HIGH PERFORMANCE
conga-TS67
-
COM Express Type 6
-
Based on 2nd Generation Intel
®
Core
™
low-power
processors
-
Soldered CPUs for higher shock resistance
-
High end graphics performance
-
Intel
®
Turbo Boost Technology 2.0
Formfactor
CPU
COM Express
™
Basic | (95 x 125 mm) | Type 6 Connector Layout
Intel
®
Celeron
™
807UE
Intel
®
Celeron
™
827E
Intel
®
Celeron
™
847E
Intel
®
Core
™
i3-2340UE
Intel
®
Core
™
i7-2610UE
Intel
®
Core
™
i7-2655LE
1x 1.0GHz
1x 1.4GHz
2x 1.1GHz
2x 1.3GHz
2x 1.5GHz
2x 2.2GHz
1MB L3 cache
1.5MB L3 cache
2MB L2 cache
3MB L2 cache
3MB L2 cache
4MB L2 cache
1333MT/s
1333MT/s
1333MT/s
1333MT/s
1333MT/s
1333MT/s
TDP 10 W
TDP 17 W
TDP 17 W
TDP 17 W
TDP 17 W
TDP 25 W
Intel
®
Turbo Boost Technology 2.0 | Intel
®
Hyper-Threading Technology | Integrated dual channel memory controller | up to 25.6 GByte/sec.
memory bandwidth | Integrated Intel
®
HD Graphics 3000 with dynamic frequency up to 1.2GHz | Intel
®
Clear Video HD Technology
DRAM
Chipset
Ethernet
I/O Interfaces
Sound
Graphics
LVDS
Digital Display Interface
CRT Interface
congatec Board Controller
Embedded BIOS Features
Security
2 Sockets | SO-DIMM DDR3 up to 1600MT/s and 16 GByte
Mobile Intel
®
6 Series Chipset: Intel
®
QM67 / Intel
®
HM65 (Intel
®
Celeron
™
version)
Intel
®
82579 GbE LAN Controller with AMT 7.0 support
7x PCI Express
™
GEN. 2.0 lanes | 1x PEG | 2x Serial ATA
®
with 6 Gb/s | 2x Serial ATA
®
with 3 Gb/s (AHCI) RAID 0/1/5/10 support (QM67 only) | 2x
ExpressCard
®
| 8x USB 2.0 (EHCI) | LPC bus | I²C bus (fast mode / 400 kHz / multi-master)
Digital High Definition Audio Interface with support for multiple audio codecs
Intel
®
Flexible Display Interface (FDI) | OpenGL 3.0 and DirectX10.1 support | Two independent pipelines for full dual view support optional High
performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.264 (AVC) support Blu-ray support @ 40 MBit/s | hardware motion compensation
Dual channel LVDS transmitter | Supports flat panels 2x24 Bit interface | VESA mappings | resolutions up to 1920x1200 | Automatic Panel Detection via EDID/EPI
1x SDVO / DisplayPort 1.1 / TMDS (DVI / HDMI) | 2x DisplayPort 1.1 / TMDS (DVI | HDMI)
350 MHz RAMDAC | resolutions up to QXGA (2048x1536)
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data Backup
I²C bus (fast mode / 400 kHz / multi-master) | Power Loss Control
AMI Aptio
®
UEFI 2.x firmware | 8 MByte serial SPI firmware flash | High Accessible Program (HAP)
The conga-TS67 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM). It is capable of calculating efficient hash and
RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and
e-commerce will benefit also with improved authentication | integrity and confidence levels.
ACPI 4.0 with battery support
Microsoft
®
Windows 8 | Microsoft
®
Windows 7 | Linux | Microsoft
®
Windows
®
embedded Standard
Typ. application: tbd. | see manual for full details | CMOS Battery Backup
Operating: 0 .. +60°C | Storage: -20 .. +80°C
Operating: 10 - 90% r. H. non cond. | Storage: 5 - 95% r. H. non cond.
