Si864x Data Sheet
Low-Power Quad-Channel Digital Isolators
KEY FEATURES
Silicon Lab's family of ultra-low-power digital isolators are CMOS devices offering sub-
stantial data rate, propagation delay, power, size, reliability, and external BOM advan-
tages over legacy isolation technologies. The operating parameters of these products
remain stable across wide temperature ranges and throughout device service life for
ease of design and highly uniform performance. All device versions have Schmitt trigger
inputs for high noise immunity and only require VDD bypass capacitors.
Data rates up to 150 Mbps are supported, and all devices achieve propagation delays of
less than 10 ns. Enable inputs provide a single point control for enabling and disabling
output drive. Ordering options include a choice of isolation ratings (1.0, 2.5, 3.75 and 5
kV) and a selectable fail-safe operating mode to control the default output state during
power loss. All products >1 kV are safety certified by UL, CSA, VDE, and CQC, and
products in wide-body packages support reinforced insulation withstanding up to 5
kV
RMS
.
Automotive Grade is available for certain part numbers. These products are built using
automotive-specific flows at all steps in the manufacturing process to ensure the robust-
ness and low defectivity required for automotive applications.
Industrial Applications
• Industrial automation systems
• Medical electronics
• Isolated switch mode supplies
• Isolated ADC, DAC
• Motor control
• Power inverters
• Communications systems
Safety Regulatory Approvals
• UL 1577 recognized
• Up to 5000 V
RMS
for 1 minute
• CSA component notice 5A approval
• IEC 60950-1, 62368-1, 60601-1 (re-
inforced insulation)
• VDE certification conformity
• Si864xxT options certified to rein-
forced VDE 0884-10
• All other options certified to basic
VDE 0884-10 and reinforced 60950-1
• CQC certification approval
• GB4943.1
Automotive Applications
• On-board chargers
• Battery management systems
• Charging stations
• Traction inverters
• Hybrid Electric Vehicles
• Battery Electric Vehicles
• High-speed operation
• DC to 150 Mbps
• No start-up initialization required
• Wide Operating Supply Voltage
• 2.5–5.5 V
• Up to 5000 V
RMS
isolation
• Reinforced VDE 0884-10, 10 kV surge-
capable (Si864xxT)
• 60-year life at rated working voltage
• High electromagnetic immunity
• Ultra low power (typical)
5 V Operation
• 1.6 mA per channel at 1 Mbps
• 5.5 mA per channel at 100 Mbps
2.5 V Operation
• 1.5 mA per channel at 1 Mbps
• 3.5 mA per channel at 100 Mbps
• Tri-state outputs with ENABLE
• Schmitt trigger inputs
• Selectable fail-safe mode
• Default high or low output (ordering
option)
• Precise timing (typical)
• 10 ns propagation delay
• 1.5 ns pulse width distortion
• 0.5 ns channel-channel skew
• 2 ns propagation delay skew
• 5 ns minimum pulse width
• Transient Immunity 50 kV/µs
• AEC-Q100 qualification
• Wide temperature range
• –40 to 125 °C
• RoHS-compliant packages
• SOIC-16 wide body
• SOIC-16 narrow body
• QSOP-16
• Automotive-grade OPNs available
• AIAG compliant PPAP documentation
support
• IMDS and CAMDS listing support
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Rev. 2.12
Si864x Data Sheet
Ordering Guide
1. Ordering Guide
Table 1.1. Ordering Guide for Valid OPNs
1, 2
Number of Number of
Inputs
Inputs
VDD1
Side
VDD2
Side
Ordering Part Number (OPN)
