PCI Interface IC PCI EXPRESS SWITCH
| 参数名称 | 属性值 |
| Brand Name | Integrated Device Technology |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | FCBGA |
| 包装说明 | FCBGA-324 |
| 针数 | 324 |
| 制造商包装代码 | ALG324 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Samacsys Description | FLIP CHIP BGA 19.0 X 19.0 MM X 1.0 MM |
| 地址总线宽度 | |
| 总线兼容性 | PCI; SMBUS |
| 最大时钟频率 | 100 MHz |
| 外部数据总线宽度 | |
| JESD-30 代码 | S-PBGA-B324 |
| JESD-609代码 | e1 |
| 长度 | 19 mm |
| 湿度敏感等级 | 4 |
| 端子数量 | 324 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装等效代码 | BGA324,18X18,40 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1,3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.42 mm |
| 最大供电电压 | 1.1 V |
| 最小供电电压 | 0.9 V |
| 标称供电电压 | 1 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 1 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 19 mm |
| uPs/uCs/外围集成电路类型 | BUS CONTROLLER, PCI |
| Base Number Matches | 1 |
| 89HPES6T6G2ZCALGI8 | 89HPES6T6G2ZCALG | 89HPES6T6G2ZCAL | 89HPES6T6G2ZCAL8 | 89HPES6T6G2ZCALGI | |
|---|---|---|---|---|---|
| 描述 | PCI Interface IC PCI EXPRESS SWITCH | PCI Interface IC PCI EXPRESS SWITCH | PCI Interface IC PCI EXPRESS SWITCH | PCI Interface IC PCI EXPRESS SWITCH | PCI Interface IC PCI EXPRESS SWITCH |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| 是否无铅 | 不含铅 | 不含铅 | 含铅 | 含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 不符合 | 不符合 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | FCBGA | FCBGA | FCBGA | FCBGA | FCBGA |
| 包装说明 | FCBGA-324 | FCBGA-324 | FCBGA-324 | FCBGA-324 | FCBGA-324 |
| 针数 | 324 | 324 | 324 | 324 | 324 |
| 制造商包装代码 | ALG324 | ALG324 | AL324 | AL324 | ALG324 |
| Reach Compliance Code | compliant | compliant | not_compliant | not_compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 总线兼容性 | PCI; SMBUS | PCI | PCI | PCI; SMBUS | PCI |
| 最大时钟频率 | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| JESD-30 代码 | S-PBGA-B324 | S-PBGA-B324 | S-PBGA-B324 | S-PBGA-B324 | S-PBGA-B324 |
| JESD-609代码 | e1 | e1 | e0 | e0 | e1 |
| 长度 | 19 mm | 19 mm | 19 mm | 19 mm | 19 mm |
| 湿度敏感等级 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 324 | 324 | 324 | 324 | 324 |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | BGA | BGA | BGA |
| 封装等效代码 | BGA324,18X18,40 | BGA324,18X18,40 | BGA324,18X18,40 | BGA324,18X18,40 | BGA324,18X18,40 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 峰值回流温度（摄氏度） | 260 | 260 | 225 | 225 | 260 |
| 电源 | 1,3.3 V | 1,3.3 V | 1,3.3 V | 1,3.3 V | 1,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.42 mm | 3.42 mm | 3.42 mm | 3.42 mm | 3.42 mm |
| 最大供电电压 | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| 最小供电电压 | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| 标称供电电压 | 1 V | 1 V | 1 V | 1 V | 1 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | 30 |
| 宽度 | 19 mm | 19 mm | 19 mm | 19 mm | 19 mm |
| uPs/uCs/外围集成电路类型 | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| Samacsys Description | FLIP CHIP BGA 19.0 X 19.0 MM X 1.0 MM | FLIP CHIP BGA 19.0 X 19.0 MM X 1.0 MM | - | - | FLIP CHIP BGA 19.0 X 19.0 MM X 1.0 MM |
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