v
V
IN
v
5.5 V
0
v
V
IN
v
V
CC
V
IN
= 3.4 V
V
OUT
= 5.5 V
Conditions
V
CC
(V)
1.8
3.0
4.5 to 5.5
1.8
3.0
4.5 to 5.5
3.0
4.5
1.8
3.0
4.5
3.0
4.5
1.8
3.0
4.5
0 to 5.5
5.5
5.5
0.0
2.9
4.4
1.40
2.58
3.94
0
0
0.1
0.1
0.36
0.36
0.36
±0.1
2.0
1.35
0.5
3.0
4.5
Min
1.2
1.4
2.0
0.3
0.53
0.8
2.9
4.4
1.38
2.48
3.80
0.1
0.1
0.44
0.44
0.44
±1.0
20
1.50
5.0
Typ
Max
T
A
=
+855C
Min
1.2
1.4
2.0
0.3
0.53
0.8
2.9
4.4
1.37
2.34
3.66
0.1
0.1
0.52
0.52
0.52
±1.0
40
1.65
10
mA
mA
mA
mA
V
Max
T
A
=
−555C
to +1255C
Min
1.2
1.4
2.0
0.3
0.53
0.8
Max
Unit
V
V
IL
V
V
OH
V
AC ELECTRICAL CHARACTERISTICS
(Input t
r
= t
f
= 3.0 ns)
Test
Condition
C
L
= 15 pF
C
L
= 50 pF
C
L
= 15 pF
C
L
= 50 pF
3.0 to 3.6
C
L
= 15 pF
C
L
= 50 pF
4.5 to 5.5
C
L
= 15 pF
C
L
= 50 pF
C
IN
C
PD
Input Capacitance
Power Dissipation
Capacitance (Note 3)
5.0
4.8
6.1
3.7
4.4
5.5
11
T
A
= 25
5C
Min
Typ
Max
15.4
23.8
10.4
14.5
7.9
11.4
5.5
7.5
10
T
A
=
+855C
Min
Max
16.9
25.2
11.2
15.5
9.5
13.0
6.5
8.5
10
T
A
=
−555C
to +1255C
Min
Max
18.7
26.7
13.2
17.9
11.5
15.5
8.0
10.0
10.0
pF
pF
Unit
ns
Symbol
t
PLH
,
t
PHL
Parameter
Propagation Delay, Input
A or B to Y
V
CC
(V)
1.65 to
1.95
2.3 to 2.7
3. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation I
CC(OPR)
= C
PD
•
V
CC
•
f
in
+ I
CC
. C
PD
is used to determine the no−load
dynamic power consumption: P
D
= C
PD
•
V
CC2
•
f
in
+ I
CC
•
V
CC.
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3
NLU1GT32
Input A or B
50%
t
PLH
Output Y
50% V
CC
50% V
CC
GND
t
PHL
V
OH
V
OL
Figure 3. Switching Waveforms
V
CC
INPUT
OUTPUT
C
L*
*Includes all probe and jig capacitance.
A 1−MHz square input wave is recommended
for propagation delay tests.
Figure 4. Test Circuit
ORDERING INFORMATION
Device
NLU1GT32MUTCG
NLU1GT32AMX1TCG
NLU1GT32BMX1TCG
NLU1GT32CMX1TCG
NLU1GT32AMUTCG
NLU1GT32CMUTCG
(In Development)
Package
UDFN6, 1.2 x 1.0, 0.4P
(Pb−Free)
ULLGA6, 1.45 x 1.0, 0.5P
(Pb−Free)
ULLGA6, 1.2 x 1.0, 0.4P
(Pb−Free)
ULLGA6, 1.0 x 1.0, 0.35P
(Pb−Free)
UDFN6, 1.45 x 1.0, 0.5P
(Pb−Free)
UDFN6, 1.0 x 1.0, 0.35P
(Pb−Free)
Shipping
†
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NLU1GT32
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA
ISSUE B
EDGE OF PACKAGE
D
A
B
L1
PIN ONE
REFERENCE
2X
E
0.10 C
2X
DETAIL A
Bottom View
(Optional)
EXPOSED Cu
MOLD CMPD
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM
A
A1
A3
b
D
E
e
L
L1
L2
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.20 BSC
1.00 BSC
0.40 BSC
0.30
0.40
0.00
0.15
0.40
0.50
0.10 C
0.10 C
(A3)
A
A1
10X
0.08 C
SIDE VIEW
A1
5X
1
3
SEATING
PLANE
C
L
L2
6X
b
0.10 C A B
0.05 C
NOTE 3
6
4
e
BOTTOM VIEW
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5
ÉÉ
ÉÉ
ÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
TOP VIEW
A3
DETAIL B
Side View
(Optional)
MOUNTING FOOTPRINT*
0.42
6X
0.22
6X
0.40
PITCH
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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