Max Data
Rate
(Mbps)
Default
Output
State
Isolation
Rating
(kV)
Temp (°C)
Package
QSOP-16 Packages
Si8640BA-B-IU
Si8640BB-B-IU
Si8640EB-B-IU
Si8641BA-B-IU
Si8641BA-C-IU
Si8641BB-B-IU
Si8641EB-B-IU
Si8642BA-B-IU
Si8642BA-C-IU
Si8642BB-B-IU
Si8642EA-B-IU
Si8642EB-B-IU
Si8645BA-B-IU
Si8645BA-C-IU
Si8645BB-B-IU
SOIC-16 Packages
Si8640BB-B-IS1
Si8640BB-B-IS
Si8640BC-B-IS1
Si8640BD-B-IS2
Si8640BD-B-IS
Si8640EC-B-IS1
Si8640ED-B-IS2
Si8640ED-B-IS
Si8641BB-B-IS1
Si8641BB-B-IS
Si8641BC-B-IS1
Si8641BD-B-IS2
4
4
4
4
4
4
4
4
3
3
3
3
0
0
0
0
0
0
0
0
1
1
1
1
150
150
150
150
150
150
150
150
150
150
150
150
Low
Low
Low
Low
Low
High
High
High
Low
Low
Low
Low
2.5
2.5
3.75
5.0
5.0
3.75
5.0
5.0
2.5
2.5
3.75
5.0
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 ˚C
–40 to 125 °C
–40 to 125 °C
–40 to 125 ˚C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
NB SOIC-16
WB SOIC-16
NB SOIC-16
WB SOIC-16
(8 mm creepage)
4
WB SOIC-16
NB SOIC-16
WB SOIC-16
(8 mm creepage)
4
WB SOIC-16
NB SOIC-16
WB SOIC-16
NB SOIC-16
WB SOIC-16
(8 mm creepage)
4
4
4
4
3
3
3
3
2
2
2
2
2
4
4
4
0
0
0
1
1
1
1
2
2
2
2
2
0
0
0
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
Low
Low
High
Low
Low
Low
High
Low
Low
Low
High
High
Low
Low
Low
1.0
2.5
2.5
1.0
1.0
2.5
2.5
1.0
1.0
2.5
1.0
2.5
1.0
1.0
2.5
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
QSOP-16
QSOP-16
QSOP-16
QSOP-16
QSOP-16
QSOP-16
QSOP-16
QSOP-16
QSOP-16
QSOP-16
QSOP-16
QSOP-16
QSOP-16
QSOP-16
QSOP-16
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Rev. 2.12 | 2
Si864x Data Sheet
Ordering Guide
Number of Number of
Inputs
Inputs
VDD1
Side
3
3
3
3
2
2
2
2
2
2
2
2
4
4
4
4
VDD2
Side
1
1
1
1
2
2
2
2
2
2
2
2
0
0
0
0
Ordering Part Number (OPN)
Max Data
Rate
(Mbps)
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
Default
Output
State
Low
High
High
High
Low
Low
Low
Low
Low
High
High
High
Low
Low
Low
Low
Isolation
Rating
(kV)
5.0
3.75
5.0
5.0
2.5
2.5
3.75
5.0
5.0
3.75
5.0
5.0
2.5
2.5
3.75
5.0
Temp (°C)
Package
Si8641BD-B-IS
Si8641EC-B-IS1
Si8641ED-B-IS2
Si8641ED-B-IS
Si8642BB-B-IS1
Si8642BB-B-IS
Si8642BC-B-IS1
Si8642BD-B-IS2
Si8642BD-B-IS
Si8642EC-B-IS1
Si8642ED-B-IS2
Si8642ED-B-IS
Si8645BB-B-IS1
Si8645BB-B-IS
Si8645BC-B-IS1
Si8645BD-B-IS
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
WB SOIC-16
NB SOIC-16
WB SOIC-16
(8 mm creepage)
4
WB SOIC-16
NB SOIC-16
WB SOIC-16
NB SOIC-16
WB SOIC-16
(8 mm creepage)
4
WB SOIC-16
NB SOIC-16
WB SOIC-16
(8 mm creepage)
4
WB SOIC-16
NB SOIC-16
WB SOIC-16
NB SOIC-16
WB SOIC-16
Product Options with Reinforced VDE 0884-10 Rating with 10 kV Surge Capability
Si8640BT-IS
Si8640ET-IS
Si8641BT-IS
Si8641ET-IS
Si8642BT-IS
Si8642ET-IS
Si8645BT-IS
Si8645ET-IS
4
4
3
3
2
2
4
4
0
0
1
1
2
2
0
0
150
150
150
150
150
150
150
150
Low
High
Low
High
Low
High
Low
Low
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
WB SOIC-16
WB SOIC-16
WB SOIC-16
WB SOIC-16
WB SOIC-16
WB SOIC-16
WB SOIC-16
WB SOIC-16
Note:
1. All packages are RoHS-compliant with peak reflow temperatures of 260 °C according to the JEDEC industry standard classifica-
tions and peak solder temperatures.
2. “Si” and “SI” are used interchangeably.
3. An "R" at the end of the part number denotes tape and reel packaging option.
4. The package designated IS2 has a design that eliminates tie bars, thus allowing for extra creepage distance while maintaining
standard WB SOIC-16 package dimensions and land pattern.