95 x 125 mm (3.74” x 4.92”)
Power Management
Operating Systems
Power Consumption
Temperature
Humidity
Size
www.congatec.com
conga-TS67
| Block diagram
A-B
Fan Control
High Definition Audio (HDA) I/F
4x SATA
Power Management and Control Signals
Gbit Ethernet
LCD I/F
(LVDS)
GPIs/GPOs
8x USB 2.0
SM Bus
VGA
I2C
7 PCIe Lanes
Hardware Monitoring
and Fan Control Circuitry
Intel®
82579LM
GB Ethernet PHY
(optional)
TPM
LPC Bus
BIOS
(Flash)
Processor
RTC
Board Controller
STMicroelectronics
STM32
1x x1 PCIe Link
Watchdog
CORE
DMI x4
CORE
CORE
SPI
8 PCIe Lanes
Mobile Intel® QM67
(Direct Media
Interface)
Express Chipset
Intel® FDI
Intel® BD82QM67 PCH
(Intel® BD82HM65 PCH for
Intel® Celeron® equipped modules)
CORE
BC SPI
(Flexible Display
Interface)
2nd Generation
Intel® Core™ i7
Intel® Core™ i5
Intel® Core™ i3
Intel® Celeron®
Memory
Controller
Graphics
CORE
SDVO / HDMI / DP
Memory Types
(1066 or 1333 or 1600MTs)
HDMI / DP
HDMI / DP
DDR3-SODIMM
Socket (top)
16 GByte Max. Total
(Celeron 807UE
DDR3-SODIMM
supports one socket (top)
Socket (bottom)
8 GByte max. total)
C-D
conga-TS67
| Order Information
Article
conga-TS67/i7-2655LE
conga-TS67/i7-2610UE
conga-TS67/i3-2340UE
conga-TS67/847E
conga-TS67/827E
conga-TS67/807UE
conga-TS67/HSP-HP-B
conga-TS67/HSP-HP-T
conga-TS67/CSP-HP-B
conga-TS67/CSP-HP-T
conga-TS67/CSA-HP-B
conga-TS67/CSA-HP-T
DDR3L-SODIMM-1600 (2GB)
DDR3L-SODIMM-1600 (4GB)
DDR3L-SODIMM-1600 (8GB)
PN
046401
046402
046403
046404
046405
046406
046450
046451
046452
046453
046454
046455
068755
068756
068757
Description
Intel
®
Core
™
i7-2655LE dual core processor with 2.2GHz | 4MB L3 cache and 1333MT/s dual channel DDR3 memory interface
Intel
®
Core
™
i7-2610UE dual core processor with 1.5GHz | 3MB L3 cache and 1333MT/s dual channel DDR3 memory interface
Intel
®
Core
™
i3-2340UE dual core processor with 1.3GHz | 3MB L3 cache and 1333MT/s dual channel DDR3 memory interface
Intel
®
Celeron
®
847E dual core processor with 1.1GHz | 2MB L3 cache and 1333MT/s dual channel DDR3 memory interface
Intel
®
Celeron
®
827E single core processor with 1.4GHz | 1.5MB L3 cache and 1333MT/s dual channel DDR3 memory interface
Intel
®
Celeron
®
807UE single core processor with 1.0GHz | 1MB L3 cache | 1333MT/s single channel DDR3 memory interface and no
PEG Port
Standard heatspreader for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes. All standoffs are
with 2.7mm bore hole
Standard heatspreader for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes. All standoffs are
M2.5mm thread
Standard passive cooling solution for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes
15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole
Standard passive cooling solution for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes
15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread
Standard active cooling solution for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes | 15mm
silver fins | 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole
Standard active cooling solution for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes | 15mm
silver fins | 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 2GB RAM
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM
Accessories
conga-TEVAL
conga-LDVI/EPI
COM-Express-carrier-
board-Socket-5
COM-Express-carrier-
board-Socket-8
065800
011115
400007
400004
Evaluation carrier board for Type 6 COM-Express-modules
LVDS to DVI converter board for digital flat panels with onboard EEPROM
Connector for COM-Express carrier boards | height 5mm | packing unit 4 pieces
Connector for COM-Express carrier boards | height 8mm | packing unit 4 pieces
© 2016 congatec AG. All rights reserved.
All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee
of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their
respective trademark holders. These trademark holders are not affiliated with congatec AG. Rev. July 12, 2015 KS
PEG x16
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