Translation - Voltage Levels 3.3V Diff LVPECL to LVTTL
| 参数名称 | 属性值 |
| Brand Name | ON Semiconductor |
| 是否无铅 | 不含铅 |
| 厂商名称 | ON Semiconductor(安森美) |
| 零件包装代码 | SOIC |
| 包装说明 | TSSOP, TSSOP8,.19 |
| 针数 | 8 |
| 制造商包装代码 | 948R-02 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| Samacsys Confidence | 3 |
| Samacsys Status | Released |
| Samacsys PartID | 225083 |
| Samacsys Pin Count | 8 |
| Samacsys Part Category | Integrated Circuit |
| Samacsys Package Category | Small Outline Packages |
| Samacsys Footprint Name | TSSOP-8 CASE948R-02 ISSUE A |
| Samacsys Released Date | 2015-08-06 09:56:25 |
| Is Samacsys | N |
| 最大延迟 | 2.25 ns |
| 接口集成电路类型 | PECL TO TTL TRANSLATOR |
| JESD-30 代码 | S-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 湿度敏感等级 | 3 |
| 位数 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出锁存器或寄存器 | NONE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP8,.19 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | ECL |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 3 mm |
| Base Number Matches | 1 |
| MC100EPT21DTG | 120856OHMS0.25% | MC100EPT21DG | |
|---|---|---|---|
| 描述 | Translation - Voltage Levels 3.3V Diff LVPECL to LVTTL | Fixed Resistor, Wire Wound, 0.4W, 856ohm, 300V, 0.25% +/-Tol, -10,10ppm/Cel, | Translation - Voltage Levels 3.3V Diff LVPECL to LVTTL |
| Reach Compliance Code | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 |
| 端子数量 | 8 | 2 | 8 |
| 最低工作温度 | -40 °C | -55 °C | -40 °C |
| 封装形状 | SQUARE | TUBULAR PACKAGE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Axial | SMALL OUTLINE |
| 技术 | ECL | WIRE WOUND | ECL |
| Brand Name | ON Semiconductor | - | ON Semiconductor |
| 是否无铅 | 不含铅 | - | 不含铅 |
| 厂商名称 | ON Semiconductor(安森美) | - | ON Semiconductor(安森美) |
| 零件包装代码 | SOIC | - | SOIC |
| 包装说明 | TSSOP, TSSOP8,.19 | - | SOP, SOP8,.25 |
| 针数 | 8 | - | 8 |
| 制造商包装代码 | 948R-02 | - | 751-07 |
| Factory Lead Time | 1 week | - | 1 week |
| Samacsys Confidence | 3 | - | 3 |
| Samacsys Status | Released | - | Released |
| Samacsys PartID | 225083 | - | 225082 |
| Samacsys Pin Count | 8 | - | 8 |
| Samacsys Part Category | Integrated Circuit | - | Integrated Circuit |
| Samacsys Package Category | Small Outline Packages | - | Small Outline Packages |
| Samacsys Footprint Name | TSSOP-8 CASE948R-02 ISSUE A | - | SOIC-8 NB CAST 751-07 |
| Samacsys Released Date | 2015-08-06 09:56:25 | - | 2015-08-06 09:55:34 |
| Is Samacsys | N | - | N |
| 最大延迟 | 2.25 ns | - | 2.25 ns |
| 接口集成电路类型 | PECL TO TTL TRANSLATOR | - | PECL TO TTL TRANSLATOR |
| JESD-30 代码 | S-PDSO-G8 | - | R-PDSO-G8 |
| JESD-609代码 | e3 | - | e3 |
| 长度 | 3 mm | - | 4.9 mm |
| 湿度敏感等级 | 3 | - | 1 |
| 位数 | 1 | - | 1 |
| 功能数量 | 1 | - | 1 |
| 最高工作温度 | 85 °C | - | 85 °C |
| 输出锁存器或寄存器 | NONE | - | NONE |
| 输出极性 | TRUE | - | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | TSSOP | - | SOP |
| 封装等效代码 | TSSOP8,.19 | - | SOP8,.25 |
| 峰值回流温度（摄氏度） | 260 | - | 260 |
| 电源 | 3.3 V | - | 3.3 V |
| 认证状态 | Not Qualified | - | Not Qualified |
| 座面最大高度 | 1.1 mm | - | 1.75 mm |
| 最大供电电压 | 3.6 V | - | 3.6 V |
| 最小供电电压 | 3 V | - | 3 V |
| 标称供电电压 | 3.3 V | - | 3.3 V |
| 表面贴装 | YES | - | YES |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL |
| 端子面层 | Tin (Sn) | - | Tin (Sn) |
| 端子形式 | GULL WING | - | GULL WING |
| 端子节距 | 0.65 mm | - | 1.27 mm |
| 端子位置 | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | - | 40 |
| 宽度 | 3 mm | - | 3.9 mm |
| Base Number Matches | 1 | - | 1 |
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