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Si864x Data Sheet
Ordering Guide
Automotive Grade OPNs
Automotive-grade devices are built using automotive-specific flows at all steps in the manufacturing process to ensure robustness and
low defectivity. These devices are supported with AIAG-compliant Production Part Approval Process (PPAP) documentation, and fea-
ture International Material Data System (IMDS) and China Automotive Material Data System (CAMDS) listing. Qualifications are compli-
ant with AEC-Q100, and a zero-defect methodology is maintained throughout definition, design, evaluation, qualification, and mass pro-
duction steps.
Table 1.2. Ordering Guide for Automotive Grade OPNs
1, 2, 4, 5
Ordering Part Number Number of Number of
Inputs
(OPN)
Inputs
VDD1
Side
QSOP-16 Packages
Si8642EA-AU
2
2
150
High
1.0
–40 to 125 °C
QSOP-16
VDD2
Side
Max Data
Rate
(Mbps)
Default
Output
State
Isolation
Rating
(kV)
Temp (°C)
Package
SOIC-16 Packages
Si8640BD-AS
Si8640ED-AS
Si8641BB-AS1
SI8641BD-AS
Si8641ED-AS
Si8642BB-AS1
Si8642BD-AS
Si8642EC-AS1
4
4
3
3
3
2
2
2
0
0
1
1
1
2
2
2
150
150
150
150
150
150
150
150
Low
High
Low
Low
High
Low
Low
High
5.0
5.0
2.5
5.0
5.0
2.5
5.0
3.75
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
WB
WB
NB
WB
WB
NB
WB
NB
SOIC-16
SOIC-16
SOIC-16
SOIC-16
SOIC-16
SOIC-16
SOIC-16
SOIC-16
Product Options with Reinforced VDE 0884-10 Rating with 10 kV Surge Capability
Si8642ET-AS
2
2
150
High
5.0
–40 to 125 °C
WB
SOIC-16
Note:
1. All packages are RoHS-compliant with peak reflow temperatures of 260 °C according to the JEDEC industry standard classifica-
tions.
2. “Si” and “SI” are used interchangeably.
3. An "R" at the end of the part number denotes tape and reel packaging option.
4. Automotive-Grade devices (with an "–A" suffix) are identical in construction materials, topside marking, and electrical parameters
to their Industrial-Grade (with a "–I" suffix) version counterparts. Automotive-Grade products are produced utilizing full automotive
process flows and additional statistical process controls throughout the manufacturing flow. The Automotive-Grade part number is
included on shipping labels.
5. Additional Ordering Part Numbers may be available in Automotive-Grade. Please contact your local Silicon Labs sales represen-
tative for further information.
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Table of Contents
1. Ordering Guide
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2. Functional Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Theory of Operation .
2.2 Eye Diagram .
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3. Device Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1 Device Startup
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.10
.10
.10
.10
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.10
.11
3.2 Undervoltage Lockout .
3.3 Layout Recommendations. .
3.3.1 Supply Bypass . . .
3.3.2 Output Pin Termination.
3.4 Fail-Safe Operating Mode .
.
3.5 Typical Performance Characteristics .
4. Electrical Specifications
5. Pin Descriptions
. . . . . . . . . . . . . . . . . . . . . . . . . . 12
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
. . . . . . . . . . . . . . . . . . . 29
31
6. Package Outline (16-Pin Wide Body SOIC)
7. Land Pattern (16-Pin Wide Body SOIC) . . . . . . . . . . . . . . . . . . . . .
8. Package Outline (16-Pin Narrow Body SOIC)
. . . . . . . . . . . . . . . . . . 32
9. Land Pattern (16-Pin Narrow Body SOIC) . . . . . . . . . . . . . . . . . . . . 34
10. Package Outline (16-Pin QSOP) . . . . . . . . . . . . . . . . . . . . . . . 35
11. Land Pattern (16-Pin QSOP)
. . . . . . . . . . . . . . . . . . . . . . . . 37
. . . . . . . . . . . . . . . . . . . . 38
. . . . . . . . . . . . . . . . . . .39
12. Top Marking (16-Pin Wide Body SOIC)
13. Top Marking (16-Pin Narrow Body SOIC)
14. Top Marking (16-Pin QSOP)
. . . . . . . . . . . . . . . . . . . . . . . . 40
41
15. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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